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    SILVER-CLAD COMPOSITE MATERIAL FOR MOVABLE CONTACTS AND PROCESS FOR PRODUCTION THEREOF
    2.
    发明公开
    SILVER-CLAD COMPOSITE MATERIAL FOR MOVABLE CONTACTS AND PROCESS FOR PRODUCTION THEREOF 审中-公开
    SILBERMANTELVERBUNDMATERIALFÜRBEWEGLICHE KONTAKTE UND HERSTELLUNGSPROZESSDAFÜR

    公开(公告)号：EP2200056A1

    公开(公告)日：2010-06-23

    申请号：EP08833392.7

    申请日：2008-09-25

    申请人： The Furukawa Electric Co., Ltd.

    发明人： TOKUHARA, Naofumi ,  OHNO, Masato ,  UNO, Takeo

    IPC分类号： H01H1/04 ,  C25D5/10 ,  C25D5/12 ,  C25D5/26 ,  C25D7/00 ,  H01H11/04

    CPC分类号： H01H1/021 ,  C25D5/10 ,  C25D5/12 ,  C25D5/34 ,  C25D7/0614 ,  H01H1/023 ,  H01H2227/022 ,  Y10T428/12646 ,  Y10T428/12882 ,  Y10T428/12896

    摘要： A silver-coated composite material for movable contact 100 includes a base material 110 composed of an alloy whose main component is iron or nickel, an under layer 120 which is formed at least on part of the surface of the base material and which is composed of any one of nickel, cobalt, nickel alloy and cobalt alloy, an intermediate layer 130 which is formed on the under layer and which is composed of copper or copper alloy and an outermost layer 140 which is formed on the intermediate layer and which is composed of silver or silver alloy, and is characterized in that a total thickness of the under layer 120 and the intermediate layer 130 falls within a range more than 0.025 µm and less than 0.20 µm.

    摘要翻译： 用于可移动触点100的银涂复合材料包括由主要成分为铁或镍的合金构成的基底材料110，形成在基材表面的至少一部分上的底层120， 镍，钴，镍合金和钴合金中的任一种，形成在下层上并由铜或铜合金构成的中间层130和形成在中间层上的最外层140，其由 银或银合金，其特征在于，底层120和中间层130的总厚度在大于0.025μm且小于0.20μm的范围内。

    ULTRATHIN COPPER FOIL WITH CARRIER, AND COPPER LAMINATED BOARD OR PRINTED WIRING BOARD
    3.
    发明公开
    ULTRATHIN COPPER FOIL WITH CARRIER, AND COPPER LAMINATED BOARD OR PRINTED WIRING BOARD 审中-公开
    HAUCHDÜNNEKUPFERFOLIE MITTRÄGERUND KUPFERKASCHIERTE PLATTE ODER LEITERPLATTE

    公开(公告)号：EP2336395A1

    公开(公告)日：2011-06-22

    申请号：EP09811577.7

    申请日：2009-09-04

    申请人： Furukawa Electric Co., Ltd.

    发明人： UNO, Takeo ,  KAWAKAMI, Akira ,  SUZUKI, Yuji

    IPC分类号： C25D7/06 ,  B32B15/01 ,  B32B15/08 ,  C25D1/20 ,  H05K3/00

    CPC分类号： C25D1/20 ,  B32B15/01 ,  B32B15/08 ,  B32B15/20 ,  C22C9/00 ,  C25D1/04 ,  C25D3/38 ,  C25D5/12 ,  C25D5/48 ,  H05K3/025 ,  H05K2203/0315 ,  Y10T428/2495 ,  Y10T428/31678

    摘要： The invention has as its object to provide an ultra-thin copper foil with a carrier which suppresses occurrence of blistering and is stable in peeling strength, in particular provides an ultra-thin copper foil with a carrier enabling easy peeling of a carrier foil from an ultra-thin copper foil even under a high temperature environment. As means for that, there is provided an ultra-thin copper foil with a carrier comprised of a carrier foil, a release layer, and a copper foil, wherein the release layer is formed by a first release layer disposed on the carrier foil side and a second release layer disposed on the ultra-thin copper foil side, there is a first interface between the carrier foil and the first release layer, a second interface between the ultra-thin copper foil and the second release layer, and a third interface between the first release layer and the second release layer, and the peeling strengths at the interfaces are first interface > third interface, and second interface > third interface.

    摘要翻译： 本发明的目的是提供一种具有抑制起泡发生并且剥离强度稳定的载体的超薄铜箔，特别是提供具有能够容易地从载体箔剥离的载体的超薄铜箔 超薄铜箔甚至在高温环境下。 作为其手段，提供了具有由载体箔，剥离层和铜箔构成的载体的超薄铜箔，其中剥离层由设置在载体箔侧的第一剥离层形成， 设置在超薄铜箔侧的第二剥离层，在载体箔和第一剥离层之间存在第一界面，在超薄铜箔和第二剥离层之间的第二界面，以及第三界面 第一释放层和第二释放层，并且界面处的剥离强度是第一界面>第三界面，第二界面>第三界面。

    ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD
    7.
    发明公开
    ROUGHENED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD 审中-公开
    HAVING DIAMOND铜箔生产和覆铜层压板的方法和组装的印刷电路板

    公开(公告)号：EP2527499A1

    公开(公告)日：2012-11-28

    申请号：EP11734781.5

    申请日：2011-01-21

    申请人： Furukawa Electric Co., Ltd.

    发明人： UNO, Takeo ,  FUJISAWA, Satoshi

    IPC分类号： C25D7/06 ,  B32B15/01 ,  B32B15/08 ,  C25D5/10 ,  H05K1/09

    CPC分类号： C22C19/03 ,  B32B15/01 ,  C22C19/002 ,  H05K1/09 ,  H05K3/384 ,  H05K3/389 ,  H05K2201/0355 ,  Y10T428/12993 ,  Y10T428/31678

    摘要： Provided is a roughened copper foil which has excellent properties in forming a fine patterned-circuit and good transmission properties in a high-frequency range and show high adhesiveness to a resin base and good chemical resistance. A surface-roughened copper foil, which is obtained by roughening at least one face of a base copper foil (untreated copper foil) so as to increase the surface roughness (Rz) thereof, relative to the surface roughness (Rz) of said base copper foil, by 0.05-0.3 µm and has a roughened surface with a surface roughness (Rz) after roughening of 1.1 µm or less, wherein said roughened surface comprises roughed grains in a sharp-pointed convex shape which have a width of 0.3-0.8 µm, a height of 0.4-1.8 µm and an aspect ratio [height/width] of 1.2-3.5.

    摘要翻译： 本发明提供一种具有形成在高频率范围内的精细图案形成电路和良好的传输特性和显示出高的粘合性树脂基体和耐化学性良好的优异性能的粗糙的铜箔。 的表面粗糙的铜箔，在所有这是由粗糙化碱铜箔（未处理铜箔）的至少一个面上，以增加表面粗糙度（Rz）体，相对于所述表面的粗糙度（R z）的所述基铜的获得 箔，由0.05〜0.3微米，并且具有以1.1微米或更小的粗糙化后的表面粗糙度（R Z）的粗糙表面，worin所述粗糙化表面包括尖锐的凸状粗化晶粒其具有0.3-0.8微米的宽度 的0.4-1.8微米的高度和的1.2-3.5 [高度/宽度]的纵横比。

    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD
    8.
    发明公开
    SURFACE-TREATED COPPER FOIL, METHOD FOR PRODUCING SAME, AND COPPER CLAD LAMINATED BOARD 审中-公开
    表面处理铜箔，方法用于生产和覆铜箔层压板

    公开(公告)号：EP2527498A1

    公开(公告)日：2012-11-28

    申请号：EP11734780.7

    申请日：2011-01-21

    申请人： Furukawa Electric Co., Ltd. ,  Nippon Steel Chemical Co., Ltd.

    发明人： FUJISAWA, Satoshi ,  UNO, Takeo ,  HATTORI, Koichi

    IPC分类号： C25D7/06 ,  B32B15/01 ,  B32B15/08 ,  C25D5/10 ,  H05K1/09

    CPC分类号： C25D5/34 ,  B32B15/01 ,  B32B15/08 ,  B32B2457/00 ,  C22C19/002 ,  C22C19/03 ,  C25D3/562 ,  C25D5/48 ,  H05K3/384 ,  H05K2201/0154 ,  Y10T156/10 ,  Y10T428/12438 ,  Y10T428/12451 ,  Y10T428/12472 ,  Y10T428/12535 ,  Y10T428/12556 ,  Y10T428/12792 ,  Y10T428/12882 ,  Y10T428/1291

    摘要： Provided is an industrially excellent surface-treated copper foil which satisfies requirements for adhesiveness to an insulating resin such as polyimide, heat-resistant adhesiveness, chemical resistance and soft etching properties. Also provided is a method for producing a surface-treated copper foil which achieves a high adhesion strength between an insulating resin and the copper foil, shows high chemical resistance in circuit formation and sustains good soft etching properties after forming vias by laser-processing. A base copper foil is subjected to a roughening treatment to give a surface roughness (Rz) of 1.1 µm or below. On the roughened surface, an Ni-Zn alloy layer is formed. The aforesaid roughening treatment is conducted in such a manner that the roughened surface comprises sharp-pointed convexes, which have a width of 0.3-0.8 µm, a height of 0.6-1.8 µm and an aspect ratio of 1.2-3.5, and the surface roughness (Rz) of said base copper foil is increased by 0.05-0.3 µm. The aforesaid Ni-Zn alloy layer has a Zn content of 6-30 wt% and a Zn deposition amount of 0.08 mg/dm 2 or more.

    摘要翻译： 本发明提供一种用于SATIS外资企业粘合性要求，在绝缘性树脂的工业上优异的表面处理铜箔：如聚酰亚胺，耐热粘合性，耐化学性和软蚀刻性。 如此提供的是一种用于制造其实现绝缘性树脂和铜箔之间的密合强度高的表面处理铜箔，示出了在电路形成高耐化学性，并通过激光加工形成通孔后维持goodsoft蚀刻性。 甲碱铜箔进行粗化处理，得到的1.1微米或以下的表面粗糙度（R z）表示。 在粗糙化的表面，Ni-Zn合金层的形成。 上述粗糙化处理是在寻求的方式进行没有粗糙表面包括尖锐的凸部，其具有0.3-0.8微米的宽度，0.6-1.8微米，1.2-3.5的纵横比的高度，并且，表面粗糙度 所述基座铜箔（裕度）是通过0.05-0.3微米增加。 上述Ni-Zn合金层具有6-30重量％的Zn含量和0:08毫克/分米2以上的Zn附着量。

    COPPER ALLOY PLATE MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS
    10.
    发明公开
    COPPER ALLOY PLATE MATERIAL FOR ELECTRIC AND ELECTRONIC COMPONENTS 审中-公开
    BLECHMATERIAL AUS KUPFERLEGIERUNGFÜRELEKTRISCHE UND ELEKTRONISCHE BAUTEILE

    公开(公告)号：EP2202326A1

    公开(公告)日：2010-06-30

    申请号：EP08836473.2

    申请日：2008-10-02

    申请人： The Furukawa Electric Co., Ltd.

    发明人： MIHARA, Kuniteru ,  NAKANO, Junsuke ,  SUGAHARA, Chikahito ,  UNO, Takeo

    IPC分类号： C22C9/06 ,  H01L23/48 ,  C22F1/00 ,  C22F1/08

    CPC分类号： C22C9/06 ,  C22F1/08 ,  H01L23/13 ,  H01L23/14 ,  H01L23/49579 ,  H01L2924/0002 ,  Y10T428/12993 ,  H01L2924/00

    摘要： An copper alloy strip material for electrical/electronic components according to the present invention is characterized in that such the copper alloy strip material for electrical/electronic components includes: Ni as between 1.5 mass% and 4.0 mass%; Si as between 0.3 mass% and 1.5 mass%; and the balance being Cu and unavoidable impurities, wherein a mean roughness Ra of a surface roughness is not larger than 0.3 µm regarding the strip in a direction as right angle to a direction of a rolling therefor, a maximum height Ry thereof is not higher than 3.0 µm regarding the same therein, and there is positioned a peak position regarding a frequency curve, that represents a concave component of the surface roughness and/or a convex component thereof, at the plus side (the side for the convex component) comparing to an average value of the curve for meaning the surface roughness.

    摘要翻译： 根据本发明的用于电气/电子部件的铜合金带材的特征在于，这种用于电气/电子部件的铜合金带材包括：Ni在1.5质量％至4.0质量％之间; Si在0.3质量％至1.5质量％之间; 余量为Cu和不可避免的杂质，其中表面粗糙度的平均粗糙度Ra相对于与其滚动方向成直角的方向关于条带不大于0.3μm，其最大高度Ry不高于 相对于3.0μm，并且在正侧（凸组件侧）相对于频率曲线定位峰值位置，该频率曲线表示表面粗糙度的凹部分和/或其凸部分，与 用于表示表面粗糙度的曲线的平均值。