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公开(公告)号：EP2319960A1
公开(公告)日：2011-05-11
申请号：EP09800406.2
申请日：2009-07-22
IPC分类号： C25D7/06 , B32B15/08 , B32B15/088 , H05K1/03 , H05K1/09
CPC分类号： H05K3/384 , B32B15/08 , B32B15/20 , C25D1/04 , C25D3/562 , C25D3/565 , C25D5/48 , C25D7/0614 , H05K1/0346 , H05K1/0393 , H05K3/389 , H05K2201/0154 , H05K2201/0355 , H05K2203/0723 , Y10T428/12431 , Y10T428/12438 , Y10T428/12472 , Y10T428/12549 , Y10T428/12569 , Y10T428/12903 , Y10T428/1291 , Y10T428/12944 , Y10T428/31663 , Y10T428/31681
摘要： In order to provide a flexible laminate circuit board using a surface treated copper foil satisfying all of a bonding strength of a copper foil with respect to polyimide, acid resistance, and etching property, in a flexible laminate circuit board formed by a copper foil on the surface of a polyimide resin layer, the copper foil is a surface treated copper foil formed by depositing an Ni-Zn alloy onto at least one surface of a untreated copper foil, and the Zn deposition amount in the deposited Ni-Zn alloy is 6% or more and 15% or less of the (Ni deposition amount + Zn deposition amount), and the Zn deposition amount is 0.08 mg/dm 2 or more to provide a flexible cupper clad laminate.
摘要翻译： 为了提供一种使用表面处理铜箔的柔性层叠电路板，其在铜箔上形成的柔性层叠电路板中，该表面处理铜箔在聚酰亚胺，耐酸性和蚀刻性方面满足铜箔的全部接合强度 铜箔是通过在未处理的铜箔的至少一个表面上沉积Ni-Zn合金形成的表面处理铜箔，并且沉积的Ni-Zn合金中的Zn沉积量为6％ （Ni沉积量+ Zn沉积量）以上且15％以下，Zn沉积量为0.08mg / dm 2以上，提供柔性的铜包覆层压体。
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2.发明公开SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD 审中-公开表面处理铜箔，方法用于生产和覆铜箔层压板
公开(公告)号：EP2527498A1
公开(公告)日：2012-11-28
申请号：EP11734780.7
申请日：2011-01-21
发明人： FUJISAWA, Satoshi , UNO, Takeo , HATTORI, Koichi
CPC分类号： C25D5/34 , B32B15/01 , B32B15/08 , B32B2457/00 , C22C19/002 , C22C19/03 , C25D3/562 , C25D5/48 , H05K3/384 , H05K2201/0154 , Y10T156/10 , Y10T428/12438 , Y10T428/12451 , Y10T428/12472 , Y10T428/12535 , Y10T428/12556 , Y10T428/12792 , Y10T428/12882 , Y10T428/1291
摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 µm or below. On the roughened surface, an Ni-Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 µm, a height of 0.6-1.8 µm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 µm. The aforesaid Ni-Zn alloy layer has a Zn content of 6-30 wt% and a Zn deposition amount of 0.08 mg/dm 2 or more.
摘要翻译： 本发明提供一种用于SATIS外资企业粘合性要求，在绝缘性树脂的工业上优异的表面处理铜箔：如聚酰亚胺，耐热粘合性，耐化学性和软蚀刻性。 如此提供的是一种用于制造其实现绝缘性树脂和铜箔之间的密合强度高的表面处理铜箔，示出了在电路形成高耐化学性，并通过激光加工形成通孔后维持goodsoft蚀刻性。 甲碱铜箔进行粗化处理，得到的1.1微米或以下的表面粗糙度（R z）表示。 在粗糙化的表面，Ni-Zn合金层的形成。 上述粗糙化处理是在寻求的方式进行没有粗糙表面包括尖锐的凸部，其具有0.3-0.8微米的宽度，0.6-1.8微米，1.2-3.5的纵横比的高度，并且，表面粗糙度 所述基座铜箔（裕度）是通过0.05-0.3微米增加。 上述Ni-Zn合金层具有6-30重量％的Zn含量和0:08毫克/分米2以上的Zn附着量。
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3.发明公开SURFACE-TREATED COPPER FOIL AND COPPER-CLAD LAMINATE 审中-公开AT AT AT AT AT AT AT AT AT AT AT AT AT AT AT AT AT
公开(公告)号：EP2312022A1
公开(公告)日：2011-04-20
申请号：EP09800407.0
申请日：2009-07-22
发明人： FUJISAWA, Satoshi , SUZUKI, Yuji , UNO, Takeo
IPC分类号： C25D7/06 , B32B15/01 , B32B15/088 , H05K1/09
CPC分类号： H05K3/384 , B32B15/01 , B32B15/08 , B32B15/20 , B32B27/281 , B32B2255/06 , B32B2255/205 , B32B2307/20 , B32B2307/306 , B32B2307/50 , B32B2307/538 , B32B2307/714 , B32B2457/08 , C22C19/03 , C25D3/562 , C25D7/0614 , H05K1/0346 , H05K2201/0154 , H05K2201/0355 , H05K2203/0723 , Y10T428/12438 , Y10T428/12472 , Y10T428/12569 , Y10T428/12882 , Y10T428/1291 , Y10T428/12944 , Y10T428/12993
摘要： To provide a surface treated copper foil satisfying all of the bonding strength to polyimide film, chemical resistance, and etching property, and to provide a CCL using the surface treated copper foil, a surface treated copper foil is formed being comprising an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, wherein Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount) x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more, or, a CCL is formed being comprising a surface treated copper foil and a polyimide film laminated on the surface treated copper foil, wherein the surface treated copper foil comprises an untreated copper foil on at least one surface of which Ni-Zn alloy is deposited, Zn content (wt%) = Zn deposition amount/(Ni deposition amount + Zn deposition amount) x 100 is 6% or more and 15% or less, and Zn deposition amount is 0.08 mg/dm 2 or more.
摘要翻译： 为了提供满足与聚酰亚胺膜的全部接合强度的表面处理铜箔，耐化学性和蚀刻性能，并且使用表面处理铜箔提供CCL，形成表面处理铜箔，其包含未处理的铜箔 其中沉积Ni-Zn合金的至少一个表面，其中Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积 量为0.08mg / dm 2以上，或者由表面处理铜箔和层叠在表面处理铜箔上的聚酰亚胺膜形成CCL，其中表面处理铜箔包含至少一个未处理的铜箔 表面沉积有Ni-Zn合金，Zn含量（wt％）= Zn沉积量/（Ni沉积量+ Zn沉积量）×100为6％以上且15％以下，Zn沉积量为0.08mg / dm 2以上。
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4.发明公开SURFACE-ROUGHENED COPPER FOIL AND COPPER-CLAD LAMINATED SUBSTRATE 审中-公开KUPFERFOLIE MIT ANGERAUTEROBERFLÄCHEUND KUPFERKASCHIERTES LAMINIERTES SUBSTRAT
公开(公告)号：EP2584877A1
公开(公告)日：2013-04-24
申请号：EP11795730.8
申请日：2011-06-14
发明人： FUJISAWA, Satoshi
CPC分类号： B32B15/08 , B32B3/263 , B32B15/01 , H05K3/022 , H05K3/323 , H05K3/383 , H05K3/384 , H05K3/389 , H05K2203/0307 , Y10T428/12431 , Y10T428/12472 , Y10T428/31663 , Y10T428/31681
摘要： Disclosed is a surface-roughened copper foil that can show excellent adhesion to an anisotropic conductive resin (ACF) and a copper-clad laminate using same. Specifically disclosed is a surface-roughened copper foil which is surface-roughened by surface roughening on at least one surface of a base copper foil (untreated copper foil), wherein the roughening treated surface is finished so that a surface roughness (Ra) of 0.28 µm or more of the adhesion surface of a polyimide film to be adhered to the roughening treated surface.
摘要翻译： 公开了一种表面粗糙化的铜箔，其可以显示出对各向异性导电树脂（ACF）的优异粘附性和使用它的覆铜层压板。 具体公开了通过在基底铜箔（未处理铜箔）的至少一个表面进行表面粗糙化而表面粗糙化的表面粗糙化的铜箔，其中粗糙化处理表面被精加工，使得表面粗糙度（Ra）为0.28 μm以上的要粘附到粗糙处理表面的聚酰亚胺膜的粘合表面。
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5.发明公开ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD 审中-公开HAVING DIAMOND铜箔生产和覆铜层压板的方法和组装的印刷电路板
公开(公告)号：EP2527499A1
公开(公告)日：2012-11-28
申请号：EP11734781.5
申请日：2011-01-21
发明人： UNO, Takeo , FUJISAWA, Satoshi
CPC分类号： C22C19/03 , B32B15/01 , C22C19/002 , H05K1/09 , H05K3/384 , H05K3/389 , H05K2201/0355 , Y10T428/12993 , Y10T428/31678
摘要： Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 µm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 µm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 µm, a height of 0.4-1.8 µm and an aspect ratio [height/width] of 1.2-3.5.
摘要翻译： 本发明提供一种具有形成在高频率范围内的精细图案形成电路和良好的传输特性和显示出高的粘合性树脂基体和耐化学性良好的优异性能的粗糙的铜箔。 的表面粗糙的铜箔，在所有这是由粗糙化碱铜箔（未处理铜箔）的至少一个面上，以增加表面粗糙度（Rz）体，相对于所述表面的粗糙度（R z）的所述基铜的获得 箔，由0.05〜0.3微米，并且具有以1.1微米或更小的粗糙化后的表面粗糙度（R Z）的粗糙表面，worin所述粗糙化表面包括尖锐的凸状粗化晶粒其具有0.3-0.8微米的宽度 的0.4-1.8微米的高度和的1.2-3.5 [高度/宽度]的纵横比。
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