公开(公告)号：EP2981158A4

公开(公告)日：2017-01-18

申请号：EP14774851

申请日：2014-03-26

Applicant: KYOCERA CORP

Inventor： KAJITA SATOSHI ,  HAGIHARA MITSUHIRO ,  MATSUMOTO YUUHEI

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/0298 ,  H05K1/036 ,  H05K1/09 ,  H05K1/115 ,  H05K1/181 ,  H05K3/0038 ,  H05K3/421 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0116 ,  H05K2201/0195 ,  H05K2201/0209 ,  H05K2201/0266 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2201/09863 ,  H05K2201/2072

Abstract: A wiring board (3) in accordance with an embodiment of the invention includes: an inorganic insulating layer (13) having a via hole (V) formed so as to penetrate the inorganic insulating layer (13) in a thickness direction thereof; a conductive layer (11) disposed on the inorganic insulating layer (13); and a via conductor (12) which adheres to an inner wall (W) of the via hole (V) and is connected with the conductive layer (11). The inorganic insulating layer (13) includes a first section (33) including a plurality of inorganic insulating particles (16) partly connected to each other, and a resin portion (18) located in gaps (17) between the inorganic insulating particles (16), and a second section (34) which is interposed between the first section (33) and the via conductor (12), including a plurality of inorganic insulating particles (16) partly connected to each other, and a conducting portion (19) composed of part of the via conductor (12) which is located in gaps (17) between the inorganic insulating particles (16).