Abstract:
A high-frequency, e.g., microwave, filter (100) is made, e.g., stamped or etched, from a single sheet (110) of electrically conductive material, e.g., a metal plate or a printed circuit board. The sheet defines a frame (112), one or more resonant filter elements (114) inside of the frame, one or more supports (116), connecting each resonant filter element to the frame, and a flange (118) on one of the resonant filter elements. The flange serves as an electrical contact to the filter; another flange on another element, or the frame itself, serves as a second contact. An electrically conductive housing (104) encapsulates both faces of the sheet.
Abstract:
A high-frequency, e.g., microwave, antenna (100) is stamped from a single sheet of electromagnetically conductive material, e.g., a metal plate. A manufacture comprising a frame (104), a plurality of radiator antenna elements (108), a plurality of first supports (112) each connecting a radiator antenna element to the frame, a feed network (110) connected to the radiator antenna elements, and a plurality of second supports connecting the radiators and the feed network to each other and to the frame, are stamped out of the single sheet. A combiner (114) may be included in the manufacture as well. The second supports provide alignment and rigidity during manufacture and assembly. Preferably, a plurality of the manufactures are stamped out side-by-side from a single roll for ease of automated manufacture and assembly. The frame is either made in two pieces or is bent relative to the resonator antenna elements along fold lines, to provide an offset of the radiators from a ground plane (102). The frame is mounted on the ground plane, and the second supports are then removed. Preferably, the feed network is positioned (e.g., by being bent) to lie closer to the ground plane than the radiator antenna elements.
Abstract:
A new physical design for electronic devices (100) comprises a multi-layer stacked assembly (104-110) of a plurality of pan-shaped conductive units that form the layers of the assembly. Each unit is preferably formed from a single sheet of metal into which electronic components, such as an antenna array or a filter array of a transceiver, have been stamped, cut, or etched, and which is then bent around its periphery to form a pan shape. The pans are oriented to face the same direction, are stacked one on top of another, and are fixedly attached to each other by weld, solder, or adhesive. The electrical components defined by the different units are electrically interconnected in a connectorless manner, preferably by flanges (122, 124) formed in the same sheets of metal as the units themselves and extending between the units. Adjacent units in the stack define electromagnetically isolated chambers, e.g., for the filter array. Some layers perform double duty, e.g., a layer (106) that forms a part of the chamber that houses the filter array also acts as a reflector plane for the antenna array.
Abstract:
A resonant capacitive coupler (124) couples signals across a gap (126) between signal transmission lines (112, 118) of two printed wiring boards (100, 102). The coupler has a conductive contact member that is either positioned in close proximity to one of the transmission lines (112) or is connected to the one transmission line via a dielectric, and forms a capacitor therewith. The coupler further has a conductive interconnect member that is connected to the contact member, and also to the other transmission line (108) either directly or via a second conductive contact member. The conductive interconnect member is dimensioned to have an inductive impedance at the frequency of the signals that equals, and hence cancels out, the capacitive impedance of the one or two capacitors formed by the one or two contact members. The coupler therefore resonates at the signal frequency, and relative to conventional capacitive coupling achieves a low-loss interconnection over large gaps while requiring only small capacitance to do so.
Abstract:
A transceiver (100) comprises a stacked metal laminate assembly of a plurality of layers (104-112) inside an enclosure (102). A first layer (104) forms an antenna. A second layer (106) forms a ground plane for the antenna. A third layer (108) forms "front-end" filters (duplexer). A fourth layer (110) together with the second layer forms an electromagnetic isolation enclosure for the filters. A fifth layer (112) comprises a PC board with electronic circuits of the transceiver mounted thereon, and is both mounted to and electronically shielded by the fourth layer. Each of the first through fourth layers is preferably made from a single metal layer, such as a sheet of metal, by stamping. Each of the first through fourth layers is either bent along its periphery into a substantially "cake-pan" shape, or is flat and has a separate side wall (130) attached thereto. Flanges (122 and 124) that are unitarily formed with the filters extend through orifices (126 and 128) in the second and fourth layers to connect the filters with the antenna and the electronic circuits. The connections may be conductive or capacitive. The assembly is put together by stacking the first through fourth layers and then epoxying, soldering, or welding them together.
Abstract:
A bandpass planar filter (110) comprises a signal input and a signal output (116), and one or more resonator elements (112, 114) coupled serially end-to-end between the input and the output across gaps (118) that separate the elements from the input, the output, and from each other. The resonator elements form a serpentine shape such that at least two portions of the serpentine shape are positioned side-by-side parallel to each other separated by a spacing (120). The side-by-side portions effect additional coupling between the resonator elements that forms a notch (transmission zero) (204) in the passband (200) of the filter. The input, output, and resonator elements are etched into one surface (106) of a PC board (102); the other surface (104) of the PC board forms a ground plane of the filter, and the substrate (103) of the PC board forms a dielectric of the filter.