公开(公告)号：EP0833371B1

公开(公告)日：2003-04-23

申请号：EP97307305.9

申请日：1997-09-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Dietrich, David Key ,  Haitko, Deborah Ann

IPC: H01J61/26

CPC classification number: H01J61/26 ,  H01J9/52 ,  H01J61/20 ,  H01J61/72 ,  Y02W30/828

公开(公告)号：EP0657267A3

公开(公告)日：1996-04-24

申请号：EP94308789.0

申请日：1994-11-29

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Kim, Bang Mo ,  Niemeyer, Matthew Frank ,  Baumgartner, Charles Edward

IPC: B29C44/58 ,  B29C33/56

CPC classification number: B29C44/58

Abstract: The invention is directed to molding foamable thermoplastic materials employing an insulated mold structure, in order to improve the surface quality of the foamed article. In an exemplary embodiment, a first insulation layer (26) is deposited on the core (12) and a second or primer layer (28) is deposited on the first layer which includes a suspension in metallic particles in a resin. A hard metal coating may be deposited over the second layer. Foamed thermoplastic articles formed using the molds have uniform surface quality, and high adhesion to metal coatings exhibiting good electrical properties.

公开(公告)号：EP0440981B1

公开(公告)日：1994-06-15

申请号：EP90125423.5

申请日：1990-12-24

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Dumas, William Vincent ,  Foust, Donald Franklin

IPC: C23C18/22 ,  C08J7/12

CPC classification number: C08J7/12 ,  C08G73/1003 ,  C08J2379/08 ,  C23C18/22 ,  H05K3/381 ,  Y10S205/926

公开(公告)号：EP0833371A3

公开(公告)日：1998-06-10

申请号：EP97307305.9

申请日：1997-09-19

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Dietrich, David Key ,  Haitko, Deborah Ann

IPC: H01J61/26

CPC classification number: H01J61/26 ,  H01J9/52 ,  H01J61/20 ,  H01J61/72 ,  Y02W30/828

Abstract: The formation of leachable mercury upon disposal or during TCLP testing of mercury vapor discharge lamps is substantially prevented by incorporation in the lamp structure or in the test solution of an oxygen scavenger.

公开(公告)号：EP0419845A2

公开(公告)日：1991-04-03

申请号：EP90116061.4

申请日：1990-08-22

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Bernstein, Lewis Andrew

IPC: C25D5/56 ,  C25D3/38 ,  C23C18/22

CPC classification number: H05K3/381 ,  C25D3/38 ,  C25D5/56 ,  H05K1/0346 ,  H05K3/244

Abstract: Metallized polyimide composites are prepared by depositing an electrolytic layer of metal onto an electrolessly-applied metal layer which is disposed on and chemically bonded to a polyimide substrate, the electrolytic metal layer being deposited from an electrolytic bath containing

A. about 50 to about 275 grams per liter of an aqueous acidic metal electrolyte,
B. about 30 to about 120 grams per liter of a strong acid,
C. about 20 to about 500 parts per million of halide ions,
D. about 0.5 to about 6% by volume of at least one organic chemical additive comprising an organic levelling agent, an organic brightener or a mixture of the foregoing.

These composites are characterized by improved surface characteristics and improved adhesion between the electroless metal layer and the polyimide surface.

Abstract translation: 金属化的聚酰亚胺复合材料通过将金属电解质层沉积在设置在化学键合到聚酰亚胺基底上的无电镀金属层上来制备，电解金属层由含有约50至约275克 每升酸性金属电解质水溶液，B.约30至约120克/升强酸，C.约20至约500份/百万份卤离子，D.约0.5至约6体积％ 至少一种有机化学添加剂，其包含有机流平剂，有机增白剂或上述的混合物。 这些复合材料的特征在于改善的表面特性和改善的化学金属层与聚酰亚胺表面之间的粘附性。

公开(公告)号：EP0310803A1

公开(公告)日：1989-04-12

申请号：EP88113776.4

申请日：1988-08-24

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Dumas, William Vincent ,  Lamby, Edward John ,  Karas, Bradley Ross

IPC: C23C18/18

CPC classification number: C23C18/26 ,  H05K3/389 ,  Y10S205/926 ,  Y10T428/31681 ,  Y10T428/31725

Abstract: A method for treating a polyimide surface is disclosed, in which an adhesion-promoting compound such as thiourea contacts the surface prior to the electroless plating of metal thereon. Articles formed by such a method are also disclosed.

Abstract translation: 一种用于处理聚酰亚胺表面的方法是在光盘游离缺失哪些到粘合促进化合物：在其上的金属的无电解镀敷之前，如硫脲与表面接触。 通过寻求方法制成的制品因此游离缺失盘。

公开(公告)号：EP1684354A3

公开(公告)日：2010-10-06

申请号：EP05256553.8

申请日：2005-10-21

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Liu, Jie ,  Duggal, Anil Raj ,  Heller, Christian Maria Anton ,  Foust, Donald Franklin ,  Faircloth, Tami Janene

IPC: H01L27/32 ,  H01L27/30 ,  G02F1/153

CPC classification number: H01L51/5203 ,  H01L27/3202 ,  H01L27/3204 ,  H01L27/3225 ,  H01L51/0021 ,  H01L51/0024 ,  H01L2251/5338 ,  Y02E10/549

Abstract: A device (22) includes a plurality of organic electronic devices disposed on a substrate (24), wherein each of the organic electronic devices comprises a first electrode (26) and a second electrode (32). Furthermore, the device (22) includes an organic layer (28) disposed between the first and second electrodes (26, 32) of each of the plurality of organic electronic devices. Additionally, the device (22) includes an interconnect element (30), wherein the interconnect element (30) is configured to electrically couple the respective first and second electrodes (26, 32) of each of the plurality of organic electronic devices.

公开(公告)号：EP0840352A2

公开(公告)日：1998-05-06

申请号：EP97308822.2

申请日：1997-11-04

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Haitko, Deborah Ann ,  Dietrich, David Key ,  Foust, Donald Franklin

IPC: H01J61/20

CPC classification number: H01J61/20 ,  H01J9/52 ,  Y02W30/828

Abstract: The formation of leachable mercury upon disposal or during TCLP testing of mercury vapor discharge lamps is substantially prevented by incorporation of an antioxidant in the lamp structure or in the test solution.

Abstract translation: 通过在灯结构中或在测试溶液中引入抗氧化剂，基本上可以防止处理或在TCLP测试汞蒸气放电灯期间形成可浸出的汞。

公开(公告)号：EP0657267A2

公开(公告)日：1995-06-14

申请号：EP94308789.0

申请日：1994-11-29

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Foust, Donald Franklin ,  Kim, Bang Mo ,  Niemeyer, Matthew Frank ,  Baumgartner, Charles Edward

IPC: B29C44/58 ,  B29C33/56

CPC classification number: B29C44/58

Abstract: The invention is directed to molding foamable thermoplastic materials employing an insulated mold structure, in order to improve the surface quality of the foamed article. In an exemplary embodiment, a first insulation layer (26) is deposited on the core (12) and a second or primer layer (28) is deposited on the first layer which includes a suspension in metallic particles in a resin. A hard metal coating may be deposited over the second layer. Foamed thermoplastic articles formed using the molds have uniform surface quality, and high adhesion to metal coatings exhibiting good electrical properties.

Abstract translation: 本发明涉及到模制绝缘模制结构的可发泡的热塑性材料用人。 在一个示例性的，本实施方式的第一绝缘层被沉积在核心和第二或底漆层被沉积其包括在树脂中的金属颗粒的悬浮液在第一层上。 硬金属涂层可以在第二层上沉积。 使用模具FORMED发泡热塑性制品具有均匀的表面质量，以及高粘合性的金属涂层显示出良好的电性能。

公开(公告)号：EP0582411A2

公开(公告)日：1994-02-09

申请号：EP93305847.1

申请日：1993-07-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Chao, Herbert Shin-I ,  Karas, Bradley Ross ,  Foust, Donald Franklin

IPC: C23C18/36

CPC classification number: H05K3/24 ,  C23C18/36 ,  H05K1/0326 ,  H05K3/181

Abstract: Increases in surface resistivity of electroless nickel coatings on polycarbonate-containing substrates are inhibited by employing two electroless nickel plating solutions. The first solution is one which deposits a metal layer containing phosphorus, if any, in an amount up to 5% by weight and is used to deposit a layer at least 0.5 micron thick. The second solution is one which deposits a layer containing phosphorus in the amount of at least 5% and preferably at least 6% by weight. Another metal layer may be interposed between the two nickel layers.

Abstract translation: 使用两种无电镀镍溶液来抑制含有聚碳酸酯的衬底上的化学镀镍表面电阻率的增加。 第一种溶液是以高达5重量％的量沉积含有磷的金属层（如果有的话），并且用于沉积至少0.5微米厚的层。 第二溶液是以含有至少5重量％，优选至少6重量％的量沉积含磷层的溶液。 可以在两个镍层之间插入另一金属层。