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公开(公告)号：EP4412405A1
公开(公告)日：2024-08-07
申请号：EP23215109.2
申请日：2023-12-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： KO, Byunghan , KONG, Doil , ZHAO, Hu
IPC: H05K1/02 , H01L23/367 , H01L23/433 , H05K1/18 , H05K3/34 , H05K7/20 , H01L23/373
CPC classification number: H05K2201/1015920130101 , H05K2201/1073420130101 , H05K2201/1054520130101 , H05K3/3415 , H05K1/181 , H05K2201/1020420130101 , H05K1/0209 , H05K2201/06620130101 , H05K2201/1096920130101 , H05K2201/203620130101 , H05K1/0206 , H01L23/3736 , H01L23/367 , H05K2203/157220130101 , H01L23/42 , H01L25/18 , H01L25/105
Abstract: The present disclosure provides semiconductor assemblies including dummy packages. In some embodiments, the semiconductor assembly includes a solid-state drive (SSD) device including a printed circuit board (20) including a memory region, a plurality of memory packages (200) disposed on the memory region, and at least one dummy package (100) disposed on the memory region. The at least one dummy package (100) is electrically coupled with the printed circuit board (20). The at least one dummy package (100) includes a first pad (150) constituting a heat path through which heat of the printed circuit board (20) is dissipated.
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2.发明授权
公开(公告)号：EP3809233B1
公开(公告)日：2024-05-22
申请号：EP20201495.7
申请日：2020-10-13
CPC classification number: G05D23/24 , H05B1/0269 , A47J31/545 , H05K2201/1015120130101 , H05K2201/1005320130101 , H05K2201/1019620130101 , H05K2201/1054520130101 , H05K3/3421
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Patent Agency Ranking
公开(公告)号：EP4427304A1
公开(公告)日：2024-09-11
申请号：EP24706296.1
申请日：2024-01-12
Applicant: Ciena Corporation
Inventor： MAYS, Russell
IPC: H01R12/71 , H01R12/72 , H01R13/6471 , H01R12/57
CPC classification number: H01R12/716 , H01R12/727 , H01R12/724 , H01R13/6471 , H01R12/57 , H05K2201/1018920130101 , H05K3/3421 , H05K1/113 , H05K1/114 , H05K1/0222 , H05K2201/1054520130101
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公开(公告)号：EP4403893A1
公开(公告)日：2024-07-24
申请号：EP23218033.1
申请日：2023-12-19
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： DANG, Xinghua , CHEN, Jiansheng , ZHOU, Renyou
IPC: G01K1/16 , H05K1/02 , H05K7/20 , H01L23/495 , H01L23/373 , H01L23/498 , H01L23/538 , H01L23/473 , H01L23/34
CPC classification number: H05K7/20927 , H05K7/20945 , H05K1/0207 , H05K1/0203 , H05K2201/1054520130101 , H05K2201/1019620130101 , G01K1/16 , H01L23/3735 , H01L23/473 , H01L23/49534 , H01L23/49568 , H01L23/5383 , H01L23/34
Abstract: Embodiments of this application provide a power module, a charging pile, and a power supply. The power module includes a substrate, a heat-emitting component, and a température sensor. The heat-emitting component and the température sensor are both disposed on a surface of the substrate, and the heat-emitting component and the température sensor are insulated from each other. The substrate includes a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure. A projection of the température sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the température sensor is configured to collect a température of the conductive structure. In this way, whether an electronic device such as a charging pile or a power supply needs over-temperature protection may be determined based on the température that is of the conductive structure and that is less affected by a liquid cooling plate, thereby improving determining accuracy.
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公开(公告)号：EP4364788A3
公开(公告)日：2024-07-10
申请号：EP24164999.5
申请日：2019-11-19
Applicant: Pacesetter, Inc.
Inventor： KELLER, Wade , EBY, Thomas B , MCKENNA, Sean , VILLAVICENCIO, Brett C.
CPC classification number: A61B2560/0420130101 , A61N1/0587 , A61N1/362 , A61N1/3756 , H05K1/189 , H05K2201/05620130101 , H05K2201/1001520130101 , H05K2201/1003720130101 , H05K2201/1015120130101 , H05K2201/1016620130101 , H05K2201/1017420130101 , H05K2201/1018920130101 , H05K2201/1054520130101 , A61N1/3754 , A61N1/37512 , A61N1/3758 , A61N1/378
Abstract: A biostimulator (100), such as a leadless cardiac pacemaker, is described. The biostimulator (100) comprises a housing (102) having an electronics compartment (116), a circuit assembly (120) within the electronics compartment (116) and including a plurality of battery connectors (410), a battery (107) having a plurality of battery pins (902) extending from a distal face (904) of the battery (107) and an end insulator (122) between the distal face (904) of the battery (107) and the circuit assembly (120). The end insulator (122) includes a plurality of slots (804), and the plurality of battery pins (902) extend through the plurality of slots (804) into the electronics compartment (116) to connect to the plurality of battery connectors (410). Also a method of manufacturing a biostimulator (100) is claimed.
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公开(公告)号：EP4364788A2
公开(公告)日：2024-05-08
申请号：EP24164999.5
申请日：2019-11-19
Applicant: Pacesetter, Inc.
Inventor： KELLER, Wade , EBY, Thomas B , MCKENNA, Sean , VILLAVICENCIO, Brett C.
IPC: A61N1/05
CPC classification number: A61B2560/0420130101 , A61N1/0587 , A61N1/362 , A61N1/3756 , H05K1/189 , H05K2201/05620130101 , H05K2201/1001520130101 , H05K2201/1003720130101 , H05K2201/1015120130101 , H05K2201/1016620130101 , H05K2201/1017420130101 , H05K2201/1018920130101 , H05K2201/1054520130101 , A61N1/3754 , A61N1/0573 , A61N1/37512
Abstract: A biostimulator (100), such as a leadless cardiac pacemaker, is described. The biostimulator (100) comprises a housing (102) having an electronics compartment (116), a circuit assembly (120) within the electronics compartment (116) and including a plurality of battery connectors (410), a battery (107) having a plurality of battery pins (902) extending from a distal face (904) of the battery (107) and an end insulator (122) between the distal face (904) of the battery (107) and the circuit assembly (120). The end insulator (122) includes a plurality of slots (804), and the plurality of battery pins (902) extend through the plurality of slots (804) into the electronics compartment (116) to connect to the plurality of battery connectors (410). Also a method of manufacturing a biostimulator (100) is claimed.
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公开(公告)号：EP3883643B1
公开(公告)日：2024-04-24
申请号：EP19818429.3
申请日：2019-11-19
CPC classification number: A61B2560/0420130101 , A61N1/0587 , A61N1/362 , A61N1/3756 , H05K1/189 , H05K2201/05620130101 , H05K2201/1001520130101 , H05K2201/1003720130101 , H05K2201/1015120130101 , H05K2201/1016620130101 , H05K2201/1017420130101 , H05K2201/1018920130101 , H05K2201/1054520130101 , A61N1/3754 , A61N1/0573 , A61N1/37512
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