公开(公告)号：EP2656702A2

公开(公告)日：2013-10-30

申请号：EP11850595.7

申请日：2011-12-23

申请人： LG Innotek Co., Ltd.

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/202 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/098 ,  H05K2203/0323 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a center part having a first width and a contact part having a second width, the contact part makes contact with a surface of the core insulating layer, and the first width is larger than the second width. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 其中，所述过孔包括具有第一宽度的中心部分和具有第二宽度的接触部分，所述接触部分与所述芯绝缘层的表面接触，并且所述第一宽度大于所述第二宽度。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：EP2644010B1

公开(公告)日：2020-03-11

申请号：EP11852165.7

申请日：2011-12-23

申请人： LG Innotek Co., Ltd.

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

公开(公告)号：EP2644010A2

公开(公告)日：2013-10-02

申请号：EP11852165.7

申请日：2011-12-23

申请人： LG Innotek Co., Ltd.

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/46 ,  H05K3/4647 ,  H05K3/465 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0338 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer. The via includes a first part, a second part below the first part, and a third part between the first and second parts, and the third part includes a metal different from a metal of the first and second parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.

摘要翻译： 公开了一种印刷电路板及其制造方法。 印刷电路板包括核心绝缘层，穿过核心绝缘层形成的至少一个通孔，埋在核心绝缘层中的内部电路层以及位于核心绝缘层的顶表面或底表面上的外部电路层 。 通孔包括第一部分，在第一部分下方的第二部分以及在第一和第二部分之间的第三部分，并且第三部分包括与第一和第二部分的金属不同的金属。 内部电路层和通孔同时形成，使得处理步骤减少。 由于提供了奇数电路层，印刷电路板具有轻薄的结构。

公开(公告)号：EP2823696A1

公开(公告)日：2015-01-14

申请号：EP13757377.0

申请日：2013-02-25

申请人： LG Innotek Co., Ltd.

发明人： KIM, Ji Su ,  CHUN, Ki Do ,  LEE, Kyu Won ,  LEE, Sang Myung

IPC分类号： H05K3/46 ,  H05K1/18

CPC分类号： H05K3/4602 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/181 ,  H05K1/185 ,  H05K3/107 ,  H05K3/465 ,  H05K3/4697 ,  H05K2201/017 ,  H05K2201/0195 ,  H05K2201/20

摘要： Provided is a printed circuit board, including: a core substrate including an internal circuit pattern on an upper surface or a lower surface; electronic devices which are formed to pass through the core substrate; an external insulating layer which covers the internal circuit pattern and the electronic devices; and an external circuit pattern which is formed on an upper surface of the external insulating layer, wherein a lower surface of the electronic devices protrudes from the lower surface of the core substrate to a lower part. Accordingly, in the embedded printed circuit board in which the electronic devices are embedded, when the electronic devices are mounted, because the insulating layer is formed regardless of a thickness of the electronic devices, the printed circuit board having a desired thickness regardless of the thickness of the electronic devices can be formed.

摘要翻译： 提供了一种印刷电路板，包括：在上表面或下表面上包括内部电路图案的核心基板; 形成为穿过核心基板的电子器件; 覆盖内部电路图案和电子器件的外部绝缘层; 以及形成在外部绝缘层的上表面上的外部电路图案，其中电子器件的下表面从核心基板的下表面突出到下部。 因此，在嵌入有电子器件的嵌入式印刷电路板中，当安装电子器件时，由于形成绝缘层而与电子器件的厚度无关，所以无论厚度如何，都具有期望厚度的印刷电路板 可以形成电子装置。

公开(公告)号：EP2656703A2

公开(公告)日：2013-10-30

申请号：EP11851645.9

申请日：2011-12-23

申请人： LG Innotek Co., Ltd.

发明人： LEE, Sang Myung ,  YOON, Sung Woon ,  LEE, Hyuk Soo ,  LEE, Sung Won ,  CHUN, Ki Do

IPC分类号： H05K3/40 ,  H05K3/46

CPC分类号： H05K1/0298 ,  H05K3/064 ,  H05K3/388 ,  H05K3/428 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0341 ,  H05K2203/0376

摘要： Disclosed are a printed circuit board and a method for manufacturing the same. The printed circuit board includes a core insulating layer, at least one via formed through the core insulating layer, an inner circuit layer buried in the core insulating layer, and an outer circuit layer on a top surface or a bottom surface of the core insulating layer, wherein the via includes a first part, a second part below the first part, a third part between the first and second parts, and at least one barrier layer including a metal different from a metal of the first to third parts. The inner circuit layer and the via are simultaneously formed so that the process steps are reduced. Since odd circuit layers are provided, the printed circuit board has a light and slim structure.