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    SCREENING PROCESS FOR MANUFACTURING A Z-DIRECTED COMPONENT FOR A PRINTED CIRCUIT BOARD
    1.
    发明公开
    SCREENING PROCESS FOR MANUFACTURING A Z-DIRECTED COMPONENT FOR A PRINTED CIRCUIT BOARD 审中-公开
    筛选过程用于生产-Z寻找一个COMPONENT组装的PCB

    公开(公告)号：EP2751830A1

    公开(公告)日：2014-07-09

    申请号：EP12827460.2

    申请日：2012-08-24

    申请人： Lexmark International, Inc.

    发明人： HALL, Paul, Kevin ,  HARDIN, Keith, Bryan ,  KRATZER, Zachary, Charles Nathan ,  ZHANG, Qing

    IPC分类号： H01L21/00

    摘要： A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes adding a substrate material to a mold defining the shape of a layer of the z-directed component. A top surface of the substrate material in the mold is leveled. The substrate material in the mold is treated and the layer of the z-directed component is formed. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed that includes a stack of component layers that includes the formed layer.

    SPIN COAT PROCESS FOR MANUFACTURING A Z-DIRECTED COMPONENT FOR A PRINTED CIRCUIT BOARD
    5.
    发明公开
    SPIN COAT PROCESS FOR MANUFACTURING A Z-DIRECTED COMPONENT FOR A PRINTED CIRCUIT BOARD 有权
    用于制造印刷电路板的Z向引导组件的旋转涂层工艺

    公开(公告)号：EP2752100A1

    公开(公告)日：2014-07-09

    申请号：EP12827212.7

    申请日：2012-08-24

    申请人： Lexmark International, Inc.

    发明人： HALL, Paul, Kevin ,  HARDIN, Keith, Bryan ,  KRATZER, Zachary, Charles Nathan ,  ZHANG, Qing

    IPC分类号： H05K1/00 ,  H05K1/16

    CPC分类号： H05K1/184 ,  H01G2/06 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K3/4046 ,  H05K2201/09645

    摘要： A method for manufacturing a z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes depositing a liquid based material onto a top surface of a rotatable plate. The top surface of the rotatable plate has at least one cavity formed thereon that defines the shape of a layer of the z-directed component. The rotatable plate is spun to level a top surface of the liquid based material in the at least one cavity. The liquid based material is cured to form the layer of the z-directed component. A conductive material is applied to at least one surface of the formed layer. The z-directed component is formed including a stack of component layers that includes the formed layer.

    摘要翻译： 根据一个示例实施例的用于制造用于插入到印刷电路板中的安装孔中的z向部件的方法包括将液体基材料沉积到可旋转板的顶表面上。 可旋转板的顶表面具有至少一个形成于其上的空腔，其限定了z向部件的层的形状。 可旋转板被旋转以使至少一个空腔中的基于液体的材料的顶表面水平。 液体基材料被固化以形成z向部件的层。 将导电材料施加到所形成的层的至少一个表面上。 z向部件被形成为包括包括所形成的层的组件层的堆叠。