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公开(公告)号：EP1191587A3
公开(公告)日：2002-07-17
申请号：EP01119622.7
申请日：2001-08-20
申请人： Hitachi, Ltd.
CPC分类号： H05K3/284 , H01L23/24 , H01L24/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/85099 , H01L2224/85207 , H01L2224/8592 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10S428/901 , Y10T428/31663 , H01L2924/00014 , H01L2924/2076 , H01L2924/20753 , H01L2924/20752 , H01L2924/00
摘要： The invention provides a packaging structure applied to an automotive component having semiconductors (3, 4) and electronic parts mounted on a ceramic base (1), characterized in that the semiconductors and electronic parts are partly ore entirely sealed with a thixotropic silicone gel (10) which has a thixotropy index of about 1.5 - 3.6 and a penetration depth of about 6 - 10 mm and a rate of change in viscosity of less than 10 % of the initial value.
摘要翻译： 本发明提供了一种应用于具有半导体（3,4）和安装在陶瓷基体（1）上的电子部件的汽车部件的封装结构，其特征在于半导体和电子部件部分地完全用触变性硅酮凝胶（10 ），其触变指数约为1.5-3.6，渗透深度约为6-10mm，粘度变化率小于初始值的10％。
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公开(公告)号：EP1191587A2
公开(公告)日：2002-03-27
申请号：EP01119622.7
申请日：2001-08-20
申请人： Hitachi, Ltd.
IPC分类号： H01L23/18
CPC分类号： H05K3/284 , H01L23/24 , H01L24/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/85099 , H01L2224/85207 , H01L2224/8592 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10S428/901 , Y10T428/31663 , H01L2924/00014 , H01L2924/2076 , H01L2924/20753 , H01L2924/20752 , H01L2924/00
摘要： The invention provides a packaging structure applied to an automotive component having semiconductors (3, 4) and electronic parts mounted on a ceramic base (1), characterized in that the semiconductors and electronic parts are partly ore entirely sealed with a thixotropic silicone gel (10) which has a thixotropy index of about 1.5 - 3.6 and a penetration depth of about 6 - 10 mm and a rate of change in viscosity of less than 10 % of the initial value.
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公开(公告)号：EP0883180A3
公开(公告)日：1999-10-27
申请号：EP98110007.6
申请日：1998-06-02
申请人： Hitachi, Ltd. , HITACHI CABLE, LTD.
发明人： Ogino, Masahiko , Eguchi, Shuji , Nagai, Akira , Ueno, Takumi , Segawa, Masanori , Kokaku, Hiroyoshi , Ishii, Toshiaki , Anjo, Ichiro , Nishimura, Asao , Miyazaki, Chuichi , Mita, Mamoru , Okabe, Norio
IPC分类号： H01L23/495 , H01L23/498 , H01L21/60
CPC分类号： H01L24/50 , H01L23/3107 , H01L23/49572 , H01L23/49816 , H01L24/32 , H01L2224/29111 , H01L2224/73215 , H01L2924/0001 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01042 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/10253 , H01L2924/15311 , H01L2924/1532 , H01L2924/30107 , H01L2924/351 , H01L2224/29099 , H01L2924/00
摘要： A semiconductor device has a three-layered buffer layer comprising core layer 1 having interconnected foams such as a three-dimensional reticular structure and adhesive layers 2 provided on both sides of the core layer 1 as a stress buffer layer between semiconductor chip 5 and wiring 4 to lessen thermal stress generated between the semiconductor device and the package substrate. The thickness ratio of core layer 1 to total buffer layer is at least 0.2. The production process can be simplified by using such a buffer layer, thereby improving the mass production capacity and enhancing the package reliability.
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公开(公告)号：EP1191587B1
公开(公告)日：2012-05-02
申请号：EP01119622.7
申请日：2001-08-20
申请人： Hitachi, Ltd.
CPC分类号： H05K3/284 , H01L23/24 , H01L24/45 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/85099 , H01L2224/85207 , H01L2224/8592 , H01L2924/01012 , H01L2924/01013 , H01L2924/01014 , H01L2924/01019 , H01L2924/01039 , H01L2924/0105 , H01L2924/01078 , H01L2924/01079 , H01L2924/19041 , H01L2924/19105 , H01L2924/19107 , H01L2924/3025 , Y10S428/901 , Y10T428/31663 , H01L2924/00014 , H01L2924/2076 , H01L2924/20753 , H01L2924/20752 , H01L2924/00
摘要： The invention provides a packaging structure applied to an automotive component having semiconductors (3, 4) and electronic parts mounted on a ceramic base (1), characterized in that the semiconductors and electronic parts are partly ore entirely sealed with a thixotropic silicone gel (10) which has a thixotropy index of about 1.5 - 3.6 and a penetration depth of about 6 - 10 mm and a rate of change in viscosity of less than 10 % of the initial value.
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公开(公告)号：EP1646271A3
公开(公告)日：2007-11-07
申请号：EP05021840.3
申请日：2005-10-06
申请人： Hitachi, Ltd.
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board (2) with electronic components (4-9) mounted thereon, a circuit board (2) connecting side of the connector (3).The electronic components (4-9) and the circuit board (2) with the electronic components (4-9) mounted thereon are encapsulated with the same resin. A metallic base (11) is united to the module (1) to obtain an electric conduction between the metallic base (11) and the circuit board (2).
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6.发明公开
公开(公告)号：EP0304939A3
公开(公告)日：1990-10-10
申请号：EP88113967.9
申请日：1988-08-26
申请人： HITACHI, LTD. , HITACHI CABLE, LTD.
发明人： Tanno, Seikichi , Taketani, Noriaki , Eguchi, Shuji , Asano, Hideki , Shimazaki, Yukio , Takuma, Yuuetsu , Ibamoto, Masahiko , Mukai, Junji
IPC分类号： G02B6/42 , C08F220/10 , G01F23/28 , B29D11/00 , B29C39/00
CPC分类号： G02B6/4202 , G01F23/2927 , G01P3/486 , G02B6/4212 , G02B6/4298
摘要： An optical part for light transmission comprises a light conductor formed of a core (23) of a transparent material and a clad (24) of a material having a smaller refractive index than the core material, and a light emitting and/or receiving element (21), wherein the light emitting and/or receiving element (21) is integrally combined with the core (23) of the light conductor by a material which is the same as that of the core material or by a material having the same refractive index as the core material and having a greater rigidity than the material forming the clad and/or jacket (24). The optical part can be used in a high temperature environment as well as a room temperature environment without involving any appreciable loss in light transmission.
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公开(公告)号：EP0178579A3
公开(公告)日：1988-03-23
申请号：EP85112788
申请日：1985-10-09
申请人： HITACHI, LTD.
发明人： Asano, Hideki , Eguchi, Shuji , Tanno, Seikichi , Okabe, Yoshiaki , Taketani, Noriaki , Nemoto, Masanori , Narusawa, Tuneo , Mihara, Yoshimitsu , Takada, Yukihiko
CPC分类号： G11B33/12 , G02B6/12004 , G11B33/02 , H05K1/0274 , H05K1/0284 , H05K1/0393 , H05K1/056 , H05K1/18 , H05K3/301 , H05K2201/09045 , H05K2201/09118 , H05K2203/1327
摘要： 57 This invention comprises unifying circuits with a base on which mechanical parts are mounted and relates to a mechanical part mounting chassis provided with a substrate and a circuit buried in the substrate and/or spread on the substrate surface.
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8.发明授权Control device and method of manufacturing thereof 有权Steuervorrichtung und Verfahren zu deren Herstellung
公开(公告)号：EP1646271B1
公开(公告)日：2010-03-17
申请号：EP05021840.3
申请日：2005-10-06
申请人： Hitachi, Ltd.
CPC分类号： H05K3/284 , B29C45/14639 , H05K1/0215 , H05K3/0061 , H05K3/321 , H05K3/3447 , H05K5/0034 , H05K5/0082 , H05K7/20854 , H05K2201/09054 , H05K2201/10189 , H05K2201/2036 , Y10T29/49146
摘要： A module comprises a metallic terminal pins for connection and a circuit board (2) with electronic components (4-9) mounted thereon, a circuit board (2) connecting side of the connector (3).The electronic components (4-9) and the circuit board (2) with the electronic components (4-9) mounted thereon are encapsulated with the same resin. A metallic base (11) is united to the module (1) to obtain an electric conduction between the metallic base (11) and the circuit board (2).
摘要翻译： 模块包括用于连接的金属端子销和安装有电子部件（4-9）的电路板（2），连接器（3）的连接侧的电路板（2）。电子部件（4-9） 并且其上安装有电子部件（4-9）的电路板（2）用相同的树脂封装。 金属基座（11）与模块（1）结合，以在金属基座（11）和电路板（2）之间获得导电。
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公开(公告)号：EP0178579B1
公开(公告)日：1993-02-17
申请号：EP85112788.6
申请日：1985-10-09
申请人： HITACHI, LTD.
发明人： Asano, Hideki , Eguchi, Shuji , Tanno, Seikichi , Okabe, Yoshiaki , Taketani, Noriaki , Nemoto, Masanori , Narusawa, Tuneo , Mihara, Yoshimitsu , Takada, Yukihiko
CPC分类号： G11B33/12 , G02B6/12004 , G11B33/02 , H05K1/0274 , H05K1/0284 , H05K1/0393 , H05K1/056 , H05K1/18 , H05K3/301 , H05K2201/09045 , H05K2201/09118 , H05K2203/1327
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公开(公告)号：EP0246613B1
公开(公告)日：1992-09-30
申请号：EP87107271.6
申请日：1987-05-19
申请人： HITACHI, LTD.
发明人： Taketani, Noriaki , Tanno, Seikichi , Eguchi, Shuji , Okabe, Yoshiaki , Terao, Hiromu , Shimura, Masato , Asano, Hideki , Abe, Tomiya
CPC分类号： G02B6/02033 , G02B1/046 , C08L33/06
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