摘要:
Through employment of a binder component, tin hydroxide powder serving as a conductive powder, and a high-refractive index powder; through dispersal of tin hydroxide powder and light-transmission-ensuring microparticles in a binder component at a predetermined ratio; and through employment of a specific binder component and, as a conductive powder, tin hydroxide powder and a conductive powder other than tin hydroxide powder at a predetermined ratio, there can be provided a composition which can form a transparent conductive film that exhibits excellent antistatic effect, and has very high visible light transmittance and provides transmitted images with natural hue by virtue of no color absorption wherein, if desired, the film also exhibits excellent scratch resistance and high antiglare effect, or the refractive index of the film can be controlled; such a transparent conductive film, and a display having such a transparent conductive film on a screen thereof.
摘要:
The invention provides a composition for forming transparent conductive film, characterized by including a binder component, and a conductive powder and a high-refractive index powder which are dispersed in the binder component, wherein the conductive powder is formed of tin hydroxide powder in an amount of 0.1 to 30 mass% and a conductive powder other than tin hydroxide powder in an amount of 70 to 99.9 mass%. The composition can form a transparent conductive film that exhibits remarkably excellent scratch resistance, excellent antistatic effect, and has very high visible light transmittance and which can impart a desired refractive index to the film. The invention also provides such a transparent conductive film and a display having such a transparent conductive film on a screen thereof.
摘要:
This metallic silicon is manufactured by refining molten crude metallic silicon by unidirectional solidification, and has a purity of 3N or more to 6N or less and an average crystal grain diameter of 1 mm or more. This method for manufacturing the metallic silicon includes: solidifying molten crude metallic silicon in a mold which contains fine silica particles in an inner peripheral layer thereof by unidirectional solidification at a rate of 1 mm/min or less; and then cooling to 200°C or below at a rate of 2°C/min or less.