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9 条记录 (耗时 0.011 秒)

    Circuit boards
    1.
    发明公开
    Circuit boards 失效
    Schaltungsplatten。

    公开(公告)号：EP0097814A2

    公开(公告)日：1984-01-11

    申请号：EP83105163.6

    申请日：1983-05-25

    申请人： International Business Machines Corporation

    发明人： Varker, Kenneth James

    IPC分类号： H05K7/06

    CPC分类号： H05K3/103 ,  H05K3/386 ,  H05K3/4641 ,  H05K7/06 ,  H05K2201/09309 ,  H05K2201/10287

    摘要： A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive sis cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable.
    As shown the board comprises two thick copper foils 20, 21, three epoxy resin pre-preg layers 22, 23, 24 and two cured adhesive layers 41, 42 in which wires are embedded.
    At each location where a connection is to be made to a wire, the wires has a non linear U-shaped portion. The increased dimensional stability plus U-shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board. Clearance holes 11 are formed in the copper layers 20, 21 and smaller holes 70 are drilled to register with the U-shaped portions of the wires and are through plated.

    摘要翻译： 描述了高密度尺寸稳定的封装电路板和制造这种板的方法。 使用可固化粘合剂将绝缘电线与衬底结合，其尺寸稳定性由相对厚的铜箔片保持。 由于粘合剂固化，并且由于当热，机械或化学循环时铜箔返回相同的尺寸，整个复合材料尺寸稳定。 如图所示，板包括两个厚铜箔20,21，三个环氧树脂预浸层22,23,24和两个固化的粘合剂层41,42，其中嵌入有导线。 在与导线连接的每个位置处，导线具有非线性的U形部分。 增加的尺寸稳定性加上电线的U形部分允许使用非常小的钻头连接到电路板。 结果是高密度稳定的电路板。 在铜层20,21中形成有间隙孔11，并且钻出较小的孔70以与线的U形部分对准并通过电镀。

    Method of eliminating short circuits in electrical circuitry
    3.
    发明公开
    Method of eliminating short circuits in electrical circuitry 失效
    Verfahren zum Beseitigen vonKurzschlüssen在einer elektrischen Schaltung。

    公开(公告)号：EP0169456A2

    公开(公告)日：1986-01-29

    申请号：EP85108698.3

    申请日：1985-07-12

    申请人： International Business Machines Corporation

    发明人： Solomon, Joseph Michael ,  Varker, Kenneth James

    IPC分类号： H05K3/22

    CPC分类号： H05K3/0088 ,  H05K3/06 ,  H05K3/225 ,  H05K3/42 ,  H05K3/429 ,  H05K2203/0763 ,  H05K2203/1147 ,  H05K2203/175 ,  Y10S134/902

    摘要： Method and apparatus is disclosed for eliminating short circuits on electrical circuitry, the circuitry being interconnected by a thru hole (12) on a substantially planar electrical board (10). The electrical board has two major surfaces, upper and lower. A first gas and liquid transmission device (30-53) is connected to the board to introduce etching gas and liquid into the thru hole. The device comprises a part that is adapted to surround the thru hole and seal the periphery thereof on one surface of the board. A second gas and liquid transmission device (58-82, 92-104) is connected to the board to remove the etching gas and liquid from the thru hole. This second device comprises a part (58) that is adapted to surround the thru hole and seal the periphery thereof on the other surface of the board. A vacuum system (104) is used to force gas and liquid to move through the thru hole from the first transmission device to the second transmission device, thereby etching and/or cleaning material from the thru hole.
    In another embodiment of the present invention there are provided transmission devices comprising a plurality of parts (53, 58) that are adapted to surround a plurality of thru holes and seal the peripheries thereof on both surfaces of the board.

    摘要翻译： 公开了用于消除电路上的短路的方法和装置，该电路通过基本上平面的电路板（10）上的通孔（12）互连。 电路板有两个主表面，上下两个。 第一气体和液体传输装置（30-53）连接到板上以将蚀刻气体和液体引入通孔中。 该装置包括适于围绕通孔并将其周边密封在板的一个表面上的部分。 第二气体和液体传输装置（58-82,92-104）连接到板上以从通孔去除蚀刻气体和液体。 第二装置包括适于围绕通孔并将其周边密封在板的另一表面上的部分（58）。 使用真空系统（104）来迫使气体和液体从第一传动装置穿过通孔移动到第二传动装置，从而从通孔中蚀刻和/或清洁材料。 在本发明的另一实施例中，提供了包括多个部件（53,58）的传动装置，其适于围绕多个通孔并将其周边密封在板的两个表面上。

    Method and apparatus for eliminating short circuits on electrical circuitry
    6.
    发明公开
    Method and apparatus for eliminating short circuits on electrical circuitry 失效
    消除电路短路的方法和装置

    公开(公告)号：EP0169456A3

    公开(公告)日：1987-08-05

    申请号：EP85108698

    申请日：1985-07-12

    申请人： International Business Machines Corporation

    发明人： Solomon, Joseph Michael ,  Varker, Kenneth James

    IPC分类号： H05K03/22

    CPC分类号： H05K3/0088 ,  H05K3/06 ,  H05K3/225 ,  H05K3/42 ,  H05K3/429 ,  H05K2203/0763 ,  H05K2203/1147 ,  H05K2203/175 ,  Y10S134/902

    摘要： Method and apparatus is disclosed for eliminating short circuits on electrical circuitry, the circuitry being interconnected by a thru hole (12) on a substantially planar electrical board (10). The electrical board has two major surfaces, upper and lower. A first gas and liquid transmission device (30-53) is connected to the board to introduce etching gas and liquid into the thru hole. The device comprises a part that is adapted to surround the thru hole and seal the periphery thereof on one surface of the board. A second gas and liquid transmission device (58-82, 92-104) is connected to the board to remove the etching gas and liquid from the thru hole. This second device comprises a part (58) that is adapted to surround the thru hole and seal the periphery thereof on the other surface of the board. A vacuum system (104) is used to force gas and liquid to move through the thru hole from the first transmission device to the second transmission device, thereby etching and/or cleaning material from the thru hole. In another embodiment of the present invention there are provided transmission devices comprising a plurality of parts (53, 58) that are adapted to surround a plurality of thru holes and seal the peripheries thereof on both surfaces of the board.

    Circuit boards
    9.
    发明公开
    Circuit boards 失效
    电路板

    公开(公告)号：EP0097814A3

    公开(公告)日：1984-03-28

    申请号：EP83105163

    申请日：1983-05-25

    申请人： International Business Machines Corporation

    发明人： Varker, Kenneth James

    IPC分类号： H05K07/06

    CPC分类号： H05K3/103 ,  H05K3/386 ,  H05K3/4641 ,  H05K7/06 ,  H05K2201/09309 ,  H05K2201/10287

    摘要： A high density dimensionally stable encapsulated circuit board and a method of making such a board is described. A curable adhesive is utilized to bond insulated wires to a substrate, the dimensional stability of which is maintained by a sheet of relatively thick copper foil. Since the adhesive sis cured and since the copper foil returns to the same dimensions when thermally, mechanically or chemically cycled, the entire composite is dimensionally stable. As shown the board comprises two thick copper foils 20, 21, three epoxy resin pre-preg layers 22, 23, 24 and two cured adhesive layers 41, 42 in which wires are embedded. At each location where a connection is to be made to a wire, the wires has a non linear U-shaped portion. The increased dimensional stability plus U-shaped portion of the wires allows connections to be made to the board utilizing a very small drill. The result is a high density stable circuit board. Clearance holes 11 are formed in the copper layers 20, 21 and smaller holes 70 are drilled to register with the U-shaped portions of the wires and are through plated.

    摘要翻译： 描述了高密度尺寸稳定的封装电路板和制造这种电路板的方法。 利用可固化粘合剂将绝缘线粘合到基底上，其尺寸稳定性由一片相对较厚的铜箔保持。 由于粘合剂被固化并且由于在热，机械或化学循环时铜箔返回到相同的尺寸，所以整个复合材料尺寸稳定。 如图所示，该板包括两个厚铜箔20,21，三个环氧树脂预浸渍层22,23,24和两个固化粘合剂层41,42，其中嵌入了电线。 在要与导线连接的每个位置处，导线具有非线性的U形部分。 增加的尺寸稳定性加上导线的U形部分允许利用非常小的钻头对板进行连接。 其结果是高密度稳定的电路板。 在铜层20,21中形成间隙孔11，并且钻出较小的孔70以与导线的U形部分对准并通过电镀。