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1.发明授权POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY 有权多孔SPEISUNGS-和接地方面来减少板等分层和可靠性提高
公开(公告)号：EP1190608B1
公开(公告)日：2003-02-26
申请号：EP00912789.5
申请日：2000-03-23
发明人： JAPP, Robert , POLIKS, Mark
CPC分类号： H05K3/38 , H05K3/429 , H05K3/4641 , H05K2201/0116 , H05K2201/0281 , H05K2201/029 , H05K2201/0769 , H05K2201/09309 , H05K2201/09681 , H05K2203/1131 , Y10S428/901 , Y10T29/49002 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1052 , Y10T428/24273 , Y10T428/24917
摘要： Power and ground planes (203, 205) that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows liquids (e.g., water and/or other solvents) to pass through the power and ground planes (202, 205), thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets (202, 205) porous by forming an array of holes (220) in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes (220) is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.
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2.发明公开POROUS POWER AND GROUND PLANES FOR REDUCED PCB DELAMINATION AND BETTER RELIABILITY 有权多孔SPEISUNGS-和接地方面来减少板等分层和可靠性提高
公开(公告)号：EP1190608A1
公开(公告)日：2002-03-27
申请号：EP00912789.5
申请日：2000-03-23
发明人： JAPP, Robert , POLIKS, Mark
CPC分类号： H05K3/38 , H05K3/429 , H05K3/4641 , H05K2201/0116 , H05K2201/0281 , H05K2201/029 , H05K2201/0769 , H05K2201/09309 , H05K2201/09681 , H05K2203/1131 , Y10S428/901 , Y10T29/49002 , Y10T29/49126 , Y10T29/49155 , Y10T29/49165 , Y10T156/1052 , Y10T428/24273 , Y10T428/24917
摘要： Power and ground planes (203, 205) that are used in Printed Circuit Boards (PCBs) and that comprise porous, conductive materials are disclosed. Using porous power and ground plane materials in PCBs allows liquids (e.g., water and/or other solvents) to pass through the power and ground planes (202, 205), thus decreasing failures in PCBs (or PCBs used as laminate chip carriers) caused by cathodic/anodic filament growth and delamination of insulators. Porous conductive materials suitable for use in PCBs may be formed by using metal-coated organic cloths (such as polyester or liquid crystal polymers) or fabrics (such as those made from carbon/graphite or glass fibers), using metal wire mesh instead of metal sheets, using sintered metal, or making metal sheets (202, 205) porous by forming an array of holes (220) in the metal sheets. Fabrics and mesh may be woven or random. If an array of holes (220) is formed in a metal sheet, such an array may be formed with no additional processing steps than are performed using conventional PCB assembly methods.
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