公开(公告)号：EP4442086A1

公开(公告)日：2024-10-09

申请号：EP23775450.2

申请日：2023-03-07

申请人： Thintronics, Inc.

发明人： AMLA, Tarun ,  PASTINE, Stefan, J.

IPC分类号： H05K1/03 ,  H05K1/18 ,  B32B15/08 ,  H05K3/46 ,  C08J5/24

CPC分类号： H05K1/0373 ,  H05K1/024 ,  H05K1/0298 ,  H05K2201/020920130101 ,  H05K2201/06820130101

公开(公告)号：EP1739105B1

公开(公告)日：2018-10-03

申请号：EP05728751.8

申请日：2005-04-04

申请人： DAIKIN INDUSTRIES, LTD.

发明人： NANBA, Yoshinori; ,  SAWADA, Yasuhiko; ,  KASAI, Shunji; ,  TAGASHIRA, Shuji; ,  ONO, Makoto; ,  TAIRA, Takahiro; ,  YOSHIMOTO, Hiroyuki;

IPC分类号： C08F214/26 ,  C08F2/00 ,  C08F2/38

CPC分类号： C08F214/26 ,  C08F14/26 ,  C08F214/262 ,  C08F259/08 ,  H05K1/024 ,  H05K1/0373 ,  H05K2201/015 ,  H05K2201/0212 ,  Y10T428/3154 ,  C08F2/00

摘要： The present invention provides a polytetrafluoroethylene powder having moldability/processability as well as electrical characteristics in microwave bands. The present invention is a modified polytetrafluoroethylene powder which has (1) a dielectric loss tangent at 12 GHz of not higher than 2.0 x 10 -4 and (2) a cylinder extrusion pressure of not higher than 45 MPa at a reduction ratio of 1600.

公开(公告)号：EP3338521A1

公开(公告)日：2018-06-27

申请号：EP16766113.1

申请日：2016-08-19

申请人： Corning Incorporated

发明人： GARNER, Sean Matthew ,  OWUSU, Samuel Odei ,  PIECH, Garrett Andrew ,  POLLARD, Scott Christopher

IPC分类号： H05K1/02 ,  H05K1/03 ,  H01L23/15 ,  C03C17/00 ,  B23K26/00 ,  C03B33/02 ,  C03C15/00 ,  B23K26/53 ,  H05K3/10 ,  H05K3/46

CPC分类号： H05K3/0029 ,  C03B33/0222 ,  C03C15/00 ,  C03C17/002 ,  C03C17/008 ,  C03C23/0025 ,  C03C23/007 ,  C03C2217/445 ,  C03C2217/70 ,  H01L21/4807 ,  H01L23/15 ,  H05K1/024 ,  H05K1/028 ,  H05K1/0306 ,  H05K1/036 ,  H05K1/115 ,  H05K3/002 ,  H05K3/107 ,  H05K3/388 ,  H05K3/4038 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/09509 ,  H05K2203/0143 ,  H05K2203/0743 ,  H05K2203/075 ,  H05K2203/0776 ,  H05K2203/0789 ,  H05K2203/107 ,  H05K2203/1194 ,  H05K2203/1545 ,  Y02P40/57

摘要： Methods of continuous fabrication of features in flexible substrates are disclosed. In one embodiment, a method of fabricating features in a substrate web includes providing the substrate web arranged in a first spool on a first spool assembly, advancing the substrate web from the first spool and through a laser processing assembly comprising a laser, and creating a plurality of defects within the substrate web using the laser. The method further includes advancing the substrate web through an etching assembly and etching the substrate web at the etching assembly to remove glass material at the plurality of defects, thereby forming a plurality of features in the substrate web. The method further includes rolling the substrate web into a final spool.

公开(公告)号：EP2916629B1

公开(公告)日：2018-06-06

申请号：EP14854898.5

申请日：2014-01-14

申请人： Meiko Electronics Co., Ltd.

发明人： ISHIKAWA, Akihiro ,  YAMAMOTO,Toru ,  INOKUCHI, Kazuya

IPC分类号： H05K3/28 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/028 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0278 ,  H05K1/0281 ,  H05K3/0044 ,  H05K3/282 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2203/0207 ,  H05K2203/0228

摘要： A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).

公开(公告)号：EP2688380B1

公开(公告)日：2017-12-20

申请号：EP11855247.0

申请日：2011-11-30

申请人： Kuang-chi Innovative Technology Ltd. ,  Kuang-Chi Institute of Advanced Technology

发明人： LIU, Ruopeng ,  XU, Guanxiong ,  JI, Chunlin ,  ZHAO, Zhiya ,  FANG, Nenghui ,  ZHANG, Yangyang ,  WANG, Wenjian ,  YUE, Yutao

IPC分类号： H05K9/00 ,  H01Q15/00 ,  H01Q17/00

CPC分类号： H01Q17/00 ,  H01Q15/006 ,  H01Q15/10 ,  H05K1/0236 ,  H05K1/024 ,  H05K9/0088

摘要： Embodiments of the present disclosure relate to an impedance matching component and a hybrid wave-absorbing material. The impedance matching component is disposed between a first medium and a second medium, and comprises a plurality of functional sheet layers. Impedances of the functional sheet layers vary continuously in a stacking direction of the functional sheet layers, with the impedance of a first one of the functional sheet layers being identical to that of the first medium and the impedance of a last one of the functional sheet layers being identical to that of the second medium. According to the impedance matching component and the hybrid wave-absorbing material of the present disclosure, the impedance matching component has a graded impedance, with an impedance value thereof at a side being identical to that of a first medium and an impedance value thereof at the other side being identical to that of a second medium. The continuous changes in the intermediate portion eliminate sudden transitions of the impedance between the first medium and the second medium. Thereby, the problems of partial reflection and energy loss of electromagnetic waves when propagating through an interface between different media are overcome. Furthermore, the hybrid wave-absorbing material of the present disclosure has improved wave-absorbing performances.

公开(公告)号：EP2973863B1

公开(公告)日：2017-12-06

申请号：EP14717966.7

申请日：2014-03-17

申请人： Flextronics AP LLC

发明人： SUORSA, Peter

IPC分类号： H01Q17/00

CPC分类号： H05K9/0088 ,  G02B2207/121 ,  H01Q17/00 ,  H01Q17/002 ,  H05K1/0233 ,  H05K1/0236 ,  H05K1/024 ,  H05K2201/083 ,  Y10T29/49018 ,  Y10T156/1002

摘要： A method and apparatus for producing a radio frequency absorbing (RFA) or perfect microwave absorbing (PMA) printed circuit board (PCB) is described herein. A metamaterial layer may be applied to a low dielectric substrate. Resistive and capacitive components may then be added to the metamaterial layer. The metamaterial layer may then be formed into an RFA or PMA PCB, which may comprise a multi-layered assembly for absorption of electromagnetic radiation in a targeted frequency range such as the microwave frequency range in the PCB.

公开(公告)号：EP3128604A1

公开(公告)日：2017-02-08

申请号：EP16185171.2

申请日：2014-07-01

申请人： Funai Electric Co., Ltd.

发明人： KODAMA, Shinichi

IPC分类号： H01P3/02 ,  H05K1/02 ,  H04B3/06 ,  H04B3/30 ,  H04L25/08

CPC分类号： H04B15/00 ,  H01P3/026 ,  H01P3/08 ,  H04B3/04 ,  H04B3/06 ,  H04B3/30 ,  H04L25/0272 ,  H04L25/085 ,  H04L27/34 ,  H04L27/36 ,  H04L27/38 ,  H04W88/02 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0245

摘要： A signal transmission method, comprising: sending, from a first electronic device, signal sender (2), to a second electronic device, signal receiver (4), a first and second transmission signals (S(+), S(-)) of mutually opposite phases via a first and second transmission paths (31, 32), wherein each amplitude of the first and second transmission signals is differentiated; and converting, with the second electronic device (4), the first and second transmission signals (S(+), S(-)) transmitted via the first and second transmission paths (31, 32) into an output signal (Sout) of a single phase based on an amplitude ratio of the first and second transmission signals. Electronic devices (2, 4) for implementing the method.

摘要翻译： 1。一种信号传输方法，其特征在于，包括：从第一电子设备向第二电子设备信号接收器发送第一传输信号S（+），第二传输信号S（ - ） 经由第一传输路径和第二传输路径（31,32）相互相反的相位，其中第一传输信号和第二传输信号的每个幅度被区分; 以及利用第二电子装置将经由第一和第二传输路径传输的第一和第二传输信号S（+），S（ - ）转换成输出信号（Sout）为 基于第一和第二传输信号的幅度比的单相。 用于实现该方法的电子设备（2,4）。

公开(公告)号：EP2840747B1

公开(公告)日：2016-12-21

申请号：EP14175295.6

申请日：2014-07-01

申请人： Funai Electric Co., Ltd.

发明人： Kodama, Shinichi

IPC分类号： H04B3/06 ,  H04B3/30 ,  H05K1/02 ,  H01P3/02

CPC分类号： H04B15/00 ,  H01P3/026 ,  H01P3/08 ,  H04B3/04 ,  H04B3/06 ,  H04B3/30 ,  H04L25/0272 ,  H04L25/085 ,  H04L27/34 ,  H04L27/36 ,  H04L27/38 ,  H04W88/02 ,  H05K1/0216 ,  H05K1/0218 ,  H05K1/024 ,  H05K1/0245

摘要： The invention concerns a signal transmission device 1 including a signal sender 2 that sends first and second transmission signals S(+), S(-) of mutually opposite phases, a first transmission path 31 over which the first transmission signal S(+) is transmitted, a second transmission path 32 over which the second transmission signal S(-) is transmitted, and a signal receiver that converts the first transmission signal received from the first transmission path and the second transmission signal received from the second transmission path into an output signal Sout of a single phase. The signal transmission device differentiates each amplitude of the first and second transmission signals sent from the signal sender, and the signal receiver, based on an amplitude ratio of the first and second transmission signals, converts the received first and second transmission signals.

公开(公告)号：EP2224794B1

公开(公告)日：2016-08-10

申请号：EP08870655.1

申请日：2008-12-10

申请人： Huawei Technologies Co., Ltd.

发明人： YANG, Ruiquan ,  SHENG, Haiqiang ,  LI, Hongcai

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/46

CPC分类号： H05K1/0243 ,  H05K1/021 ,  H05K1/024 ,  H05K1/025 ,  H05K1/03 ,  H05K1/036 ,  H05K1/11 ,  H05K1/182 ,  H05K3/0061 ,  H05K3/4688 ,  H05K2201/09745 ,  H05K2201/09845 ,  H05K2201/10416 ,  H05K2203/063

公开(公告)号：EP2916629A4

公开(公告)日：2016-07-13

申请号：EP14854898

申请日：2014-01-14

申请人： MEIKO ELECTRONICS CO LTD

发明人： ISHIKAWA AKIHIRO ,  YAMAMOTO TORU ,  INOKUCHI KAZUYA

IPC分类号： H05K3/28 ,  H05K1/02 ,  H05K3/46

CPC分类号： H05K1/028 ,  H05K1/024 ,  H05K1/025 ,  H05K1/0278 ,  H05K1/0281 ,  H05K3/0044 ,  H05K3/282 ,  H05K3/4652 ,  H05K3/4691 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2203/0207 ,  H05K2203/0228

摘要： A printed wiring board (10) includes: an inner layer structure body (20) containing at least an inner layer insulative base material (31) composed of a glass cloth (31a) and resin (31b) which covers the glass cloth (31a) and not containing a resin insulative base material composed only of resin; outer layer wiring (21) formed on a first face (20a) of the inner layer structure body (20); and a solder resist layer (23) formed on a surface of the outer layer wiring (21), wherein in the inner layer structure body (20), an opening part (11) is formed, and the solder resist layer (23) is composed of a first ink part (23a) covering at least the outer layer wiring (21) that is formed on a partial region of the first face (20a) which corresponds to the opening part (11) and a second ink part (23b) interposing both ends of the first ink part (23a) and being lower in flexibility than the first ink part (23a).

摘要翻译： 印刷电路板（10）包括：内层结构体（20），其至少包含由玻璃布（31a）构成的内层绝缘基材（31）和覆盖玻璃布（31a）的树脂（31b） 不含仅由树脂构成的树脂绝缘基材; 形成在所述内层结构体（20）的第一面（20a）上的外层布线（21） 以及形成在所述外层布线（21）的表面上的阻焊层（23），其中，在所述内层结构体（20）中形成有开口部（11），所述阻焊层（23）为 由形成在与开口部分（11）对应的第一面（20a）的部分区域上的至少覆盖外层布线（21）的第一墨水部分（23a）和第二墨水部分（23b）组成， 插入第一墨水部分（23a）的两端并且柔性比第一墨水部分（23a）低。