摘要:
To provide a thermosetting resin composition that has low elasticity, high heat resistance, high elongation under an ordinary temperature environment and a high temperature environment, high electric insulation reliability, and high adhesion strength to a metal foil, and is capable of providing a prepreg that is excellent in crack resistance; a prepreg including the thermosetting resin composition; a metal foil with a resin including the thermosetting resin composition and a metal foil laminated on each other; a laminate including the prepreg or the metal foil with a resin; a printed wiring board including the laminate; and a semiconductor package including the printed wiring board. Specifically, the thermosetting resin composition contains (A) a phenol-based resin, and the component (A) contains (A-1) a phenol-based resin having an aliphatic hydrocarbon group having 10 to 25 carbon atoms.
摘要:
The present invention provides a curable resin composition exhibiting excellent performance as a cured product, such as excellent heat resistance and flame retardancy, and further exhibiting excellent interlayer adhesive strength when applied to a printed circuit board. A phenol resin composition used as a curing agent for an epoxy resin includes a naphthol novolac resin (a1) represented by general formula (1) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group, and n is a repeating unit and an integer of 1 or more), and a compound (a2) represented by general formula (2) (wherein R 1 and R 2 each independently represent a hydrogen atom, an alkyl group, or an alkoxy group), wherein the total ratio of compounds with n = 1 and n = 2 in the general formula (1) present in the composition is in the range of 10 to 35%, the average of n in the general formula (1) is in the range of 3.0 to 7.0, and the content of the compound (a2) in the composition is 1 to 6%.
摘要:
A resin for an under-layer material for use in forming an under-layer film between a substrate and a photoresist layer, which is a novolak resin containing an oligomer having a mass average molecular weight of 500 or less in an amount of 1 mass % or less as measured by the gel-permeation chromatographic method; a under-layer material comprising the resin; a laminate comprising the under-layer material; and a method for forming a resist pattern using the under-layer material.
摘要:
A process for producing a carbon comprising heating a phenol resin at 600 to 1,000°C under an oxidizing gas atmosphere wherein the phenol resin is obtained by reacting a compound represented by the formula (1): wherein R 1 represents a C1-C12 alkyl group which may be substituted with at least one substituent, m represents an integer of 0 to 4, n represents an integer of 0 to 4, m+n is an integer of 0 to 4, and when n is 2 or more, R 1 s may be the same or different from each other, with an aldehyde compound.
摘要:
Alkylated antioxidant macromolecules are represented by Structural Formula 1: wherein the variables are described herein. Also included are methods of making the molecules and methods of using the molecules as antioxidants.
摘要:
Tall oil pitch may be reacted with a phenol-containing organic compound and formaldehyde or reactive equivalent thereof to prepare a resin. The reactants may further include polyhydric organic compound, a,b-unsaturated carboxyl compound or ester thereof, and hydroxyl-containing non-phenolic organic compound. The resin may be formulated with a colorant to provide an ink for lithographic, gravure or letterpress printing.
摘要:
The cure rate of phenol-aldehyde resins is accelerated by conjoint use of a cyclic carbonate cure accelerant and an amine cure accelerant. The cure rate is accelerated still further by addition of a resorcinol source to resin comprising a cyclic carbonate and an amine cure accelerator.
摘要:
The present invention provides a method for producing a water insoluble, aqueous alkali soluble novolak resins having consistent molecular weight and superior performance in photoresist composition, by isolating such novolak resin without high temperature distillation. A method is also provided for producing photoresist composition from such a novolak resin and for producing semiconductor devices using such a photoresist composition.
摘要:
The present invention provides a method for producing a film forming, fractionated novolak resin having consistent molecular weight and superior performance in photoresist composition, by isolating such novolak resin fractions without high temperature distillation. A method is also provided for producing photoresist composition from such a fractionated novolak resin and for producing semiconductor devices using such a photoresist composition.