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公开(公告)号：EP3961332A1
公开(公告)日：2022-03-02
申请号：EP21196822.7
申请日：2017-11-03
发明人： KOO, Dae Sung , KIM, Yong , PARK, Ki Won
IPC分类号： G05B19/418 , G01N21/88 , G01N21/17
摘要： Disclosed are a method and a device for adjusting a quality determination conditions for a test body. The method for adjusting the quality determination conditions can include: a step for acquiring measurement values of the structures of a plurality of test bodies; a step for comparing error values of the measurement values with respect to design values of the structure with a prescribed reference value, and thereby determining for each of the plurality of test bodies, whether the test body is satisfactory or defective; a step for identifying one or more test bodies for which determination errors have occurred from among the plurality of test bodies; a step for generating and outputting a test result graph including the number of test bodies according to the error values, the reference value, and the number of the one or more test bodies for which the determination errors have occurred; a step for updating the reference value according to a graphical input on the test result graph so that the determination errors decrease; and a step for comparing the error values with the updated reference value and re-determining for each of the plurality of test bodies, whether the test body is satisfactory or defective.
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公开(公告)号：EP3735122A1
公开(公告)日：2020-11-04
申请号：EP18895879.7
申请日：2018-12-28
发明人： KOO, Dae Sung , LIM, Woo Young , KIM, Yong
摘要： A substrate inspection apparatus may include: a communication circuit; a plurality of light sources; an image sensor; at least one memory; and at least one processor. The processor may be configured to: generate insertion state information indicating an insertion state of each of a plurality of pins included in each of a plurality of first connectors by using the pattern light reflected from the pin tail of each of the plurality of pins ; detect at least one second connector having an insertion defect by using the insertion reference information and the insertion state information of each of the plurality of pins; generate a control signal for adjusting at least one first process parameter, based on insertion state information for the plurality of pins included in the at least one second connector; and control the communication circuit to transmit the control signal to the connector insertion apparatus.
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3.发明公开
公开(公告)号：EP3734299A1
公开(公告)日：2020-11-04
申请号：EP18896171.8
申请日：2018-12-28
发明人： KOO, Dae Sung , LIM, Woo Young , KIM, Yong
摘要： A substrate inspection apparatus may include a communication circuit, a plurality of light sources, an image sensor, at least one memory, and at least one processor. The processor may be configured to generate pin insertion state information indicating an insertion state of each of a plurality of first pins by using a pattern light reflected from each of the plurality of first pins, detect at least one second pin having an insertion defect from among the plurality of first pins by using at least one of the pin insertion reference information and the pin insertion state information of each of the plurality of first pins, generate a control signal for adjusting at least one first process parameter among a plurality of process parameters of the pin insertion apparatus, and control the communication circuit to transmit the control signal to the pin insertion apparatus.
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公开(公告)号：EP3582599A1
公开(公告)日：2019-12-18
申请号：EP18751183.7
申请日：2018-02-13
发明人： HAN, Seung Bum , PIEKNIEWSKI, Filip Lukasz , KOO, Dae Sung , LIM, Woo Young , KANG, Jin Man , PARK, Ki Won
摘要： An apparatus for inspecting components may include a processor for: determining exterior information of a first component mounted on a first printed circuit board; inspecting a mounting state of the first component by using inspection information of a second component having a first similarity value, when the first similarity value is higher than or equal to a preset reference similarity value, and updating the inspection information of the plurality of components by using the inspection information of the first component matched with the inspection information of the second component, when it is determined that the mounting state of the first component is good.
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