COMPOSITION FOR FORMING ALUMINUM FILM AND METHOD FOR FORMING ALUMINUM FILM
    2.
    发明公开
    COMPOSITION FOR FORMING ALUMINUM FILM AND METHOD FOR FORMING ALUMINUM FILM 审中-公开
    成分用于形成铝层和方法形成的铝膜

    公开(公告)号:EP2226368A1

    公开(公告)日:2010-09-08

    申请号:EP08865378.7

    申请日:2008-12-24

    申请人: JSR Corporation

    摘要: A composition for forming an aluminum film, comprising a complex represented by the following formula (1) and a complex represented by the following formula (2), the molar ratio of the complex represented by the following formula (1) and the complex represented by the following formula (2) being 40:60 to 85:15: AlH 3 ⋅ NR 1 ⁢ R 2 ⁢ R 3 AlH 3 ⋅ NR 1 ⁢ R 2 ⁢ R 3 2
    (in the above formulas (1) and (2), R 1 , R 2 and R 3 are each independently a hydrogen atom, alkyl group, cycloalkyl group, alkenyl group, alkynyl group, aryl group or aralkyl group.) .

    摘要翻译: 一种用于形成在铝上的电影,包括由下式表示的复合物(1)和由下式表示的配合物(2),由下式表示的配合物的摩尔比(1),并通过所示的络合物组合物 下述式(2)是40:60〜85:15:3的AlH <¢NR 1 R 2 R 3 3的AlH¢<¢NR 1个R 2 R 3¢2((在上述式1) 和(2)中,R 1,R 2和R 3各自独立地为氢原子,烷基,环烷基,烯基,炔基,芳基或芳烷基。)。

    METHOD OF FORMING METAL FILM
    4.
    发明公开
    METHOD OF FORMING METAL FILM 审中-公开
    VERFAHREN ZUR BILDUNG EINES METALLFILMS

    公开(公告)号:EP1995347A1

    公开(公告)日:2008-11-26

    申请号:EP06782219.7

    申请日:2006-07-27

    申请人: JSR Corporation

    IPC分类号: C23C16/18 H01L21/285

    摘要: A method of forming a metal film, comprising the steps of:
    sublimating at least one metal compound selected from the group consisting of a cobalt compound, a ruthenium compound and a tungsten compound from a substrate having the above metal compound film formed thereon; and
    supplying the sublimated gas to a substrate for forming a metal film to decompose the gas, thereby forming a metal film on the surface of the first substrate.
    A method of forming a metal film which serves as a seed layer when a metal, especially copper is to be filled into the trenches of a substrate as an insulator by plating and as a barrier layer for preventing the migration of metal atoms to an insulating film when the substrate has no barrier layer and has excellent adhesion to the insulator.

    摘要翻译: 一种形成金属膜的方法,包括以下步骤:从其上形成有上述金属化合物膜的基材升华至少一种选自钴化合物,钌化合物和钨化合物的金属化合物; 并且将升华的气体供给到用于形成金属膜的基板以分解气体,从而在第一基板的表面上形成金属膜。 当金属,特别是铜通过电镀被填充到作为绝缘体的基板的沟槽中时,形成用作种子层的金属膜的方法以及作为用于防止金属原子迁移到绝缘膜的阻挡层 当基板没有阻挡层并且对绝缘体具有优异的粘附性时。