公开(公告)号：EP2791951A4

公开(公告)日：2015-11-11

申请号：EP12858253

申请日：2012-12-10

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  WEBSTER ALAN P ,  JONES LONNIE G ,  RENNER GARRY L ,  BELL JEFFREY

IPC: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/30

CPC classification number: H01G4/232 ,  H01G2/06 ,  H01G4/12 ,  H01G4/30 ,  H01G4/38 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10515 ,  H05K2201/10772 ,  H05K2201/10856 ,  H05K2201/10878 ,  Y02P70/613 ,  Y10T29/49139 ,  Y10T29/49142

Abstract: An improved passive electronic stacked component is described. The component has a stack of individual electronic capacitors and a first lead attached to a first side of the stack. A second lead is attached to a second side of the stack. A foot is attached to the first lead and extends inward towards the second lead. A stability pin is attached to one of the foot or the first lead.

公开(公告)号：EP2577694A4

公开(公告)日：2014-07-02

申请号：EP11787439

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/232 ,  H01G4/005 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00