COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL
    5.
    发明公开
    COPPER ALLOY FOIL, FLEXIBLE PRINTED WIRING BOARD OBTAINED USING SAME, AND PROCESS FOR PRODUCING COPPER ALLOY FOIL 有权
    合金铜箔,柔性印刷电路板组装体和方法生产铜合金箔

    公开(公告)号:EP2479298A1

    公开(公告)日:2012-07-25

    申请号:EP10815489.9

    申请日:2010-09-13

    摘要: The zirconium content of the alloy composition of a copper alloy foil 10 of the present invention is 3.0 to 7.0 atomic percent, and the copper alloy foil 10 includes copper matrix phases 30 and composite phases 20 composed of copper-zirconium compound phases 22 and copper phases 21. As shown in Fig. 1 , the copper matrix phases 30 and the composite phases 20 form a matrix phase-composite phase layered structure and are arranged alternately parallel to a rolling direction as viewed in a cross-section perpendicular to the width direction. In addition, the copper-zirconium compound phases 22 and the copper phases 21 in the composite phases 20 form a composite phase inner layered structure and are arranged alternately parallel to the rolling direction at a phase pitch of 50 nm or less as viewed in the above cross-section. This double layered structure presumably makes the copper alloy foil 10 densely layered to provide a strengthening mechanism similar to multilayer reinforced composite materials.

    摘要翻译: 的铜合金的合金组合物的锆含量贴膜本发明的图10是3.0〜7.0原子%,且该铜合金箔10包括铜母相30和铜 - 锆化合物相22和铜相的复合体相20 21.如在图1中,铜母相30和复合相20形成基体相复合相层状结构和交替排列平行于当在横截面垂直于该宽度方向观察的轧制方向。 此外,铜 - 锆化合物相22和铜相21的复合相20形成复合相内层状结构,交替排列平行于轧制方向上为50nm或更小的相沥青作为上方观察 横截面。 这种双层结构想必使铜合金箔10密集地层叠以提供类似于多层强化复合材料的加固机制。