公开(公告)号：EP2737522A4

公开(公告)日：2015-03-18

申请号：EP12820834

申请日：2012-07-25

申请人： HENKEL IP & HOLDING GMBH

发明人： HOANG GINA ,  KIM YOUNSANG ,  GUINO ROSETTE ,  HUANG QIAOHONG

IPC分类号： H01L21/56

CPC分类号： H01L21/78 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/27436 ,  H01L2224/73104 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00014

公开(公告)号：EP2671249A4

公开(公告)日：2015-10-07

申请号：EP12742755

申请日：2012-01-27

申请人： HENKEL IP & HOLDING GMBH

发明人： KIM YOUNSANG ,  HOANG GINA ,  GUINO ROSE

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/683 ,  H01L23/48

CPC分类号： H01L21/02227 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/481 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/73104 ,  H01L2224/83191

摘要： A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.

公开(公告)号：EP2850146A4

公开(公告)日：2015-12-16

申请号：EP13790039

申请日：2013-04-05

申请人： HENKEL IP & HOLDING GMBH

发明人： GAO JUNBO ,  HOANG GINA

IPC分类号： C09J9/02 ,  C09J7/02 ,  C09J163/00

CPC分类号： C09J9/02 ,  C08G59/182 ,  C08G73/124 ,  C08G73/125 ,  C08G73/126 ,  C08G73/127 ,  C08K3/10 ,  C08L63/00 ,  C09J163/00 ,  C09J179/085

摘要： A conductive adhesive film is prepared from components comprising a thermosetting resin, a film-forming resin, a conductive filler, and further comprising a chain extended epoxy resin prepared from the reaction of a poly-functional phenol with a combination of a poly-functional aromatic epoxy and a poly-functional aliphatic epoxy (poly-functional includes di-functional). The addition of the chain extended epoxy preserves the adhesiveness of the conductive adhesive film at silver loadings of 80 weight percent or greater.