公开(公告)号：EP3809233B1

公开(公告)日：2024-05-22

申请号：EP20201495.7

申请日：2020-10-13

IPC分类号： G05D23/24 ,  H05K3/34 ,  A47J31/54 ,  H05B1/02

CPC分类号： G05D23/24 ,  H05B1/0269 ,  A47J31/545 ,  H05K2201/1015120130101 ,  H05K2201/1005320130101 ,  H05K2201/1019620130101 ,  H05K2201/1054520130101 ,  H05K3/3421

公开(公告)号：EP4403893A1

公开(公告)日：2024-07-24

申请号：EP23218033.1

申请日：2023-12-19

申请人： Huawei Digital Power Technologies Co., Ltd.

发明人： DANG, Xinghua ,  CHEN, Jiansheng ,  ZHOU, Renyou

IPC分类号： G01K1/16 ,  H05K1/02 ,  H05K7/20 ,  H01L23/495 ,  H01L23/373 ,  H01L23/498 ,  H01L23/538 ,  H01L23/473 ,  H01L23/34

CPC分类号： H05K7/20927 ,  H05K7/20945 ,  H05K1/0207 ,  H05K1/0203 ,  H05K2201/1054520130101 ,  H05K2201/1019620130101 ,  G01K1/16 ,  H01L23/3735 ,  H01L23/473 ,  H01L23/49534 ,  H01L23/49568 ,  H01L23/5383 ,  H01L23/34

摘要： Embodiments of this application provide a power module, a charging pile, and a power supply. The power module includes a substrate, a heat-emitting component, and a température sensor. The heat-emitting component and the température sensor are both disposed on a surface of the substrate, and the heat-emitting component and the température sensor are insulated from each other. The substrate includes a conductive structure, the heat-emitting component is electrically connected to the conductive structure, and the conductive structure is configured to perform heat exchange with the heat-emitting component electrically connected to the conductive structure. A projection of the température sensor in a thickness dimension of the substrate overlaps at least partially with a projection of the conductive structure in the thickness dimension of the substrate, and the température sensor is configured to collect a température of the conductive structure. In this way, whether an electronic device such as a charging pile or a power supply needs over-temperature protection may be determined based on the température that is of the conductive structure and that is less affected by a liquid cooling plate, thereby improving determining accuracy.

公开(公告)号：EP4346340A3

公开(公告)日：2024-06-05

申请号：EP24151423.1

申请日：2018-07-23

申请人： Smith & Nephew PLC

发明人： HUNT, Allan, Kenneth, Frazer, Grugeon ,  PARTINGTON, Lee, Ian ,  QUINTANAR, Felix, Clarence ,  STEWARD, Daniel, Lee ,  URWIN, Charlotte, Rose

IPC分类号： A61F13/00 ,  A61F13/02 ,  A61F13/05 ,  H05K1/02 ,  H05K1/18 ,  H05K3/28 ,  H01L23/31

CPC分类号： H01L2924/18120130101 ,  A61F13/00987 ,  H05K3/284 ,  A61F2013/009420130101 ,  A61F13/0286 ,  A61F13/00055 ,  H05K1/0283 ,  H05K1/189 ,  H05K2201/011620130101 ,  H05K2201/014520130101 ,  H05K2201/01520130101 ,  H05K2201/1015120130101 ,  H05K2201/1019620130101 ,  H05K2203/117320130101 ,  H01L23/3171 ,  H01L23/3185 ,  H01L23/3121 ,  H01L23/3135 ,  A61F13/05 ,  A61F13/00991

摘要： Devices and methods for encapsulating a portion of a wound dressing with biocompatible coating are disclosed. In some embodiments, a method includes coating a first side of a flexible wound contact layer of the wound dressing with a hydrophobic coating. The first side of the wound contact layer can support a plurality of electronic components. The method can further include coating a second side of the wound contact layer opposite the first side with the hydrophobic coating. The wound contact layer can be formed at least partially from hydrophilic material.

公开(公告)号：EP3994710B1

公开(公告)日：2024-09-18

申请号：EP20739589.8

申请日：2020-07-03

IPC分类号： H01C1/14 ,  H01C1/142 ,  H01C7/04 ,  H01C7/18

CPC分类号： H01C7/18 ,  H01C17/075 ,  H01C1/142 ,  H05K1/0306 ,  H05K2201/1019620130101 ,  H05K2201/1015120130101 ,  H05K2201/06820130101 ,  H01C7/006 ,  H01C17/288

公开(公告)号：EP4097761B1

公开(公告)日：2024-06-26

申请号：EP21701349.9

申请日：2021-01-28

IPC分类号： H01L23/538 ,  H01L23/498 ,  H01L23/373 ,  H01L25/07 ,  H01L25/16 ,  H05K1/14 ,  H01L23/00 ,  H05K1/02 ,  H05K3/22

CPC分类号： H01L25/072 ,  H05K3/222 ,  H05K1/141 ,  H05K1/0262 ,  H05K2201/1016620130101 ,  H05K2201/04220130101 ,  H05K2201/1015120130101 ,  H05K2201/1019620130101 ,  H01L23/3735 ,  H01L23/5385 ,  H01L23/49811 ,  H01L2224/060320130101 ,  H01L2224/3223820130101 ,  H01L24/72 ,  H01L2224/7325120130101 ,  H01L2224/2020130101 ,  H01L2224/838420130101 ,  H01L25/162

公开(公告)号：EP4367691A2

公开(公告)日：2024-05-15

申请号：EP22741159.2

申请日：2022-06-24

申请人： TDK Electronics AG

发明人： HOJAS, Gerhard ,  LAMPL, Siegfried ,  ALFARRO SAMON MASAN, Lamablawa Mario Valentino

IPC分类号： H01C1/014 ,  H01C1/144 ,  H01C17/28 ,  H01G2/06 ,  H01G13/00 ,  H05K1/18 ,  H05K3/32 ,  H05K3/40 ,  H01L23/00 ,  H01G4/232 ,  H01C1/01

CPC分类号： H01G4/232 ,  H05K3/328 ,  H05K2201/036720130101 ,  H01G13/006 ,  H01C1/014 ,  H01C17/281 ,  H01G2/065 ,  H01C17/283 ,  H01G2/06 ,  H01C1/01 ,  H01C1/144 ,  H01L2224/1622520130101 ,  H01L24/81 ,  H05K1/0306 ,  H05K2201/1002220130101 ,  H05K2201/1019620130101 ,  H01L24/16