公开(公告)号：EP4403893A1

公开(公告)日：2024-07-24

申请号：EP23218033.1

申请日：2023-12-19

Applicant: Huawei Digital Power Technologies Co., Ltd.

Inventor： DANG, Xinghua ,  CHEN, Jiansheng ,  ZHOU, Renyou

IPC: G01K1/16 ,  H05K1/02 ,  H05K7/20 ,  H01L23/495 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L23/473 ,  H01L23/34

CPC classification number: H05K7/20927 ,  H05K7/20945 ,  H05K1/0207 ,  H05K1/0203 ,  H05K2201/1054520130101 ,  H05K2201/1019620130101 ,  G01K1/16 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49534 ,  H01L23/49568 ,  H01L23/5383 ,  H01L23/34

Abstract: Embodiments of this application provide a power module, a charging pile, and a power supply. The power module includes a substrate, a heat-emitting component, and a température sensor. The heat-emitting component and the température sensor are both disposed on a surface of the substrate, and the heat-emitting component and the température sensor are insulated from each other. The substrate includes a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure. A projection of the température sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the température sensor is configured to collect a température of the conductive structure. In this way, whether an electronic device such as a charging pile or a power supply needs over-temperature protection may be determined based on the température that is of the conductive structure and that is less affected by a liquid cooling plate, thereby improving determining accuracy.