摘要:
The outserted shape includes a metal plate (8) formed with a plurality of through holes, a plurality of resin portions (15) connected to resin filled in the through holes and bulging on opposite sides of the metal plate (8), the resin portions (15) having a planar cross section larger than that of the through holes, and a plurality of resin components (14) each formed integral with one of the resin portions (15). The resin components (14) are secured in place on the metal plate (8) separate from and independent of each other by virtue of residual thermal stress produced by the difference in the coefficient of thermal expansion between the resin portions and the metal plate, in such a manner that the radially oriented residual thermal stress in each resin portion is symmetrical with respect to the center axis of one of the resin components (14).
摘要:
57 This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread on the substrate surface.
摘要:
57 This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread on the substrate surface.