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公开(公告)号：EP3391415A1
公开(公告)日：2018-10-24
申请号：EP15828622.9
申请日：2015-12-30
IPC分类号： H01L27/18 , H01L23/498
CPC分类号： H01L39/045 , H01L23/49816 , H01L23/49888 , H01L24/03 , H01L24/05 , H01L24/10 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L25/18 , H01L25/50 , H01L27/18 , H01L2224/0345 , H01L2224/0362 , H01L2224/0381 , H01L2224/03826 , H01L2224/0384 , H01L2224/0401 , H01L2224/05023 , H01L2224/05025 , H01L2224/05124 , H01L2224/05179 , H01L2224/05186 , H01L2224/05564 , H01L2224/05568 , H01L2224/05669 , H01L2224/05684 , H01L2224/05686 , H01L2224/1145 , H01L2224/1181 , H01L2224/13023 , H01L2224/13109 , H01L2224/13116 , H01L2224/13164 , H01L2224/13179 , H01L2224/13183 , H01L2224/16145 , H01L2224/81013 , H01L2224/81193 , H01L2224/81201 , H01L2224/81409 , H01L2225/06513 , H01L2225/06541 , H01L2924/10253 , H01L2924/10271 , H01L2924/10329 , H01L2924/20102 , H01L2924/00014 , H01L2924/04941
摘要： A device (100) includes a first chip (104) having a first circuit element (112), a first interconnect pad (116) in electrical contact (118) with the first circuit element, and a barrier layer (120) on the first interconnect pad, a superconducting bump bond (106) on the barrier layer, and a second chip (102) joined to the first chip by the superconducting bump bond, the second chip having a quantum circuit element (108), in which the superconducting bump bond provides an electrical connection between the first circuit element and the quantum circuit element.
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公开(公告)号：EP3852021A1
公开(公告)日：2021-07-21
申请号：EP21153943.2
申请日：2017-12-15
申请人： Google LLC
IPC分类号： G06N10/00 , H01L25/16 , H01L23/522 , H01L25/065 , H01L23/00
摘要： A stacked quantum computing device including a first chip that includes a first dielectric substrate and a superconducting qubit on the first dielectric substrate, and a second chip that is bonded to the first chip and includes a second dielectric substrate, a qubit readout element on the second dielectric substrate, a control wire on the second dielectric substrate, a dielectric layer covering the control wire, and a shielding layer covering the dielectric layer.
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公开(公告)号：EP4092584A1
公开(公告)日：2022-11-23
申请号：EP22180075.8
申请日：2017-12-12
申请人： Google LLC
摘要： A stacked quantum computing device including: a first chip including a superconducting qubit, where the superconducting qubit includes a superconducting quantum interference device (SQUID) region, a control region, and a readout region, and a second chip bonded to the first chip, where the second chip includes a first control element overlapping with the SQUID region, a second control element displaced laterally from the control region and without overlapping the control region, and a readout device overlapping the readout region.
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公开(公告)号：EP4068142A1
公开(公告)日：2022-10-05
申请号：EP22175554.9
申请日：2016-12-23
申请人： Google LLC
IPC分类号： G06F30/39 , G06F111/02 , G06F111/04
摘要： Methods, systems, and apparatus, including computer programs encoded on a computer storage medium, for parameterization of physical dimensions of discrete circuit components for component definitions that define discrete circuit components. The component definitions may be selected for use in a device design. When a parametrization of a particular version of a discrete circuit component definition is changed, the version level of the device design is also changed and the circuit layout for the device design is physically verified for the new version level.
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公开(公告)号：EP3391415B1
公开(公告)日：2019-08-21
申请号：EP15828622.9
申请日：2015-12-30
申请人： Google LLC
IPC分类号： H01L27/18 , H01L23/498 , H01L25/065
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公开(公告)号：EP3576142B1
公开(公告)日：2020-11-25
申请号：EP19187073.2
申请日：2015-12-30
申请人： Google LLC
IPC分类号： H01L23/498 , H01L25/065 , H01L27/18
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