公开(公告)号：EP4369534A1

公开(公告)日：2024-05-15

申请号：EP22868928.7

申请日：2022-08-16

申请人： Huawei Technologies Co., Ltd.

发明人： CAO, Shuzhao ,  QIU, Shuang ,  YANG, Xichen ,  ZHANG, Jie

IPC分类号： H01R43/18 ,  H01R13/6591 ,  H01R13/648 ,  H01R13/40 ,  H01R13/46

CPC分类号： H01R43/18 ,  H01R13/648 ,  H01R13/6591 ,  H01R13/46 ,  H01R13/40 ,  H01R43/00 ,  H01R12/73 ,  H01R12/7082 ,  H05K1/144 ,  H05K2201/201820130101 ,  H05K2201/04220130101

摘要： This application provides a connector, a connector preparation method, an interconnection system, and a communication device, to achieve comparatively low costs, comparatively good electrical performance, and connector fabrication process simplification. The connector may include a base structure. At least one first via hole is disposed between a first surface and second surface of the base structure. The first surface has a first metal layer and a first clearance region that is in one-to-one correspondence with the at least one first via hole. The first clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding first clearance region. The first clearance region does not overlap the first metal layer. The second surface has a second metal layer and a second clearance region that is in one-to-one correspondence with the at least one first via hole. The second clearance region is of a ring-shaped structure. The first via hole is located in a region encircled by the corresponding second clearance region. The second clearance region does not overlap the second metal layer. A surface, of the base structure, other than the first surface and the second surface has a third metal layer.

公开(公告)号：EP4243072A1

公开(公告)日：2023-09-13

申请号：EP21896653.9

申请日：2021-10-21

申请人： Huawei Technologies Co., Ltd.

发明人： SUN, Jie ,  MO, Ruiming ,  YANG, Xichen ,  XU, Yi

IPC分类号： H01L25/16 ,  H01L23/367 ,  H01L23/04 ,  H01L23/10

摘要： Embodiments of this application disclose an electronic component and an electronic device, to achieve a three-dimensional stacked structure, reduce an area, and improve heat dissipation. In embodiments of this application, the electronic component includes an upper cover plate, a lower cover plate, and an enclosure frame. The upper cover plate carries a first circuit. The lower cover plate carries a second circuit. The enclosure frame is separately connected to the upper cover plate and the lower cover plate. An interconnection circuit is disposed in the enclosure frame, and the interconnection circuit is configured to implement interconnection between the first circuit and the second circuit. The first circuit and the second circuit overlap in a vertical direction without interfering with each other. Because a height of the enclosure frame is not lower than a preset height, and the preset height is higher than a sum of a height of the first circuit and a height of the second circuit, a three-dimensional stacked structure is achieved between the upper cover plate and the lower cover plate, thereby reducing an area of the electronic device.

公开(公告)号：EP2227076A1

公开(公告)日：2010-09-08

申请号：EP09815564.1

申请日：2009-04-24

申请人： Huawei Technologies Co., Ltd.

发明人： HUANG, Mingli ,  ZHANG, Shun ,  YANG, Xichen ,  ZHAO, Junying ,  LUO, Bing ,  LI, Zhihai ,  WANG, Guoliang

IPC分类号： H05K3/46

CPC分类号： H05K1/0206 ,  H05K1/0204 ,  H05K3/4611 ,  H05K2201/09309 ,  H05K2201/10416 ,  H05K2203/063 ,  Y10T29/49124

摘要： A multi-layer circuit board, a method of manufacturing the same, and a communication device are provided. As for the multi-layer circuit board, a slot segment is opened on at least one daughter board to form a first daughter board. At least one daughter board and medium layers are stacked together. The daughter boards include first daughter boards. The first daughter boards are placed in such a way that the slot segments of the first daughter boards are communicated. The slot segments are communicated to form a receiving slot. A heat conducting block is placed within the receiving slot. Each medium layer is sandwiched between the daughter boards. The stacked daughter boards, medium layers, and heat conducting block are pressed together, and the pressed daughter boards and heat conducting block are made into a multi-layer circuit board. The heat conducting block is embedded when the circuit board is pressed, thereby simplifying the assembling process of the heat conducting block.

摘要翻译： 提供了多层电路板，其制造方法和通信装置。 对于多层电路板，在至少一个子板上打开槽段以形成第一子板。 至少一个子板和中间层堆叠在一起。 子板包括第一个子板。 第一子板被放置成使得第一子板的槽段被通信。 槽段被传送以形成接收槽。 导热块放置在接收槽内。 每个介质层夹在子板之间。 将堆叠的子板，中等层和导热块压在一起，将压制的子板和导热块制成多层电路板。 当电路板被按压时，导热块被嵌入，从而简化了导热块的组装过程。