-
1.发明公开CYANATE-EPOXY RESIN COMPOSITION, AND PREPREG, METAL FOIL-LAMINATED PLATE AND PRINTED WIRING BOARD USING THE SAME 审中-公开氰酸环氧树脂组合物预浸料和金属膜进行层压板及印刷电路基板使用该化合物
公开(公告)号：EP1142953A1
公开(公告)日：2001-10-10
申请号：EP99961325.0
申请日：1999-12-22
CPC分类号： B32B15/14 , B32B15/08 , B32B2260/021 , B32B2260/046 , B32B2457/08 , C08G59/4014 , H05K1/0326 , H05K1/0346
摘要： A cyanate-epoxy resin composition comprising (A) a cyanate type compound containing two or more cyanato groups in one molecule thereof, (B) an epoxy resin, and (C) a curing accelerator, wherein the epoxy resin is derived from a dicyclopentadiene-phenol polyaddition product having a dicyclopentadiene skeleton, and the curing accelerator comprises a combination of a compound having the function to accelerate the curing reaction of the above (A) and a compound having the function to accelerate the curing reaction of the above (B). This cyanate-epoxy resin composition is excellent in glass transition temperature, dielectric characteristics, heat resistance and low susceptibility to water, and can be effectively used for preparing a prepreg and for manufacturing a laminate, a metal foil-laminated plate and a printed wiring board using the prepreg.
-
2.发明公开POLYAMIDEIMIDE RESIN, ADHESIVE AGENT, MATERIAL FOR FLEXIBLE SUBSTRATE, FLEXIBLE LAMINATE, AND FLEXIBLE PRINT WIRING BOARD 审中-公开POLYAMIDIMIDHARZ，KLEBSTOFF，材料FÜR柔性基材，柔性层压板柔性LEITERPLATTE
公开(公告)号：EP2070961A1
公开(公告)日：2009-06-17
申请号：EP07792714.3
申请日：2007-08-20
IPC分类号： C08G18/34 , B32B15/088 , C08G73/14 , C09J163/00 , C09J179/08 , H05K1/03
CPC分类号： B32B7/12 , B32B3/085 , B32B15/08 , B32B15/088 , B32B27/08 , B32B27/34 , B32B2255/06 , B32B2255/10 , B32B2255/26 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/726 , B32B2457/08 , C08G18/5036 , C08G18/5057 , C08G18/615 , C08G73/14 , C09J179/08 , H05K1/0346 , H05K1/0393 , H05K3/386 , H05K2201/0154 , Y10S428/901 , Y10T428/31515 , Y10T428/31522 , Y10T428/31681 , Y10T428/31721
摘要： A polyamide-imide resin obtained by a process comprising the step of reacting an aromatic diisocyanate with a diimide dicarboxylic acid containing 40 mol% or more of a compound represented by the following general formula (1) and 20 mol% or more of a compound represented by the following general formula (2).
摘要翻译： 通过包括使芳族二异氰酸酯与含有40mol％以上的由以下通式（1）表示的化合物和20mol％以上的化合物表示的二酰亚胺二羧酸反应的方法得到的聚酰胺酰亚胺树脂 通过以下通式（2）。
-
3.发明公开
公开(公告)号：EP3778685A1
公开(公告)日：2021-02-17
申请号：EP19775595.2
申请日：2019-03-29
摘要： To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.
-
4.发明公开
公开(公告)号：EP3456779A1
公开(公告)日：2019-03-20
申请号：EP17796260.2
申请日：2017-05-15
发明人： HIRAYAMA, Yuya , KITAJIMA, Takayo , TOMIOKA, Kenichi , KUSHIDA, Keisuke , KAKITANI, Minoru , SHIMIZU, Hiroshi
摘要： The present invention relates to a resin composition including an acrylic polymer (A) and a thermosetting resin (B), wherein a phase separation structure of a first phase containing the acrylic polymer (A) and a second phase containing the thermosetting resin (B) is formed, and an average domain size of the second phase is 20 µm or less.
-
-
-
搜索结果
4 条记录 (耗时 0.01 秒)
