-
1.发明公开Thermosetting resin compositions and their use for thin film wiring boards 失效HitzhärtendeHarzzusammensetzungen und ihre Verwendung vorDünn-film-Leiterplatten。
公开(公告)号：EP0618269A1
公开(公告)日：1994-10-05
申请号：EP94105152.6
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10² to 10⁷ dyne/cm² in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译： 本发明涉及一种热固性树脂组合物，其包含（A）热固性聚酰亚胺和（B）双马来酰亚胺，并且在热固化步骤中显示10 2至10 7达因/ cm 2的弹性模量 适用于形成具有优异的耐热性和高可靠性的薄膜布线板中使用的粘合膜。 本发明还涉及前体化合物和组合物。
-
2.发明公开Thermosetting resin compositions and their use for thin film wiring boards 失效HitzehärtendeHarzzusammensetzungen und ihre Verwendung vonDünnfilmleiterplatten
公开(公告)号：EP0755979A3
公开(公告)日：1997-06-18
申请号：EP96116246.8
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10 2 to 10 7 dyne/cm 2 in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译： 本发明涉及一种热固性树脂组合物，其包含（A）热固性聚酰亚胺和（B）双马来酰亚胺，并且在热固化步骤中显示10 2至10 7达因/ cm 2的弹性模量 适用于形成具有优异的耐热性和高可靠性的薄膜电路板中使用的粘合膜。 本发明还涉及前体化合物和组合物。
-
3.发明授权Thermosetting resin compositions and their use for making resin articles and thin film wiring boards 失效Warmehärtbare树脂组合物及其用于生产合成树脂制品和薄膜电路板的用途
公开(公告)号：EP0618269B1
公开(公告)日：1998-11-11
申请号：EP94105152.6
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
-
4.发明公开
公开(公告)号：EP0755979A2
公开(公告)日：1997-01-29
申请号：EP96116246.8
申请日：1994-03-31
发明人： Miwa, Takao , Suzuki, Masahiro , Takahashi, Akio , Okabe, Yoshiaki , Satsu, Yuichi , Nishimura, Shin
IPC分类号： C08L79/08 , C08G73/10 , C08K5/3415
CPC分类号： H05K3/4655 , C08G73/1039 , C08G73/1071 , C08K5/3415 , C08L79/08 , C09J179/08 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , Y10S428/901 , Y10T428/24917 , Y10T428/31721
摘要： The invention relates to a thermosetting resin composition comprising (A) a thermosetting polyimide and (B) a bismaleimide and showing a modulus of elasticity of 10 2 to 10 7 dyne/cm 2 in the course of heat curing step which is suitable for forming adhesive films used in thin film wiring boards having excellent heat resistance and high reliability. The invention further relates to precursor compounds and compositions.
摘要翻译： 本发明涉及一种热固性树脂组合物，其包含（A）热固性聚酰亚胺和（B）双马来酰亚胺，并且在热固化步骤过程中显示出102-107达因/厘米2的弹性模量，该热固化步骤适合形成 具有优异的耐热性和高可靠性的薄膜布线板。 本发明还涉及前体化合物和组合物。
-
公开(公告)号：EP0630173B1
公开(公告)日：2002-08-14
申请号：EP94303930.5
申请日：1994-06-01
发明人： Ohta, Fumihiko , Nojiri, Takeshi , Tsuchikawa, Shinji , Nakano, Akio , Ishimaru, Toshiaki , Yamazaki, Hiroshi , Akaboshi, Haruo , Kawamoto, Mineo , Takahashi, Akio
CPC分类号： G03F7/033 , C23C18/1605 , C23C18/2013 , C23C18/2033 , C23C18/24 , C23C18/30 , C23C18/405 , H05K3/0076 , H05K3/184 , H05K2203/0793
-
6.发明公开
公开(公告)号：EP1113465A3
公开(公告)日：2001-08-01
申请号：EP01108424.1
申请日：1997-05-26
发明人： Satsu, Yuichi , Katayama, Hideaki , Ito, Yuzo , Takahashi, Akio , Baba, Noboru , Tanaka, Chikara , Miyata, Hiroaki , Satou, Kazuhiro , Asaka, Kazuo , Ishihara, Chio
CPC分类号： H01F1/26 , H01F1/24 , H01F41/0246 , Y10T428/2991
摘要： The present invention provides a soft magnetic powder composite core for an electric apparatus produced with soft magnetic particles having electric insulating layers on the surfaces thereof, wherein said electric insulating layers are formed by mixing said soft magnetic particles with an insulating layer-forming solution which comprises a phosphating solution and a surfactant, and drying the treated soft magnetic particles at a predetermined temperature. The soft magnetic powder composite core is excellent in iron loss and magnetic flux density. The surfactant contains anionic or cationic functional groups and a perfluoroalkyl group.
-
7.发明授权Resin-impregnated superconducting magnet coil and process for its production 失效树脂结合的超导磁体线圈，以及它们的制备方法
公开(公告)号：EP0488275B1
公开(公告)日：1997-04-02
申请号：EP91120374.3
申请日：1991-11-28
申请人： HITACHI, LTD.
发明人： Koyama, Toru , Honjo, Koo , Suzuki, Masao , Takahashi, Akio , Mukoh, Akio , Fukushi, Keiji , Numata, Seiji
IPC分类号： H01F6/06
CPC分类号： H01F6/06 , Y10S428/93 , Y10S505/705 , Y10S505/813 , Y10S505/884 , Y10S505/887 , Y10T428/31678 , Y10T428/31681 , Y10T428/31721 , Y10T428/31725
-
公开(公告)号：EP0735806A1
公开(公告)日：1996-10-02
申请号：EP95104218.3
申请日：1995-03-22
申请人： HITACHI, LTD.
发明人： Miura, Osamu , Takahashi, Akio , Miwa, Takao , Suzuki, Masahiro , Watanabe, Ryuji , Kitagiri, Junichi , Daiko, Yoichi , Imai, Tsutomu , Akahoshi, Haruo
IPC分类号： H05K1/00 , H01L23/538
CPC分类号： H01L24/82 , H01L23/5389 , H01L24/24 , H01L2224/16225 , H01L2224/2402 , H01L2224/24227 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01015 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01042 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/15787 , H01L2924/19041 , H01L2924/19043 , H01L2924/30107 , H01L2924/3011 , H01L2924/00
摘要： A thin and high-density package board used with general-purpose mainframe computers and high-speed processors is provided. On a ceramic substrate (3) on which memory LSIs (5, 6) and a logic LSI (4) with only elements formed without multilayer wiring are mounted, a multilayer wiring layer (23) insuring signal transfer of the LSIs is formed, providing a thin package board.
摘要翻译： 提供了一种用于通用大型计算机和高速处理器的薄型和高密度封装板。 在其上安装仅具有不具有多层布线的元件的存储器LSI（5,6）和逻辑LSI（4））的陶瓷基板（3）上，形成确保LSI的信号传输的多层布线层（23），提供 薄包装板。
-
9.发明授权Thermosetting resin composition, printed circuit board using the resin composition and process for producing printed circuit board 失效热固性树脂组合物，由该组合物和方法用于制造印刷电路的印刷电路。
公开(公告)号：EP0364785B1
公开(公告)日：1995-03-01
申请号：EP89118041.6
申请日：1989-09-29
CPC分类号： C08G18/092 , C08G18/6275 , C08G18/6705 , C08G18/678 , C08G73/1035 , H01B3/302 , H01B3/303 , H05K1/0346 , Y10S428/901 , Y10T156/10 , Y10T428/24917 , Y10T428/31547 , Y10T428/31678
-
10.发明公开Methods of making thin-film wiring boards, thin-film wiring boards made thereby, and adhesive materials 失效制造薄膜布线板的方法，由此制成的薄膜布线板和粘合材料
公开(公告)号：EP0552984A3
公开(公告)日：1994-01-19
申请号：EP93300488.9
申请日：1993-01-22
申请人： HITACHI, LTD.
发明人： Okabe, Yoshiaki , Tawata, Ris , Fujisaki, Koji , Ikeda, Takayoshi , Miwa, Takao , Katagiri, Junichi , Takahashi, Akio
CPC分类号： H05K3/4655 , H01L21/4857 , H01L23/145 , H01L2924/0002 , H05K1/0306 , H05K3/386 , H05K3/4605 , H05K3/4652 , H05K2201/0154 , H05K2201/0195 , H05K2203/0759 , H01L2924/00
摘要： A wiring board having plural layers is made by bonding together individual wiring sheets (1,11,21), each typically comprising copper wiring on a polyimide film substrate. The sheets are bonded together by applying a liquid varnish (16,26) to the wired surface (3) of one sheet. The varnish contains a polyimide precursor, preferably a polyamic acid ester, or a soluble polyimide, as well as a thermosetting adhesion promoter, preferably maleimide-terminated. The liquid varnish (16,26) is dried to a solid polyimide layer on the wired surface. A further wiring sheet is then pressed onto the polyimide layer and the adhesion promoter is polymerised by heating to bond the layers together.
摘要翻译： 具有多层的布线板通过将各自典型地包括铜布线的各个布线板（1,11,21）接合在聚酰亚胺膜基板上而制成。 通过将液体清漆（16,26）施加到一个片材的布线表面（3）上来将这些片材粘合在一起。 清漆含有聚酰亚胺前体，优选聚酰胺酸酯或可溶性聚酰亚胺，以及热固性助粘剂，优选马来酰亚胺封端的。 将液体清漆（16,26）干燥成接线表面上的固体聚酰亚胺层。 然后将另外的布线板压到聚酰亚胺层上，并且通过加热使粘合促进剂聚合以将这些层粘合在一起。
-
-
-
-
-
-
-
-
-
搜索结果
74 条记录 (耗时 0.02 秒)
