公开(公告)号：EP3159669A1

公开(公告)日：2017-04-26

申请号：EP16189745.9

申请日：2016-09-20

Applicant: NXP USA, Inc.

Inventor： Liu, Lianjun ,  Monk, David

IPC: G01L19/00 ,  B81C1/00

CPC classification number: B81B7/007 ,  B81B2201/025 ,  B81C1/00301 ,  B81C1/00817 ,  G01L9/0042 ,  G01L9/0073 ,  H01L43/02 ,  H01L43/12

Abstract: In some embodiments a method of manufacturing a sensor system can comprise forming a first structure having a substrate layer (28) and a first sensor (30,32,34) that is positioned on a first side of the substrate layer, bonding a cap structure (24) over the first sensor on the first side of the substrate layer, and depositing a first dielectric layer (131) over the cap structure. After bonding the cap structure and depositing the first dielectric layer, a second sensor (124,126,128) is fabricated on the first dielectric layer. The second sensor includes material that would be adversely affected at a temperature that is used to bond the cap structure to the first side of the substrate layer.

Abstract translation: 在一些实施例中，制造传感器系统的方法可包括形成具有衬底层（28）和位于衬底层的第一侧上的第一传感器（30,32,34）的第一结构，将帽结构 （24）在所述衬底层的所述第一侧上的所述第一传感器上，并且在所述帽结构上方沉积第一电介质层（131）。 在结合帽结构并沉积第一介电层之后，在第一介电层上制造第二传感器（124,126,128）。 第二传感器包括在用于将帽结构粘合到基底层的第一侧的温度下会受到不利影响的材料。

公开(公告)号：EP1657553B1

公开(公告)日：2016-08-31

申请号：EP06001027.9

申请日：2000-04-14

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Oguchi, Takahiro, (A170) Intell., Prop., Dept.

IPC: G01P15/08

CPC classification number: G01C19/5719 ,  B81B2201/025 ,  B81C1/00579 ,  B81C1/00587 ,  B81C2201/0132 ,  B81C2201/014 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  Y10S148/012 ,  Y10S148/135 ,  Y10S148/159

公开(公告)号：EP2727132B1

公开(公告)日：2016-02-03

申请号：EP12805169.5

申请日：2012-06-29

Applicant: InvenSense, Inc.

Inventor： SEEGER, Joseph ,  TCHERTKOV, Igor ,  AKYOL, Hasan ,  YARALIOGLU, Goksen, G. ,  NASIRI, Steven, S. ,  GURIN, Ilya

IPC: H01L21/00 ,  G01F1/20

CPC classification number: B81B7/02 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00246 ,  B81C2203/0771 ,  G01L1/144 ,  G01L1/148 ,  G01L5/0028 ,  G01L9/0072 ,  G01L15/00 ,  G01L19/0092 ,  G01L19/0636 ,  G01L19/148 ,  G01L27/007

公开(公告)号：EP2455331B1

公开(公告)日：2014-06-18

申请号：EP11190203.7

申请日：2011-11-22

Applicant: Honeywell International, Inc.

Inventor： Horning, Robert D. ,  Supino, Ryan

IPC: H01L21/768 ,  H01L25/065

CPC classification number: H01L29/84 ,  B81B7/0032 ,  B81B7/0038 ,  B81B7/0074 ,  B81B7/0077 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81C2201/019 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: Systems and methods for a micro-electromechanical system (MEMS) device are provided. In one embodiment, a system comprises a first outer layer and a first device layer comprising a first set of MEMS devices, wherein the first device layer is bonded to the first outer layer. The system also comprises a second outer layer and a second device layer comprising a second set of MEMS devices, wherein the second device layer is bonded to the second outer layer. Further, the system comprises a central layer having a first side and a second side opposite that of the first side, wherein the first side is bonded to the first device layer and the second side is bonded to the second device layer.

公开(公告)号：EP2455327A2

公开(公告)日：2012-05-23

申请号：EP11190200.3

申请日：2011-11-22

Applicant: Honeywell International, Inc.

Inventor： Horning, Robert D. ,  Supino, Ryan

IPC: B81B3/00

CPC classification number: B81B3/0086 ,  B81B2201/025 ,  B81B2203/0136 ,  Y10T29/49117

Abstract: A MEMS sensor comprises a substrate and at least one proof mass having a first plurality of combs. The proof mass is coupled to the substrate via one or more suspension beams such that the proof mass and the first plurality of combs are movable. The MEMS sensor also comprises at least one anchor having a second plurality of combs. The anchor is coupled to the substrate such that the anchor and second plurality of combs are fixed in position relative to the substrate. The first plurality of combs are interleaved with the second plurality of combs. Each of the combs comprises a plurality of conductive layers electrically isolated from each other by one or more non-conductive layers. Each conductive layer is individually coupled to a respective electric potential such that capacitance between the combs varies approximately linearly with displacement of the movable combs in an out-of-plane direction.

Abstract translation: MEMS传感器包括基板和至少一个具有第一多个梳子的检测质量块。 检测质量块经由一个或多个悬架梁耦合到基板，使得检验质量块和第一多个梳子可移动。 MEMS传感器还包括具有第二多个梳子的至少一个锚固件。 锚固件联接到基板，使得锚固件和第二多个梳子相对于基板固定在适当位置。 第一组多个梳子与第二组梳子交错。 每个梳子包括通过一个或多个非导电层彼此电隔离的多个导电层。 每个导电层单独地耦合到相应的电位，使得梳子之间的电容随着可移动梳齿在面外方向上的位移而近似线性地变化。

公开(公告)号：EP2048109A3

公开(公告)日：2011-05-25

申请号：EP08017806.4

申请日：2008-10-10

Applicant: Epson Toyocom Corporation

Inventor： Ono, Atsushi ,  Kobayashi, Yoshihiro ,  Kitamura, Shojiro ,  Matsunaga, Masayuki ,  Hara, Akitoshi

IPC: B81B7/00

CPC classification number: B81B7/007 ,  B81B7/0074 ,  B81B2201/025 ,  H01L24/97 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15156 ,  H01L2924/15313 ,  H01L2924/16195 ,  Y10T29/49155 ,  H01L2924/00014

Abstract: An electronic device includes: an outline configuration including a first surface, a second surface facing opposite from the first surface, and a mounting surface coupled to the first and second surfaces; a first substrate including a first electrode; a second substrate including a second electrode; a resin disposed between the first and second substrates; and an electric element sealed with the resin and having an outline configuration of a polyhedron, the electric element being disposed such that a broadest surface of the polyhedron faces one of the first substrate and the second substrate. The first surface is one surface of the first substrate, the one surface being opposite from another surface of the first substrate on a side adjacent to the resin. The second surface is one surface of the second substrate, the one surface being opposite from another surface of the second substrate on a side adjacent to the resin. The mounting surface includes: an exposed surface of the resin between the first and second substrates, and side surfaces of the first and second substrates adjacent to the exposed surface. The first electrode is disposed at an end of the first surface adjacent to the mounting surface and electrically coupled to the electric element. The second electrode is disposed at an end of the second surface adjacent to the mounting surface and electrically coupled to the electric element.

公开(公告)号：EP2187168A1

公开(公告)日：2010-05-19

申请号：EP08790513.9

申请日：2008-08-29

Applicant: Panasonic Corporation

Inventor： OHKOSHI, Hideo ,  MITANI, Tomohiro

IPC: G01C19/56 ,  G01P9/04 ,  G01P15/08

CPC classification number: G01P1/003 ,  B81B7/0058 ,  B81B2201/025 ,  B81C1/0023 ,  G01C19/5607 ,  G01P1/023 ,  H01L2224/48091 ,  H01L2924/00014

Abstract: An inertial sensor includes oscillating-type angular velocity sensing element (32), IC (34) for processing signals supplied from angular velocity sensing element (32), capacitor (36) for processing signals, and package (38) for accommodating angular velocity sensing element (32), IC (34), capacitor (36). Element (32) and IC (34) are housed in package (38) via a vibration isolator, which is formed of TAB tape (46), plate (40) on which IC (34) is placed, where angular velocity sensing element (32) is layered on IC (34), and outer frame (44) placed outside and separately from plate (40) and yet coupled to plate (40) via wiring pattern (42).

Abstract translation: 惯性传感器包括振荡型角速度传感元件（32），用于处理从角速度传感元件（32）提供的信号的IC（34），用于处理信号的电容器（36）以及用于适应角速度传感的封装（38） 元件（32），IC（34），电容器（36）。 元件（32）和IC（34）通过隔振器容纳在封装（38）中，该隔振器由其上放置有IC（34）的TAB带（46），板（40）形成，其中角速度感测元件 32）层叠在IC（34）上，外框架（44）放置在外部并与板（40）分开，并通过布线图形（42）与平板（40）连接。

公开(公告)号：EP1953816A1

公开(公告)日：2008-08-06

申请号：EP06833259.2

申请日：2006-11-24

Applicant: MATSUSHITA ELECTRIC WORKS, LTD.

Inventor： OKUDO, Takafumi ,  SUZUKI, Yuji ,  TAKEGAWA, Yoshiyuki ,  BABA, Toru ,  GOTOU, Kouji ,  MIYAJIMA, Hisakazu ,  KATAOKA, Kazushi ,  SAIJO, Takashi

IPC: H01L23/02 ,  G01P9/04

CPC classification number: G01P15/0802 ,  B81B7/0051 ,  B81B7/0064 ,  B81B2201/025 ,  B81C2203/038 ,  G01C19/5719 ,  G01P1/023 ,  G01P15/125 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A sensor device having small variations in sensor characteristics and improved resistance to electrical noise is provided. This sensor device has a sensor unit, which is provided with a frame having an opening, a movable portion held in the opening to be movable relative to the frame, and a detecting portion for outputting an electric signal according to a positional displacement of the movable portion, and a package substrate made of a semiconductor material, and bonded to a surface of the sensor unit. The package substrate has an electrical insulating film on a surface facing the sensor unit. The package substrate is bonded to the sensor unit by forming a direct bonding between an activated surface of the electrical insulating film and an activated surface of the sensor unit at room temperature.

Abstract translation: 提供了一种传感器装置，传感器特性变化小，电噪声提高。 该传感器装置具有传感器单元，该传感器单元设置有具有开口的框架，保持在开口中的可移动部分可相对于框架移动;以及检测部分，用于根据可移动的位移位移输出电信号 部分，以及由半导体材料制成的封装衬底，并结合到传感器单元的表面。 封装基板在面向传感器单元的表面上具有电绝缘膜。 通过在室温下在电绝缘膜的活化表面和传感器单元的活化表面之间形成直接接合，将封装基板结合到传感器单元。

公开(公告)号：EP1721173B1

公开(公告)日：2008-05-07

申请号：EP04804166.9

申请日：2004-12-22

Applicant: ETH Zürich

Inventor： HIEROLD, Christopher ,  JUNGEN, Alain ,  STAMPFER, Christoph

IPC: G01P15/08 ,  G01P15/12 ,  G01L1/22

CPC classification number: B81B3/0021 ,  B81B2201/025 ,  B82Y15/00 ,  B82Y30/00 ,  G01L1/005 ,  G01P15/123 ,  Y10S977/724 ,  Y10S977/953 ,  Y10S977/956

Abstract: The resolution and the signal-to-noise ration of known force sensors as e.g. capacitive force sensors decrease when scaling them down. To solve this problem there is a solution presented by the usage of a nanostructure as e.g. a carbo nanotube, which is mechanically deformed by a force to be measured. The proposed force sensors comprises a support with two arms carrying the carbon nanotube. The main advantage of this force sensor is a very high sensitivity as the conductance of carbon nanotubes changes several orders of magnitude when a mechanical deformation arises.

公开(公告)号：EP1760039A2

公开(公告)日：2007-03-07

申请号：EP06076605.2

申请日：2006-08-21

Applicant: Delphi Technologies, Inc.

Inventor： Christenson, John C.

IPC: B81C5/00

CPC classification number: B81B7/0006 ,  B81B2201/025 ,  G01P15/0802 ,  G01P15/125

Abstract: A method for making a subsurface electrical contact (34) on a micro-electrical-mechanical-systems (MEMS) device (10). The contact (34) is formed by depositing a layer of polycrystalline silicon (34) onto a surface (16) within a cavity (20) buried under a device silicon layer (24). The polycrystalline silicon layer (34) is deposited in the cavity (20) through holes (30 and 32) etched through the device silicon (24) and reseals the cavity (20) during the polycrystalline silicon deposition step. The polycrystalline silicon layer (24) can then be masked and etched, or etched back to expose the device layer (24) of the micromachined device (10). Through the layer of polycrystalline silicon (34), a center hub (18) of the device (10) may be electrically contacted.

Abstract translation: 一种用于在微电子机械系统（MEMS）装置（10）上制造地下电接触（34）的方法。 通过将多晶硅层（34）沉积在掩埋在器件硅层（24）下面的空腔（20）内的表面（16）上来形成触点（34）。 多晶硅层（34）通过穿过器件硅（24）蚀刻的孔（30和32）沉积在空腔（20）中，并且在多晶硅沉积步骤期间重新密封空腔（20）。 然后可以对多晶硅层（24）进行掩模和蚀刻，或者回蚀刻以暴露微机械加工装置（10）的装置层（24）。 通过多晶硅层34，可以使器件（10）的中心毂（18）电接触。