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1.发明公开ELECTRONIC COMPONENT TERMINATION AND ASSEMBLY BY MEANS OF TRANSIENT LIQUID PHASE SINTERING AND POLYMER SOLDER PASTES 有权连接和安装过渡和液相的电子元件的POLYMERLÖTPASTEN
公开(公告)号：EP2577694A4
公开(公告)日：2014-07-02
申请号：EP11787439
申请日：2011-05-26
Applicant: KEMET ELECTRONICS CORP
Inventor： MCCONNELL JOHN E , BULTITUDE JOHN , PHILLIPS REGGIE , HILL ALLEN , RENNER GARRY L , LESSNER PHILIP M , CHACKO ANTONY P , BELL JEFFREY , BROWN KEITH
CPC classification number: H01G4/2325 , B23K1/0016 , B23K1/0053 , B23K1/008 , B23K1/203 , B23K35/0227 , B23K35/3613 , B23K2201/42 , H01G4/005 , H01G4/30 , H01L2224/83825 , H01L2924/01322 , H01L2924/01327 , H01L2924/10253 , H01L2924/1461 , Y10T29/435 , H01L2924/00012 , H01L2924/00015 , H01L2924/00
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