MULTI-LAYER STRUCTURE, PACKAGING MATERIAL AND PRODUCT THAT USE SAME, AND PROTECTIVE SHEET FOR ELECTRONIC DEVICES
    4.
    发明公开
    MULTI-LAYER STRUCTURE, PACKAGING MATERIAL AND PRODUCT THAT USE SAME, AND PROTECTIVE SHEET FOR ELECTRONIC DEVICES 审中-公开
    多层结构,包装材料及其使用的产品,以及用于电子设备的保护片

    公开(公告)号:EP3238935A1

    公开(公告)日:2017-11-01

    申请号:EP15872287.6

    申请日:2015-12-24

    申请人: Kuraray Co., Ltd.

    IPC分类号: B32B27/00 B65D65/40

    摘要: The present invention relates to a multilayer structure including a base (X) and a layer (Y) stacked on the base (X). The layer (Y) contains an aluminum-containing compound (A), an organic phosphorus compound (BO), and a polymer (F) having an ether bond and having no glycosidic bond.

    摘要翻译: 本发明涉及包括基底(X)和堆叠在基底(X)上的层(Y)的多层结构。 层(Y)含有含铝化合物(A),有机磷化合物(BO)和具有醚键且不具有糖苷键的聚合物(F)。