-
公开(公告)号：EP2016024A2
公开(公告)日：2009-01-21
申请号：EP07761748.8
申请日：2007-05-02
发明人： SHARAN, Alok , POLLARD, Jeffrey R.
IPC分类号： B81C3/00
CPC分类号： B81C3/001 , B81B2203/033 , B81B2203/0338 , B81C2203/031 , B81C2203/032 , B81C2203/036 , H01L21/67092 , H01L25/0657 , H01L25/50 , H01L2924/0002 , H01L2924/00
摘要： An apparatus includes a first component (102) and a second component (104). The apparatus includes one or more cavities (110) within one or more of the first and the second components. The apparatus includes one or more channels (108) within one or more of the first and the second components. The channels are fluidically inerconnectable with the cavities. Upon pressing the first component against the second component to bond the first component to the second component, gas trapped between the first and the second components is forced into the cavities via the channels.
-
公开(公告)号：EP1720795A1
公开(公告)日：2006-11-15
申请号：EP05723177.1
申请日：2005-02-16
CPC分类号： B81C1/00087 , B41J2/1603 , B41J2/1628 , B41J2/1629 , B41J2/1631 , B41J2/1634 , B81B2201/052
摘要： The described embodiments relate to slotted substrates (300) and methods of forming same. One exemplary method forms a first slot portion (410a) into a first surface (302) of a substrate (300), the first slot portion (410a) defining a footprint (404) at the first surface (302). The method also forms a second slot portion (410a1) through the first slot portion (410a); and, forms a third slot portion (410a2) through a second surface (303) of the substrate (300) sufficiently to intercept the second slot portion (410a1) to form a fluid-handling slot (305) through the substrate (300).
-
公开(公告)号：EP4117925A1
公开(公告)日：2023-01-18
申请号：EP20924385.6
申请日：2020-03-11
-
公开(公告)号：EP1896261B1
公开(公告)日：2013-04-03
申请号：EP06784689.9
申请日：2006-06-07
CPC分类号： B41J2/1603 , B41J2/1408 , B41J2/14145 , B41J2/1629 , B41J2/1631 , B41J2/1634
-
公开(公告)号：EP1896261A1
公开(公告)日：2008-03-12
申请号：EP06784689.9
申请日：2006-06-07
CPC分类号： B41J2/1603 , B41J2/1408 , B41J2/14145 , B41J2/1629 , B41J2/1631 , B41J2/1634
摘要： A thermal ink-jet head has extended surface elements, like fins (350) or protrusions (650) used to cool the portion of the head dissipated by the resistors (130) that does not go into vaporizing the ink and is conducted through the substrate (122) . This head is manufactured using a light beam and anisotropic etching.
-
公开(公告)号：EP3959012A1
公开(公告)日：2022-03-02
申请号：EP19939603.7
申请日：2019-07-26
-
公开(公告)号：EP3717258A1
公开(公告)日：2020-10-07
申请号：EP17932868.7
申请日：2017-11-27
-
公开(公告)号：EP3609712A1
公开(公告)日：2020-02-19
申请号：EP17920348.4
申请日：2017-07-31
-
公开(公告)号：EP3609711A1
公开(公告)日：2020-02-19
申请号：EP17919812.2
申请日：2017-07-31
-
-
-
-
-
-
-
-
搜索结果
9 条记录 (耗时 0.01 秒)
