公开(公告)号：EP4016151A1

公开(公告)日：2022-06-22

申请号：EP21198382.0

申请日：2021-09-22

申请人： INTEL Corporation

发明人： DESHPANDE, Nitin ,  KARHADE, Omkar ,  MARIN, Brandon ,  MAY, Robert ,  BOYAPATI, Sri Ranga Sai ,  PIETAMBARAM, Srinivas V. ,  LI, Xiaoqian ,  ECTON, Jeremy ,  PRATAP, Divya ,  TANAKA, Hiroki ,  VADLAMANI, Sai

IPC分类号： G02B6/42

摘要： Embodiments disclosed herein include optical systems with Faraday rotators in order to enhance efficiency. In an embodiment, a photonics package comprises an interposer and a patch over the interposer. In an embodiment, the patch overhangs an edge of the interposer. In an embodiment, the photonics package further comprises a photonics die on the patch and a Faraday rotator passing through a thickness of the patch. In an embodiment, the Faraday rotator is below the photonics die.

公开(公告)号：EP4270072A1

公开(公告)日：2023-11-01

申请号：EP23157645.5

申请日：2023-02-20

申请人： INTEL Corporation

发明人： TANAKA, Hiroki ,  NIE, Bai ,  DARMAWIKARTA, Kristof ,  MAHALINGAM, Hari

IPC分类号： G02B6/12 ,  G02B6/136

摘要： Techniques for signal amplification for a photonic integrated circuit (PIC) die are disclosed. In the illustrative embodiment, an optical fiber (104) is coupled to an input signal waveguide (110) in a glass interposer (102), and an input signal waveguide (130) of a PIC die is coupled to the input signal waveguide (110) of the glass interposer (102). In order to compensate for any coupling losses, the input signal waveguide (110) of the glass interposer (102) is active, amplifying an input signal. Light in a pump waveguide (114) near the input signal waveguide (110) pumps ions in the input signal waveguide (110) into a population inversion, allowing them to amplify the input signal.

公开(公告)号：EP4020848A1

公开(公告)日：2022-06-29

申请号：EP21195492.0

申请日：2021-09-08

申请人： Intel Corporation

发明人： HOSSEINI, Kaveh ,  O'KEEFFE, Conor ,  MARIN, Brandon C. ,  TANAKA, Hiroki

IPC分类号： H04B10/532 ,  G02B6/27

摘要： Embodiments described herein may be related to apparatuses, processes, and techniques related to a dual polarization chiplet that may be used by an optical receiver to split multi-polarized light traveling on a single fiber and carrying two or more light signals into two or more fibers each carrying the particular light signal. The dual polarization chiplet may also be used by an optical transmitter to combine multiple light signals to be transmitted onto a single fiber, where each of the multiple light signals are represented by a different polarization of a wavelength on the single fiber. Other embodiments may be described and/or claimed.

公开(公告)号：EP4016150A1

公开(公告)日：2022-06-22

申请号：EP21196215.4

申请日：2021-09-13

申请人： Intel Corporation

发明人： TANAKA, Hiroki ,  MARIN, Brandon ,  DARMAWKARTA, Kristof ,  MAY, Robert Alan ,  BOYAPATI, Sri Ranga Sai ,  PIETAMBARAM, Srinivas

IPC分类号： G02B6/42

摘要： Embodiments disclosed herein include photonics package with Faraday rotators to improve efficiency. In an embodiment, a photonics package comprises a package substrate and a compute die over the package substrate. In an embodiment, the photonics package further comprises a photonics die over the package substrate. In an embodiment, the compute die is communicatively coupled to the photonics die by a bridge in the package substrate. In an embodiment, the photonics package further comprises an integrated heat spreader (IHS) over the package substrate, and a Faraday rotator passing through the IHS and optically coupled to the photonics die.

公开(公告)号：EP3732718A1

公开(公告)日：2020-11-04

申请号：EP17936282.7

申请日：2017-12-29

申请人： INTEL Corporation

发明人： PIETAMBARAM, Srinivas ,  MAY, Robert Alan ,  DARMAWIKARTA, Kristof ,  TANAKA, Hiroki ,  MANEPALLI, Rahul N. ,  BOYAPATI, Sri Ranga Sai

IPC分类号： H01L25/07 ,  H01L25/065 ,  H01L23/538 ,  H01L23/498 ,  H01L23/485

公开(公告)号：EP4399554A1

公开(公告)日：2024-07-17

申请号：EP22867875.1

申请日：2022-08-10

申请人： INTEL Corporation

发明人： TANAKA, Hiroki ,  MARIN, Brandon C. ,  DARMAWIKARTA, Kristof ,  PIETAMBARAM, Srinivas Venkata Ramanuja ,  ECTON, Jeremy D. ,  MAHALINGAM, Hari ,  DUONG, Benjamin

IPC分类号： G02B6/12

CPC分类号： G02F1/035

公开(公告)号：EP4202963A1

公开(公告)日：2023-06-28

申请号：EP22201860.8

申请日：2022-10-17

申请人： INTEL Corporation

发明人： ALEKSOV, Aleksandar ,  TANAKA, Hiroki ,  DARMAWIKARTA, Kristof

IPC分类号： H01G4/38 ,  H01L21/302 ,  H01L21/3213 ,  H01L21/768 ,  H01L27/02 ,  H01L29/66 ,  H01L29/94 ,  H01G4/012 ,  H01G4/33 ,  H01G4/248 ,  H01G4/40 ,  H01G4/228 ,  H01G4/08 ,  H01G4/10 ,  H01G4/12

摘要： Embodiments herein relate to systems, apparatuses, or processes directed to electrically coupled trench capacitors within a substrate. The substrate may be part of an interposer, such as a glass interposer, where the trench capacitors deliver a high capacitance density close to one or more dies that are attached to a surface of the substrate. Portions of the trench capacitor may be a thin film capacitor at a surface of the substrate. The trenches extend from a first side of the substrate toward a second side of the substrate opposite the first side. Other embodiments may be described and/or claimed.

公开(公告)号：EP4020039A1

公开(公告)日：2022-06-29

申请号：EP21197529.7

申请日：2021-09-17

申请人： INTEL Corporation

发明人： ALEKSOV, Aleksandar ,  MARIN, Brandon ,  PIETAMBARAM, Srinivas ,  ZHANG, Zhichao ,  DUAN, Gang ,  ECTON, Jeremy ,  TANAKA, Hiroki ,  VADLAMANI, Sai ,  NIE, Bai ,  CHEN, Haobo

IPC分类号： G02B6/42

摘要： Embodiments disclosed herein include electronic packages and methods of forming such structures. In an embodiment, an electronic package comprises a package substrate, a first die over the package substrate, and a second die over the package substrate. In an embodiment, the electronic package further comprises an optical waveguide on the package substrate. In an embodiment, a first end of the optical waveguide is below the first die and a second end of the optical waveguide is below the second die. In an embodiment, the optical waveguide communicatively couples the first die to the second die.