ORGANOPOLYSILOXANE
    7.
    发明公开
    ORGANOPOLYSILOXANE 审中-公开
    ORGANOPOLYSILOXAN

    公开(公告)号:EP2784104A1

    公开(公告)日:2014-10-01

    申请号:EP12851391.8

    申请日:2012-11-26

    申请人: LG Chem, Ltd.

    摘要: Provided is an organopolysiloxane and its use. The organopolysiloxane may exhibit excellent processibility and workability. In addition, when the organopolysiloxane is used as an encapsulant, it exhibits excellent light extraction efficiency, crack resistance, hardness, thermal and shock resistance and an adhesive property. Moreover, the organopolysiloxane may provide an encapsulant exhibiting stable durability and reliability under severe conditions for a long time and having no whitening and surface stickiness

    摘要翻译: 提供有机聚硅氧烷及其用途。 有机聚硅氧烷可以表现出优异的加工性和可加工性。 此外,当使用有机聚硅氧烷作为密封剂时,其显示出优异的光提取效率,抗裂纹性,硬度,耐热和抗冲击性以及粘合性。 此外,有机聚硅氧烷可以在苛刻条件下长时间提供具有稳定的耐久性和可靠性的密封剂,并且没有美白和表面粘性

    CURABLE COMPOSITION
    8.
    发明公开
    CURABLE COMPOSITION 有权
    HÄRTBAREZUSAMMENSETZUNG

    公开(公告)号:EP2662412A2

    公开(公告)日:2013-11-13

    申请号:EP12732111.5

    申请日:2012-01-06

    申请人: LG Chem, Ltd.

    摘要: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

    摘要翻译: 提供了可固化组合物及其用途。 示例性的可固化组合物可以显示出优异的加工性和可加工性。 此外,固化性组合物在固化前后可具有高折射率。 该组合物在固化前后的透湿性低,显示出优异的抗裂性,耐热冲击性,粘合性和硬度。 此外,该组合物在高温或高湿度条件下不引起变色,例如增白,并且在其表面上不显示粘性。 可固化组合物可以用作粘合剂材料或用作诸如LED,CCD,光电耦合器或光伏电池的半导体器件的封装材料。

    CURABLE COMPOSITION
    9.
    发明公开
    CURABLE COMPOSITION 审中-公开
    可固化组合物

    公开(公告)号:EP2662410A2

    公开(公告)日:2013-11-13

    申请号:EP12731982.0

    申请日:2012-01-06

    申请人: LG Chem, Ltd.

    摘要: A curable composition and use thereof are provided. The exemplary curable composition can show excellent processability and workability. Also, the curable composition can have a high refractive index before or after curing. The composition has low moisture permeability before or after curing and shows excellent crack resistance, thermal shock resistance, adhesive property and hardness. In addition, the composition does not cause color change such as whitening, under a high-temperature or high-humidity condition, and does not exhibit stickiness on a surface thereof. The curable composition may be used as an adhesive material or as an encapsulation material for semiconductor devices such as an LED, a CCD, a photo coupler, or a photovoltaic cell.

    摘要翻译: 提供可固化组合物及其用途。 示例性可固化组合物可显示优异的可加工性和可加工性。 而且,可固化组合物在固化之前或之后可以具有高折射率。 该组合物在固化之前或之后具有低透湿性并显示出优异的抗裂性,耐热冲击性,粘合性和硬度。 另外,该组合物在高温或高湿条件下不会引起变白如变白,并且在其表面上不显示发粘。 可固化组合物可以用作粘合材料或用作半导体器件例如LED,CCD,光耦合器或光伏电池的封装材料。