公开(公告)号：EP2737522A4

公开(公告)日：2015-03-18

申请号：EP12820834

申请日：2012-07-25

申请人： HENKEL IP & HOLDING GMBH

发明人： HOANG GINA ,  KIM YOUNSANG ,  GUINO ROSETTE ,  HUANG QIAOHONG

IPC分类号： H01L21/56

CPC分类号： H01L21/78 ,  H01L21/563 ,  H01L21/568 ,  H01L21/6836 ,  H01L2221/68327 ,  H01L2224/131 ,  H01L2224/27436 ,  H01L2224/73104 ,  H01L2224/94 ,  H01L2224/27 ,  H01L2924/00012 ,  H01L2924/00014

公开(公告)号：EP3110897A4

公开(公告)日：2017-10-18

申请号：EP15752347

申请日：2015-02-20

申请人： HENKEL IP & HOLDING GMBH

发明人： BAI JIE ,  DO LY ,  CHAU HUNG ,  KIM YOUNSANG ,  ECKENRODE JULISSA

IPC分类号： C09J5/00 ,  C01B35/14 ,  C01F7/02 ,  C09J7/02 ,  C09J9/00 ,  C09J11/04 ,  C09J133/08 ,  C09J163/00 ,  C09J175/04 ,  C09J179/08 ,  C09J183/04 ,  H01L23/373

CPC分类号： C09J9/00 ,  C08G59/5073 ,  C08K3/22 ,  C08K3/36 ,  C08K3/38 ,  C08K5/14 ,  C08K2003/2227 ,  C08K2003/385 ,  C08L33/00 ,  C08L63/00 ,  C08L75/04 ,  C08L79/08 ,  C09J5/00 ,  C09J11/04 ,  C09J179/085 ,  C09J183/04 ,  C09J2433/00 ,  C09J2463/00 ,  C09J2479/00 ,  C09K5/14 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/00

摘要： Provided herein are thermally conductive underfill compositions which have a combination of melt viscosity, glass transition temperature (Tg), coefficient of thermal expansion, and/or transparency that renders such materials useful for the preparation of a variety of electronic devices, such as flip chip packages, stacked dies, hybrid memory cubes, through-silica via (TSV) devices, and the like. In certain embodiments of the invention, there are provided assemblies comprising a first article permanently adhered to a second article by a cured aliquot of a formulation as described herein. In certain embodiments of the invention, there are provided methods for adhesively attaching a first article to a second article. In certain embodiments of the present invention, there are provided methods for improving heat dissipation by electronic devices assembled employing thermally conductive, but electrically non-conductive adhesive.

公开(公告)号：EP2671249A4

公开(公告)日：2015-10-07

申请号：EP12742755

申请日：2012-01-27

申请人： HENKEL IP & HOLDING GMBH

发明人： KIM YOUNSANG ,  HOANG GINA ,  GUINO ROSE

IPC分类号： H01L21/50 ,  H01L21/56 ,  H01L21/683 ,  H01L23/48

CPC分类号： H01L21/02227 ,  H01L21/563 ,  H01L21/6836 ,  H01L23/481 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68377 ,  H01L2224/73104 ,  H01L2224/83191

摘要： A method for preparing a semiconductor with preapplied underfill comprises providing a semiconductor wafer with a plurality of metallic bumps on its top side and, optionally, through-silica-vias vertically through the silicon wafer; laminating a back grinding tape to the top of the wafer covering the metallic bumps and through silicon vias; thinning the back side of the wafer; mounting a dicing tape to the back side of the thinned wafer and mounting the silicon wafer and dicing tape to a dicing frame; removing the back grinding tape; providing an underfill material precut into the shape of the wafer; aligning the underfill on with the wafer and laminating the underfill to the wafer.

公开(公告)号：EP2791967A4

公开(公告)日：2015-08-05

申请号：EP12857913

申请日：2012-11-20

申请人： HENKEL IP & HOLDING GMBH

发明人： KIM YOUNSANG ,  GREY JEFFREY ,  BECKER KEVIN

IPC分类号： H01L21/301 ,  C09J5/00 ,  C09J7/02 ,  H01L21/67 ,  H01L21/673 ,  H01L21/683 ,  H01L21/78 ,  H01L23/00

CPC分类号： H01L21/673 ,  C09J5/00 ,  C09J7/20 ,  C09J2201/122 ,  C09J2201/28 ,  C09J2201/602 ,  C09J2203/326 ,  H01L21/67132 ,  H01L21/6836 ,  H01L24/27 ,  H01L24/29 ,  H01L2221/68327 ,  H01L2224/27003 ,  H01L2224/271 ,  H01L2224/2711 ,  H01L2224/27436 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2924/12042 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

摘要： A method for removing the trimmed scrap of conductive die attach adhesive film from a carrier support tape is provided. An adhesive film is disposed between a support carrier and a release liner; the release liner and adhesive film are cut into a shape conforming to the shape of a semiconductor wafer. After scrap release liner is removed, a temporary adhesive sheet is mounted over and adhered to the exposed conductive die attach film surrounding the cut shape, and mounted over and adhered to the scrap release liner on the cut shape; the temporary adhesive sheet is removed, and due to its adhesion properties to the adhesive film and release liner, the scrap adhesive film and scrap release liner are removed along with the temporary adhesive sheet.