公开(公告)号：EP3256627A1

公开(公告)日：2017-12-20

申请号：EP16708267.6

申请日：2016-02-12

Applicant: Apple Inc.

Inventor： PODHAJNY, Daniel A. ,  SUNSHINE, Daniel D. ,  CREWS, Kathryn P.

IPC: D03D15/00

CPC classification number: D03D15/00 ,  D02G3/441 ,  D10B2101/20 ,  D10B2401/16 ,  H05K1/0283 ,  H05K1/038 ,  H05K2201/0281

Abstract: Weaving equipment may include warp strand positioning equipment that positions warp strands and weft strand positioning equipment that inserts weft strands among the warp strands to form fabric. The fabric may include insulating strands and conductive strands. Conductive strands may run orthogonal to each other and may cross at open circuit and short circuit intersections. The fabric may be formed using pairs of interwoven warp and weft strands. Conductive warp and weft strands may be interposed within the pairs of strands. The fabric may be a single layer fabric or may contain two or more layers. Stacked warp strands may be formed between pairs of adjacent insulating warp strands. The stacked warp strands may include insulating and conductive strands. Touch sensors and other components may include conductive structures that are formed from the conductive strands in the fabric.

公开(公告)号：EP2833369A4

公开(公告)日：2015-11-11

申请号：EP13769474

申请日：2013-03-13

Applicant: SUMITOMO RIKO CO LTD

Inventor： KOBAYASHI JUN ,  YAMASHITA YUSUKE ,  TAGUCHI YUTARO ,  YOSHIKAWA HITOSHI

IPC: H01B1/24 ,  C01B31/04 ,  C08K3/04 ,  C08L101/12 ,  H01B1/00 ,  H01B5/14 ,  H05K3/12 ,  H05K9/00

CPC classification number: H05K1/11 ,  C01B32/20 ,  C08K3/04 ,  C08K3/041 ,  C08K2201/001 ,  C08K2201/011 ,  C08L33/20 ,  H01B1/24 ,  H05K1/0283 ,  H05K1/095 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0281 ,  H05K2201/0314 ,  H05K2201/0323 ,  Y10T428/254 ,  C08L21/00

Abstract: Provided is a conductive film having a high conductivity in which electric resistance is less likely to increase, and a conductive composition for forming the same. The conductive composition includes an elastomer component, a fibrous carbon material having a fiber diameter of less than 30 nm, and a flake-like carbon material having a graphite structure, having an intensity ratio (G/D ratio) of a peak (G band) appearing in the vicinity of 1580 cm -1 to a peak (D band) appearing in the vicinity of 1330 cm -1 of Raman spectrum of not less than 1.8, and having a maximum length of not less than 150 nm and a thickness of not more than 100 nm. The conductive film is formed from the conductive composition.

公开(公告)号：EP2694712A1

公开(公告)日：2014-02-12

申请号：EP12718091.7

申请日：2012-03-23

Applicant: Sefar AG

Inventor： CHABRECEK, Peter ,  SONDEREGGER, Uriel

IPC: D03D1/00 ,  H01L51/52 ,  H01L51/44

CPC classification number: H05K1/0274 ,  D03D1/0088 ,  D10B2401/16 ,  H01L31/0224 ,  H01L33/38 ,  H01L51/0037 ,  H01L51/0096 ,  H01L51/0097 ,  H01L51/442 ,  H01L51/5203 ,  H01L51/56 ,  H01L2924/0002 ,  H05K1/038 ,  H05K1/095 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10106 ,  Y02E10/549 ,  Y02P70/521 ,  Y10T29/49155 ,  H01L2924/00

Abstract: The invention relates to an electrode substrate for an optoelectronic device, comprising a woven fabric (10) containing electrically conducting (14) and non-conducting (12) fibers and a coating (16) from a transparent, electrically non-conducting polymer material, the woven fabric being embedded in the coating such that sections (20; 22, 24) of the conducting fibers project from the non-conducting polymer material of the coating at least on one side of the coating, wherein the coating is provided with a transparent and electrically conducting conductive coating (26, 28) such that the projecting sections cooperate with the conductive coating, in particular engage and/or protrude in the conductive coating, to establish electrical contacts, wherein the conductive coating has a layer thickness that is smaller than a diameter, in particular a mean diameter, of the electrically conducting and electrically non-conducting fibers of the woven fabric.

公开(公告)号：EP2559022B1

公开(公告)日：2013-09-04

申请号：EP11730436.0

申请日：2011-04-11

Applicant: Koninklijke Philips Electronics N.V.

Inventor： VAN HERPEN, Maarten Marinus Johannes Wilhelmus ,  JOCHIJMS, Paul Antonius Emil ,  WILLEMSEN, Oscar Hendrikus

IPC: G09F13/22 ,  G09F9/33 ,  G09F21/02

CPC classification number: G09F13/22 ,  G09F9/33 ,  G09F21/02 ,  G09F2021/023 ,  H05K1/038 ,  H05K1/189 ,  H05K2201/0281

公开(公告)号：EP2441130A1

公开(公告)日：2012-04-18

申请号：EP09845680.9

申请日：2009-06-08

Applicant: Tex-Ray Industrial Co., Ltd. ,  King's Metal Fiber Technologies Co., Ltd.

Inventor： LEE, James ,  HUANG, Hong Hsu

IPC: H01R12/24 ,  G06F3/01 ,  H05K1/00 ,  G01L1/14

CPC classification number: G06F3/044 ,  G01D5/2405 ,  G06F2203/04111 ,  H05K1/038 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151

Abstract: A fabric connector for sensing object proximity is provided. The fabric connector comprises a sensing layer (23), an insulating layer (22) and a yarn (26). The sensing layer has at least one connection region (233a, 233b, 233c, 233d) and a disconnection region. The at least one connection region (233a, 233b, 233c, 233d) has a capacitance value and is formed with conductive fabric. The insulation layer (22) which is formed with insulating fabric is disposed below the sensing layer (23). The yarn (26) is formed with conductive material and is configured to electrically connect to the at least one connection region (233a, 233b, 233c, 233d) of the sensing layer (23) and a sensor (25). The sensor (25) senses a variation in the capacitance value of the at least one connection region (233a, 233b, 233c, 233d) in accordance with object proximity.

公开(公告)号：EP2030491B9

公开(公告)日：2012-02-22

申请号：EP07764352.6

申请日：2007-06-04

Applicant: Future-Shape GmbH

Inventor： LAUTERBACH, Christl ,  STEINHAGE, Axel

IPC: H01K1/00 ,  H03K17/96

CPC classification number: H03K17/962 ,  H03K2017/9602 ,  H03K2217/94094 ,  H03K2217/960755 ,  H05K1/0263 ,  H05K1/038 ,  H05K3/0058 ,  H05K3/321 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10151 ,  H05K2201/1034 ,  H05K2201/10386 ,  H05K2201/10727

Abstract: A textile layer arrangement has a first textile layer (1) and a second textile layer (13), wherein the second textile layer is formed on or above the first textile layer. The textile layer arrangement also has at least one electronic component (3) which is formed between the first textile layer and the second textile layer. The textile layer arrangement further has at least one power line (8), which is formed in at least one boundary region of the textile layer arrangement, for providing electrical power. The textile layer arrangement also has at least one supply line (7), which at least one supply line electrically couples the at least one electronic component to the at least one power line. The at least one power line is arranged at a distance from the at least one electronic component, and the at least one supply line is arranged at an angle with respect to the at least one power line.

公开(公告)号：EP2416840A1

公开(公告)日：2012-02-15

申请号：EP09792071.4

申请日：2009-08-28

Applicant: National Ict Australia Limited (NICTA)

Inventor： ROBINSON, David

IPC: A61N1/05 ,  A61N1/36 ,  A61N1/372

CPC classification number: A61N1/375 ,  A61B2562/125 ,  A61N1/0551 ,  A61N1/3605 ,  A61N1/37229 ,  H05K3/103 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/0308 ,  H05K2201/10287 ,  H05K2201/10598 ,  H05K2203/1189 ,  Y10T29/4913

Abstract: An active implantable medical device (AIMD) comprising an implantable electronics module and a tissue interface. At least one of the electronics module and the tissue interface comprises an electrically non-conductive, biocompatible and needle-piercable base having one or more biocompatible electrically conductive strands of conductive filaments stitched to the base. As used herein, stitching a conductive filament to a base refers to sewing, embroidering or otherwise securing the filament to the base through the use of hand or machine needlework.

公开(公告)号：EP2107642A3

公开(公告)日：2011-04-20

申请号：EP09004942.0

申请日：2009-04-03

Applicant: Amphenol-Tuchel Electronics GmbH

Inventor： Schewe, Eckhard ,  Ellsäßer, Uwe

IPC: H01R4/06

CPC classification number: H01R4/06 ,  H01R4/242 ,  H01R4/2495 ,  H01R4/58 ,  H01R12/62 ,  H01R12/675 ,  H01R12/68 ,  H05K1/00 ,  H05K1/038 ,  H05K3/365 ,  H05K2201/0281 ,  H05K2201/029 ,  H05K2201/10598 ,  H05K2203/1189

Abstract: Die Erfindung betrifft eine Verbindungsanordnung umfassend mindestens ein erstes flexibles und leitfähiges Halbzeug, wobei das leitfähige textile Halbzeug über gewellt angeordnete paarweise beabstandete Leitfäden in dem textilen Halbzeug verfügt, sowie mindestens ein Durchdringanpresselement zur Verbindung des ersten flexiblen leitfähigen Halbzeuges mit einem zweiten textilen leitfähigen Halbzeug oder einer Leiterplatte, wobei mindestens ein Durchdringanpresselement als mechanisches und gleichzeitig auch elektrisches Verbindungselement vorgesehen ist, zum mechanischen und elektrischen Verbinden der Leitfäden des ersten flexiblen und leitfähigen textilen Halbzeuges mit dem zweiten textilen leitfähigen Halbzeug oder der Leiterplatte.

公开(公告)号：EP2231803A1

公开(公告)日：2010-09-29

申请号：EP08861688.3

申请日：2008-12-04

Applicant: 3M Innovative Properties Company

Inventor： KROPP, Michael A., ,  ZENNER, Robert L.D.,

IPC: C09J9/02 ,  H05K3/32

CPC classification number: H05K3/321 ,  C08K3/36 ,  C08K9/02 ,  C08L2666/54 ,  C09J4/00 ,  C09J9/02 ,  C09J163/00 ,  H05K2201/0281 ,  Y10T428/31515

Abstract: A conductive adhesive precursor has polyepoxide, free-radically polymerizable (meth)acrylate, conductive fibers, conductive substantially spherical particles, thixotrope, photoinitiator, and thermal curative. The conductive adhesive precursor can be cured to form a conductive adhesive useful for bonding two substrates together.

公开(公告)号：EP2168748A1

公开(公告)日：2010-03-31

申请号：EP08165108.5

申请日：2008-09-25

Applicant: Hella Lighting Finland Oy

Inventor： Yllikäinen, Sami

IPC: B29C45/00 ,  B29C45/16 ,  F21V15/01 ,  F21V23/06 ,  F21V31/00 ,  H01R4/04

CPC classification number: H05K3/101 ,  B29C45/0013 ,  B29C45/0062 ,  B29C45/1643 ,  B29C45/1671 ,  B29C2045/1673 ,  B29K2995/0005 ,  B29L2031/747 ,  F21V15/01 ,  F21V31/04 ,  H05K1/0203 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0281 ,  H05K2201/09118 ,  H05K2201/10106 ,  H05K2203/0113

Abstract: The invention relates to a watertight lamp comprising a housing (7), a lens (8) attached watertight to the housing, an electric component unit (9) comprising a light source (21), and an outer connector (6) for connecting a power supply to the lamp. In order that the manufacturing method thereof be simple and quick, the outer connector (6) comprises conductive parts (4, 5) of electro conductive compound (30) comprising a polymer, said conductive parts providing an electro conductive path to the electric component unit (9, 9', 9"). The invention relates also to a manufacturing method of a watertight lamp. In the method the housing, the lens, electro conductive parts and the sealing are produced by injection moulding into the same mould.

Abstract translation: 本发明涉及一种水密灯，包括壳体（7），水密地附接到壳体的透镜（8），包括光源（21）的电气部件单元（9）和用于连接 电源给灯。 为了使其制造方法简单快捷，外部连接器（6）包括由聚合物构成的导电化合物（30）的导电部分（4,5），所述导电部件提供到电气部件单元的导电路径 （9,9'，9“）本发明还涉及一种防水灯的制造方法，在该方法中，通过注塑成型到同一模具中制造外壳，透镜，导电部件和密封件。