公开(公告)号：EP2774945B1

公开(公告)日：2016-12-28

申请号：EP12846753.7

申请日：2012-10-09

Applicant: Kuraray Co., Ltd.

Inventor： ONODERA, Minoru ,  SUNAMOTO, Tatsuya ,  MATSUNAGA, Shuji ,  KONNO, Takafumi

IPC: C08J5/18 ,  H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  B32B37/10

CPC classification number: H05K1/0313 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/286 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2250/42 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  C08J5/18 ,  C08J2300/12 ,  C08J2367/03 ,  C09K19/3809 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0326 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T428/31678

公开(公告)号：EP3893272A1

公开(公告)日：2021-10-13

申请号：EP19893905.0

申请日：2019-11-28

Applicant: Kuraray Co., Ltd.

Inventor： SUNAMOTO, Tatsuya ,  ONODERA, Minoru

IPC: H01L23/12 ,  H01L23/14 ,  H01L23/36 ,  H05K1/02 ,  H05K1/03 ,  H05K3/46

Abstract: Provided are a circuit board including an insulating layer including a thermoplastic liquid crystal polymer and having excellent insulation reliability under a high voltage; and a high voltage device using the same. The circuit board (30) is a high voltage circuit board including an insulating layer (31) and a high voltage circuit layer (34), wherein the insulating layer includes a thermoplastic liquid crystal polymer. It is preferable that the circuit board includes a heat dissipation part (39) for dissipating heat from the insulating layer (31).

公开(公告)号：EP3424703B1

公开(公告)日：2020-08-26

申请号：EP17760141.6

申请日：2017-03-02

Applicant: Kuraray Co., Ltd.

Inventor： HIRAMATSU, Shinji ,  NAKASHIMA, Takahiro ,  SUNAMOTO, Tatsuya ,  SUZUKI, Shigeaki

IPC: B32B15/08 ,  C25D5/56 ,  H05K3/00 ,  C23C28/02 ,  B32B15/088 ,  B32B15/09 ,  B32B15/04

公开(公告)号：EP2774945A1

公开(公告)日：2014-09-10

申请号：EP12846753.7

申请日：2012-10-09

Applicant: Kuraray Co., Ltd.

Inventor： ONODERA, Minoru ,  SUNAMOTO, Tatsuya ,  MATSUNAGA, Shuji ,  KONNO, Takafumi

IPC: C08J5/18 ,  H05K1/03 ,  H05K3/46 ,  B32B15/08 ,  B32B37/10

CPC classification number: H05K1/0313 ,  B32B15/08 ,  B32B15/09 ,  B32B15/20 ,  B32B27/20 ,  B32B27/286 ,  B32B27/32 ,  B32B27/322 ,  B32B27/34 ,  B32B27/36 ,  B32B37/06 ,  B32B37/10 ,  B32B37/182 ,  B32B2250/42 ,  B32B2305/55 ,  B32B2307/202 ,  B32B2309/02 ,  B32B2309/105 ,  B32B2457/00 ,  C08J5/18 ,  C08J2300/12 ,  C08J2367/03 ,  C09K19/3809 ,  H05K1/024 ,  H05K1/032 ,  H05K1/0326 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T428/31678

Abstract: To provide a thermoplastic liquid crystal polymer film capable of suppressing change in relative dielectric constant before and after heating, and a laminated and a circuit board using the same. In this film, a change ratio of a dielectric constant (ε r2 ) of the film after heating to a dielectric constant (ε r1 ) of the film before the heating satisfies the following formula (I) where the film is heated for 1 hour at a temperature in a range from a temperature being 30°C lower than a melting point of the film to a temperature being 10°C higher than the melting point,

where ε r1 denotes the relative dielectric constant before the heating, ε r2 denotes the relative dielectric constant after the heating. These relative dielectric constants are measured at the same frequency in a range of 1 to 100 GHz.

公开(公告)号：EP4071926A1

公开(公告)日：2022-10-12

申请号：EP20897408.9

申请日：2020-11-30

Applicant: Kuraray Co., Ltd.

Inventor： SUNAMOTO, Tatsuya ,  MIYAUCHI, Chikako ,  ISOUE, Koichiro

IPC: H01Q1/22 ,  H01Q1/32 ,  H01Q1/40

Abstract: Provided is an antenna system useful for communication using high-frequency waves. The antenna system (100) comprises a first glass layer (101) that transmits high-frequency waves; a low-dielectric layer (103) having a lower dielectric constant than that of the first glass layer (101), the low-dielectric layer disposed adjacent to the first glass layer (101) and transmitting the high-frequency waves entering through the first glass layer (101); and an antenna circuit board (107) disposed adjacent to the low-dielectric layer (103) and including a high-frequency insulation layer (105) that receives the high-frequency waves entering through the low-dielectric layer (103).

公开(公告)号：EP3604381A1

公开(公告)日：2020-02-05

申请号：EP18778136.4

申请日：2018-03-26

Applicant: Kuraray Co., Ltd.

Inventor： KONNO, Takafumi ,  SUNAMOTO, Tatsuya ,  NANBA, Michiyuki ,  HARA, Tetsuya

IPC: C08G63/60 ,  B32B7/02 ,  B32B15/08 ,  B32B15/09 ,  C08J5/18 ,  G01S7/03

Abstract: Provided are a thermoplastic polymer capable of reducing a dielectric dissipation factor in high frequency bands and a film thereof. The thermoplastic liquid crystal polymer includes repeating units represented by the following formulae (I), (II), (III) and (IV), in which a molar ratio of a total amount of the repeating units represented by formulae (I) and (II) to a total amount of all the repeating units in the thermoplastic liquid crystal polymer is 50 to 90 mol%, and a molar ratio of the repeating unit represented by formula (III) to the repeating unit represented by formula (IV) is the former/the latter = 23/77 to 77/23.

公开(公告)号：EP2661159A1

公开(公告)日：2013-11-06

申请号：EP11853488.2

申请日：2011-12-16

Applicant: Kuraray Co., Ltd.

Inventor： OHMORI, Kazuyuki ,  SUNAMOTO, Tatsuya

IPC: H05K3/28 ,  B29C43/32 ,  B29C65/02 ,  H05K3/00

CPC classification number: H05K1/0245 ,  B29C37/0075 ,  B29C43/18 ,  B29C43/203 ,  H05K1/0237 ,  H05K1/0242 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/281 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2203/068 ,  Y10T156/10

Abstract: Provided is a method of manufacturing a circuit board including preparing a board structural body (11) and covering a conductor circuit element (13) on an outermost layer of the board structural body (11) with a cover film (14), wherein a heat treatment is performed while having a release material (15) interposed between the cover film (14) and a heat-processing device. The release material (15) is a laminate at least including, sequentially from the cover film toward the heat-processing device, a low friction film (16) selected from an ultrahigh-molecular-weight polyethylene film and a polytetrafluoroethylene film, a first aluminum foil (17), a first high-density polyethylene film (18a), a second high-density polyethylene film (18b), and a second aluminum foil (19). The first high-density polyethylene film (18a) and the second high-density polyethylene film (18b) are positioned such that respective MD directions are perpendicular to each other.

Abstract translation: 本发明提供一种电路基板的制造方法，该电路基板的制造方法包括：准备基板构造体（11），用覆盖膜（14）覆盖基板构造体（11）的最外层的导体电路元件（13） 在具有介于覆盖膜（14）和热处理装置之间的剥离材料（15）的同时进行处理。 剥离材料（15）是至少从覆盖膜朝向热处理装置依次至少包含选自超高分子量聚乙烯膜和聚四氟乙烯膜的低摩擦膜（16），第一铝 （17），第一高密度聚乙烯薄膜（18a），第二高密度聚乙烯薄膜（18b）和第二铝箔（19）。 第一高密度聚乙烯膜（18a）和第二高密度聚乙烯膜（18b）被定位成使得各自的MD方向彼此垂直。

公开(公告)号：EP4468517A1

公开(公告)日：2024-11-27

申请号：EP23743255.4

申请日：2023-01-17

Applicant: Kuraray Co., Ltd.

Inventor： IKEDA, Keisuke ,  SUNAMOTO, Tatsuya ,  ONODERA, Minoru

IPC: H01Q1/40 ,  H01Q1/22 ,  H01Q1/32

Abstract: An antenna system to be used at a frequency of 1 GHz or higher, including: a laminate including a plurality of high-frequency permeable layers that are mutually in contact at interfaces and respectively transmit high-frequency wave, and an antenna circuit board including a high-frequency insulating layer, and disposed adjacent to an outermost high-frequency permeable layer of the laminate, the antenna circuit board receiving the high-frequency wave having been transmitted through the laminate, wherein n-th layer of the plurality of high-frequency permeable layers has a thickness Ln within a range of L nmin ± λ/(10√ε n ), where n is an integer of 1 or more, ε n denotes a relative dielectric constant of the n-th layer, λ denotes a wavelength of the high-frequency wave that is incident on the laminate, and L nmin denotes a thickness of the n-th layer where an intensity of a reflected wave from the laminate is minimized, the intensity being determined as an intensity of a composite wave of reflected waves from a front surface, a back surface, and joint interfaces of the laminate.

公开(公告)号：EP2832525A1

公开(公告)日：2015-02-04

申请号：EP13769770.2

申请日：2013-03-08

Applicant: Kuraray Co., Ltd.

Inventor： KONNO, Takafumi ,  SUNAMOTO, Tatsuya ,  ONODERA, Minoru ,  MATSUNAGA, Shuji ,  OHMORI, Kazuyuki

IPC: B29C55/02 ,  C08J5/18 ,  B29K67/00 ,  B29L7/00 ,  B29L9/00

CPC classification number: B29C35/02 ,  B29C55/005 ,  B29C55/12 ,  B29C55/143 ,  B29D7/01 ,  B29K2101/00 ,  B29K2105/0079 ,  B29L2007/00 ,  C08J5/18 ,  C08J2300/20 ,  C08J2300/22 ,  C08J2367/04 ,  C09K19/3809 ,  C09K2219/03

Abstract: A thermoplastic liquid polymer film and a method of producing the same are provided. The method includes preparing a thermoplastic liquid crystal polymer film that has dielectric constants of not larger than 3.25 both in an MD direction and in a TD direction; and performing drawing of the film while heating the film at a temperature in a range from a temperature (Td - 60°C) that is 60°C lower than a heat deformation temperature (Td) of the film to a temperature (Td - 5°C) that is 5°C lower than Td. The temperature of the heating during the drawing of the film may be in a range from a temperature (Td - 40°C) that is 40°C lower than a heat deformation temperature (Td) of the film subjected to the drawing to a temperature (Td - 10°C) that is 10°C lower than Td.

Abstract translation: 提供一种热塑性液态聚合物膜及其制造方法。 该方法包括在MD方向和TD方向上制备介电常数不大于3.25的热塑性液晶聚合物膜; 并且在从薄膜的温度（Td-60℃）低于薄膜的热变形温度（Td）的温度（Td）到温度（Td-5）的温度范围内的温度下，对薄膜进行拉伸， ℃），比Td低5℃。 在拉伸膜期间的加热温度可以在从经受拉伸的膜的热变形温度（Td）低40℃的温度（Td-40℃）到温度 （Td-10℃）比Td低10℃。