-
1.发明公开Process for the manufacture of substrates to interconnect electronic components and articles made by said process 失效用于制造基板以互连电子元件和由制造工艺制成的制品的方法
公开(公告)号：EP0214628A3
公开(公告)日：1987-05-13
申请号：EP86112310
申请日：1986-09-05
Applicant: KOLLMORGEN TECHNOLOGIES CORPORATION
Inventor： Lassen, Charles L.
IPC: H05K07/06
CPC classification number: H05K7/06 , H05K1/112 , H05K3/103 , H05K3/4602 , H05K3/4641 , H05K3/4644 , H05K2201/09309 , H05K2201/09472 , H05K2201/09509 , H05K2201/10287
Abstract: An improved process for making substrates for mounting and interconnecting high density components comprising a substrate core and at least two printed circuit conductor networks and wire scribed conductor filaments wherein connection between selected conductors of the printed circuit networks are formed by providing cavities reaching from a conductor in one network to a conductor in another network and depositing conductive material covering the cavity wall and reaching from one to the other conductor; encapsulating the surface with a resin composition and providing its surface with wire scribed conductors; encapsulating the thus formed surface and,at predetermined locations, providing cavities reaching from the encapsulant surface to the respective wire scribed conductor; and applying a conductive metal layer to said cavity and the core of said wire scribed conductor thus forming an electrical connection from said conductor core to said surface of said encapsulant layer.
Search Results
1
records
(took 0.007 seconds)
