公开(公告)号：EP3053250A1

公开(公告)日：2016-08-10

申请号：EP14850994.6

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： ABDELMONEUM, Mohamed A. ,  GWIN, Paul J. ,  MAHAMEED, Rashed ,  SPRENGER, Mark E.

IPC: H02J50/00 ,  H02J7/00

Abstract: Methods and systems may provide for detecting a location of an adjacent ultrasonic receiver of a battery powered device relative to a charging surface of a contactless charger. The charging surface may include an ultrasonic array of transmitter sub arrays, wherein one or more of the transmitter sub arrays may be selectively activated based on the location to focus an ultrasonic beam on the adjacent ultrasonic receiver. In one example, a movement of the adjacent ultrasonic receiver may be detected and the focus of the ultrasonic beam is adjusted in response to the movement.

Abstract translation: 方法和系统可以提供相对于非接触充电器的充电表面检测电池供电装置的相邻超声波接收器的位置。 充电表面可以包括发射器子阵列的超声波阵列，其中可以基于将超声波束聚焦在相邻超声波接收器上的位置来选择性地激活发射机子阵列中的一个或多个。 在一个示例中，可以检测相邻的超声波接收器的移动，并且响应于该移动来调整超声波束的焦点。

公开(公告)号：EP3049997A2

公开(公告)日：2016-08-03

申请号：EP14868834.4

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： PANT, Mondira D. ,  ABDELMONEUM, Mohamed A. ,  KARNIK, Tanay ,  PISENTI, Stephen ,  POISNER, David I. ,  MAHAMEED, Rashed

IPC: G06K9/00 ,  G06F21/32

CPC classification number: G01N29/265 ,  G01N2291/106 ,  G06F21/32 ,  G06F2221/2111 ,  G06K9/0002 ,  Y10T29/49005

Abstract: Methods and systems may provide for a system having a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array. The processor may identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile. In one example, the external component includes a button having a function that is separate from identification of the fingerprint.

Abstract translation: 方法和系统可以提供具有柔性衬底，耦合到柔性衬底的超声换能器阵列和耦合到超声换能器阵列的处理器的系统。 处理器可以基于来自超声换能器阵列的信号识别指纹。 该系统还可以包括具有弯曲轮廓的外部部件，其中超声换能器阵列嵌入在外部部件中并且包括符合弯曲轮廓的读取表面。 在一个示例中，外部组件包括具有与指纹的识别分离的功能的按钮。

公开(公告)号：EP3053250B1

公开(公告)日：2019-11-20

申请号：EP14850994.6

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： ABDELMONEUM, Mohamed A. ,  GWIN, Paul J. ,  MAHAMEED, Rashed ,  SPRENGER, Mark E.

IPC: H02J50/00 ,  H02J7/00

公开(公告)号：EP3036188B1

公开(公告)日：2019-07-17

申请号：EP13891862.8

申请日：2013-08-23

Applicant: Intel Corporation

Inventor： MAHAMEED, Rashed ,  DORSEY, Kristen, L. ,  M M ABDELMEJEED, Mamdouh, O. ,  ABDELMONEUM, Mohamed, A.

IPC: B81B7/00 ,  B81C1/00 ,  G01C19/56 ,  G01P15/14 ,  G01P15/125 ,  G01P15/08

公开(公告)号：EP3049997B1

公开(公告)日：2018-08-08

申请号：EP14868834.4

申请日：2014-09-26

Applicant: Intel Corporation

Inventor： PANT, Mondira D. ,  ABDELMONEUM, Mohamed A. ,  KARNIK, Tanay ,  PISENTI, Stephen ,  POISNER, David I. ,  MAHAMEED, Rashed

IPC: G06K9/00 ,  G06F21/32 ,  G01N29/265

CPC classification number: G01N29/265 ,  G01N2291/106 ,  G06F21/32 ,  G06F2221/2111 ,  G06K9/0002 ,  Y10T29/49005

Abstract: Methods and systems may provide for a system having a flexible substrate, an ultrasonic transducer array coupled to the flexible substrate and a processor coupled to the ultrasonic transducer array. The processor may identify a fingerprint based on a signal from the ultrasonic transducer array. The system may also include an external component having a curved profile, wherein the ultrasonic transducer array is embedded in the external component and includes a read surface that conforms to the curved profile. In one example, the external component includes a button having a function that is separate from identification of the fingerprint.

公开(公告)号：EP3036188A1

公开(公告)日：2016-06-29

申请号：EP13891862.8

申请日：2013-08-23

Applicant: Intel Corporation

Inventor： MAHAMEED, Rashed ,  DORSEY, Kristen, L. ,  M M ABDELMEJEED, Mamdouh, O. ,  ABDELMONEUM, Mohamed, A.

IPC: B81B7/00 ,  B81C1/00 ,  G01C19/56 ,  G01P15/14

CPC classification number: B81B3/0051 ,  B81B3/0021 ,  B81B7/008 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2203/0145 ,  B81C1/00166 ,  B81C1/00246 ,  B81C1/00531 ,  B81C2203/0714 ,  B81C2203/0742 ,  G01C19/5733 ,  G01P15/125 ,  G01P2015/0814

Abstract: A MEMS device, such as an accelerometer or gyroscope, fabricated in interconnect metallization compatible with a CMOS microelectronic device. In embodiments, a proof mass has a first body region utilizing a thick metal layer that is separated from a thin metal layer. The thick metal layer has a film thickness that is significantly greater than that of the thin metal layer for increased mass. The proof mass further includes a first sensing structure comprising the thin metal layer, but lacking the thick metal layer for small feature sizes and increased capacitive coupling to a surrounding frame that includes a second sensing structure comprising the thin metal layer, but also lacking the thick metal layer. In further embodiments, the frame is released and includes regions with the thick metal layer to better match film stress-induced static deflection of the proof mass.