摘要:
A composition for forming an aluminum film, comprising a complex represented by the following formula (1) and a complex represented by the following formula (2), the molar ratio of the complex represented by the following formula (1) and the complex represented by the following formula (2) being 40:60 to 85:15: AlH 3 ⋅ NR 1 R 2 R 3 AlH 3 ⋅ NR 1 R 2 R 3 2 (in the above formulas (1) and (2), R 1 , R 2 and R 3 are each independently a hydrogen atom, alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group or aralkyl group.) .
摘要翻译:一种用于形成在铝上的电影,包括由下式表示的复合物(1)和由下式表示的配合物(2),由下式表示的配合物的摩尔比(1),并通过所示的络合物组合物 下述式(2)是40:60〜85:15:3的AlH <¢NR 1 R 2 R 3 3的AlH¢<¢NR 1个R 2 R 3¢2((在上述式1) 和(2)中,R 1,R 2和R 3各自独立地为氢原子,烷基,环烷基,烯基,炔基,芳基或芳烷基。)。
摘要:
A silicone resin which is represented by the following rational formula (1) and solid at 120°C:
(H 2 SiO) n (HSiO 1.5 ) m (SiO 2 ) k (1)
wherein n, m and k are each a number, with the proviso that, when n+m+k=1, n is not less than 0.5, m is more than 0 and not more than 0.95 and k is 0 to 0.2. The silicone resin of the present invention can be advantageously used in a composition for forming a trench isolation having a high aspect ratio.
摘要翻译:由以下合理式(1)表示的有机硅树脂和120℃下的固体:€ƒ€ƒ€ƒ€ƒ€ƒ€(ƒƒƒƒ€ƒ€ 2)k€ƒ€ƒ€ƒ€ƒ(1)其中n,m和k各自为数,条件是当n + m + k = 1时,n不小于0.5,m为 大于0且不大于0.95,k为0至0.2。 本发明的有机硅树脂可以有利地用于形成具有高纵横比的沟槽隔离的组合物中。
摘要:
A method of forming a metal film, comprising the steps of: sublimating at least one metal compound selected from the group consisting of a cobalt compound, a ruthenium compound and a tungsten compound from a substrate having the above metal compound film formed thereon; and supplying the sublimated gas to a substrate for forming a metal film to decompose the gas, thereby forming a metal film on the surface of the first substrate. A method of forming a metal film which serves as a seed layer when a metal, especially copper is to be filled into the trenches of a substrate as an insulator by plating and as a barrier layer for preventing the migration of metal atoms to an insulating film when the substrate has no barrier layer and has excellent adhesion to the insulator.