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1.发明授权HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS 有权密封MEMS器件与垂直集成电子元件的杰出PART
公开(公告)号：EP2727132B1
公开(公告)日：2016-02-03
申请号：EP12805169.5
申请日：2012-06-29
申请人： InvenSense, Inc.
发明人： SEEGER, Joseph , TCHERTKOV, Igor , AKYOL, Hasan , YARALIOGLU, Goksen, G. , NASIRI, Steven, S. , GURIN, Ilya
CPC分类号： B81B7/02 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81C1/00246 , B81C2203/0771 , G01L1/144 , G01L1/148 , G01L5/0028 , G01L9/0072 , G01L15/00 , G01L19/0092 , G01L19/0636 , G01L19/148 , G01L27/007
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2.发明公开HERMETICALLY SEALED MEMS DEVICE WITH A PORTION EXPOSED TO THE ENVIRONMENT WITH VERTICALLY INTEGRATED ELECTRONICS 有权密封MEMS器件与垂直集成电子元件的杰出PART
公开(公告)号：EP2727132A1
公开(公告)日：2014-05-07
申请号：EP12805169.5
申请日：2012-06-29
申请人： InvenSense, Inc.
发明人： SEEGER, Joseph , TCHERTKOV, Igor , AKYOL, Hasan , YARALIOGLU, Goksen, G. , NASIRI, Steven, S. , GURIN, Ilya
CPC分类号： B81B7/02 , B81B2201/025 , B81B2201/0264 , B81B2203/0127 , B81C1/00246 , B81C2203/0771 , G01L1/144 , G01L1/148 , G01L5/0028 , G01L9/0072 , G01L15/00 , G01L19/0092 , G01L19/0636 , G01L19/148 , G01L27/007
摘要： A system and method for providing a MEMS device with integrated electronics are disclosed. The MEMS device comprises an integrated circuit substrate and a MEMS subassembly coupled to the integrated circuit substrate. The integrated circuit substrate includes at least one circuit coupled to at least one fixed electrode. The MEMS subassembly includes at least one standoff formed by a lithographic process, a flexible plate with a top surface and a bottom surface, and a MEMS electrode coupled to the flexible plate and electrically coupled to the at least one standoff. A force acting on the flexible plate causes a change in a gap between the MEMS electrode and the at least one fixed electrode.
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