摘要:
A thermosetting resin composition which comprises a cyanate compound or an isocyanate compound represented by the following general formula (I): A - R₁ - A (I) wherein R₁ is an aromatic group, an alicyclic group or a mixed group thereof and A is a cyanate group or an isocyanate group, and a poly-(p-hydroxystyrene) derivative represented by the following general formula (II): wherein X is a fluorine atom, a bromine atom and a chlorine atom, R₂ is an alkenyl group and an unsaturated carboxyl group, each having 2 to 4 carbon atoms, B is any one of a polymerization initiator residue, a polymerization-terminating agent residue, H and m is an integer of 1 to 4 and n is an integer of 5 to 100, and further containing a compound having at least one N-substituted unsaturated imido group, if required, can produce a printed circuit board of high flame retardness, low dielectric constant, low moisture absorption and a high mechanical strength at an elevated temperature.
摘要:
A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate (3) on which memory LSIs (5, 6) and a logic LSI (4) with only elements formed without multilayer wiring are mounted, a multilayer wiring layer (23) insuring signal transfer of the LSIs is formed, providing a thin package board.
摘要:
The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10² to 10⁷ dyne/cm² in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译:本发明涉及一种热固性树脂组合物,其包含(A)热固性聚酰亚胺和(B)双马来酰亚胺,并且在热固化步骤中显示10 2至10 7达因/ cm 2的弹性模量 适用于形成具有优异的耐热性和高可靠性的薄膜布线板中使用的粘合膜。 本发明还涉及前体化合物和组合物。
摘要:
An optical information recording disc having at least one substrate (1) for recording/reproducing an information through an optical unit is disclosed in which a spindle hole (50) through which a spindle (11) provided in a disc drive system is formed in a central portion of the substrate (1). An engagement member (4; 31; 33; 35; 36; 38) engageable with a disc engagement member (14; 21, 21a; 32; 34; 37; 39) integrally formed with the spindle (11) is formed around the central portion. In addition an associated disc drive apparatus is disclosed in which the disc engagement member is formed in a spindle (11).
摘要:
The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10 2 to 10 7 dyne/cm 2 in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译:本发明涉及一种热固性树脂组合物,其包含(A)热固性聚酰亚胺和(B)双马来酰亚胺,并且在热固化步骤中显示10 2至10 7达因/ cm 2的弹性模量 适用于形成具有优异的耐热性和高可靠性的薄膜电路板中使用的粘合膜。 本发明还涉及前体化合物和组合物。
摘要:
A multilayer printed circuit board comprising a plurality of alternately laminated layers of insulating layers and circuit conductor layers having a signal transmission delay time of 6.0 ns/m or less, excellent in heat resistance, adhesive, fire retardance, etc. can be produced by forming insulating layers using a fluorine-containing thermosetting resin composition.