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1.发明公开SILICONE BASED REFLECTIVE UNDERFILL AND THERMAL COUPLER FOR FLIP CHIP LED 有权后梁在填补硅基和热耦合器FLIP-CHIP-LED
公开(公告)号：EP2497126A2
公开(公告)日：2012-09-12
申请号：EP10779582.5
申请日：2010-10-11
CPC分类号： H01L33/62 , H01L33/0079 , H01L33/382 , H01L33/60 , H01L33/641 , H01L33/642 , H01L33/647 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： In one embodiment, a flip chip LED is formed with a high density of gold posts extending from a bottom surface of its n-layer and p-layer. The gold posts are bonded to submount electrodes. An underfill material is then molded to fill the voids between the bottom of the LED and the submount. The underfill comprises a silicone molding compound base and about 70-80%, by weight, alumina (or other suitable material). Alumina has a thermal conductance that is about 25 times better than that of the typical silicone underfill, which is mostly silica. The alumina is a white powder. The underfill may also contain about 5-10%, by weight, TiO2 to increase the reflectivity. LED light is reflected upward by the reflective underfill, and the underfill efficiently conducts heat to the submount. The underfill also randomizes the light scattering, improving light extraction. The distributed gold posts and underfill support the LED layers during a growth substrate lift-off process.
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公开(公告)号：EP2462634A1
公开(公告)日：2012-06-13
申请号：EP10740008.7
申请日：2010-07-07
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/507 , H01L33/44 , H01L33/486 , H01L33/54 , H01L2224/16 , H01L2933/0041
摘要： A method for fabricating a light emitting device is described where an array of flip- chip light emitting diode (LED) dies are mounted on a submount wafer. Over each of the LED dies is simultaneously molded a hemispherical first silicone layer. A preformed flexible phosphor layer, comprising phosphor powder infused in silicone, is laminated over the first silicone layer to conform to the outer surface of the hemispherical first silicone layer. A silicone lens is then molded over the phosphor layer. By preforming the phosphor layer, the phosphor layer may be made to very tight tolerances and tested. By separating the phosphor layer from the LED die by a molded hemispherical silicone layer, color vs. viewing angle is constant, and the phosphor is not degraded by heat. The flexible phosphor layer may comprise a plurality of different phosphor layers and may comprise a reflector or other layers.
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公开(公告)号：EP2454764A1
公开(公告)日：2012-05-23
申请号：EP10732750.4
申请日：2010-06-22
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/60 , H01L33/507 , H01L2224/16225 , H01L2224/97 , H01L2924/181 , H01L2933/0091 , H01L2924/00012
摘要： An underfill formation technique for LEDs molds a reflective underfill material to encapsulate LED dies mounted on a submount wafer while forming a reflective layer of the underfill material over the submount wafer. The underfill material is then hardened, such as by curing. The cured underfill material over the top of the LED dies is removed using microbead blasting while leaving the reflective layer over the submount surface. The exposed growth substrate is then removed from all the LED dies, and a phosphor layer is molded over the exposed LED surface. A lens is then molded over the LEDs and over a portion of the reflective layer. The submount wafer is then singulated. The reflective layer increases the efficiency of the LED device by reducing light absorption by the submount without any additional processing steps.
摘要翻译： 用于LED的底部填充形成技术模制反射底部填充材料以封装安装在底座晶片上的LED管芯，同时在底座晶片上形成底部填充材料的反射层。 然后将底部填充材料硬化，例如通过固化。 使用微珠喷射除去在LED管芯顶部的固化的底部填充材料，同时将反射层留在底座表面上。 然后将曝光的生长衬底从所有的LED管芯移除，并且在暴露的LED表面上模制荧光体层。 然后将透镜模制在LED上并在反射层的一部分上方。 然后将底座晶片分割。 反射层通过减少副安装座的光吸收而没有任何额外的处理步骤来增加LED器件的效率。
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公开(公告)号：EP2537190A1
公开(公告)日：2012-12-26
申请号：EP11707915.2
申请日：2011-02-03
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/504 , B29C43/18 , H01L25/0753 , H01L33/005 , H01L33/0075 , H01L33/50 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
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公开(公告)号：EP2168178A1
公开(公告)日：2010-03-31
申请号：EP08776562.4
申请日：2008-07-03
IPC分类号： H01L33/00
CPC分类号： H01L33/0079 , H01L24/97 , H01L33/54 , H01L33/56 , H01L2224/05568 , H01L2224/05573 , H01L2224/13 , H01L2224/16225 , H01L2224/73204 , H01L2224/81001 , H01L2224/92125 , H01L2924/00014 , H01L2924/12041 , H01L2924/00 , H01L2224/05599
摘要： A light emitting diode (LED) is fabricated using an underfill layer that is deposited on either the LED or the submount prior to mounting the LED to a submount. The deposition of the underfill layer prior to mounting the LED to the submount provides for a more uniform and void free support, and increases underfill material options to permit improved thermal characteristics. The underfill layer may be used as support for the thin and brittle LED layers during the removal of the growth substrate prior to mounting the LED to the submount. Additionally, the underfill layer may be patterned to and/or polished back so that only the contact areas of the LED and/or submount are exposed. The patterns in the underfill may also be used as a guide to assist in the singulating of the devices.
摘要翻译： 在将LED安装到底座之前，使用底部填充层制造发光二极管（LED），其沉积在LED或者底座上。 在将LED安装到底座之前，底部填充层的沉积提供了更均匀和无空隙的支撑，并且增加了底部填充材料选项以允许改进的热特性。 在将LED安装到底座之前，底部填充层可以在移除生长衬底期间用作薄的和脆的LED层的支撑。 此外，底部填充层可以被图案化和/或抛光，使得只有LED和/或底座的接触区域被暴露。 底部填充物中的图案也可以用作辅助单元的设备的指导。
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公开(公告)号：EP2115789A2
公开(公告)日：2009-11-11
申请号：EP08719476.7
申请日：2008-02-26
发明人： MUELLER, Gerd , MUELLER-MACH, Regina , BASIN, Grigoriy , WEST, Robert Scott , MARTIN, Paul S. , LIM, Tze-Sen , EBERLE, Stefan
IPC分类号： H01L33/00
CPC分类号： H01L33/505 , B29C41/14 , B29C41/20 , B29C41/22 , B29K2995/0031 , B29L2011/00 , H01L24/97 , H01L25/167 , H01L33/504 , H01L33/54 , H01L33/56 , H01L2224/16225 , H01L2224/45139 , H01L2224/48091 , H01L2224/73204 , H01L2224/73265 , H01L2224/97 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01033 , H01L2924/01047 , H01L2924/01055 , H01L2924/01058 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2924/1815 , H01L2924/351 , H01L2933/0041 , H01L2924/00014 , H01L2224/81 , H01L2924/00 , H01L2924/01049 , H01L2924/00012
摘要： Overmolded lenses and certain fabrication techniques are described for LED structures. In one embodiment, thin YAG phosphor plates are formed and affixed over blue LEDs mounted on a submount wafer. A clear lens is then molded over each LED structure during a single molding process. The LEDs are then separated from the wafer. The molded lens may include red phosphor to generate a warmer white light. In another embodiment, the phosphor plates are first temporarily mounted on a backplate, and a lens containing a red phosphor is molded over the phosphor plates. The plates with overmolded lenses are removed from the backplate and affixed to the top of an energizing LED. A clear lens is then molded over each LED structure. The shape of the molded phosphor-loaded lenses may be designed to improve the color vs. angle uniformity. Multiple dies may be encapsulated by a single lens. In another embodiment, a prefabricated collimating lens is glued to the flat top of an overmolded lens.
摘要翻译： LED结构描述了包覆成型的透镜和某些制造技术。 在一个实施例中，薄的YAG磷光体板被形成并固定在安装在底座晶片上的蓝色LED上。 然后在单个模制过程中在每个LED结构上模制透明透镜。 然后将LED从晶片分离。 模制的透镜可以包括红色磷光体以产生较暖的白光。 在另一个实施例中，荧光板首先临时安装在背板上，并且在荧光体板上模制含有红色荧光体的透镜。 具有包覆成型透镜的板从背板上移除并固定在通电LED的顶部。 然后在每个LED结构上模制透明透镜。 模制的含磷光体的透镜的形状可以设计成改善颜色与角度均匀性。 多个管芯可以由单个透镜封装。 在另一个实施例中，将预制准直透镜胶合到包覆成型透镜的平坦顶部。
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公开(公告)号：EP2537190B1
公开(公告)日：2014-05-07
申请号：EP11707915.2
申请日：2011-02-03
发明人： BASIN, Grigoriy , MARTIN, Paul S.
CPC分类号： H01L33/504 , B29C43/18 , H01L25/0753 , H01L33/005 , H01L33/0075 , H01L33/50 , H01L33/56 , H01L33/58 , H01L2924/0002 , H01L2924/00
摘要： A flexible film comprising a wavelength converting material is positioned over a light source. The flexible film is conformed to a predetermined shape. In some embodiments, the light source is a light emitting diode mounted on a support substrate. The diode is aligned with an indentation in a mold such that the flexible film is disposed between the support substrate and the mold. Transparent molding material is disposed between the support substrate and the mold. The support substrate and the mold are pressed together to cause the molding material to fill the indentation. The flexible film conforms to the shape of the light source or the mold.
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