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    SEMICONDUCTOR DETECTOR
    2.
    发明公开
    SEMICONDUCTOR DETECTOR 审中-公开
    半导体探测器

    公开(公告)号：EP3291311A1

    公开(公告)日：2018-03-07

    申请号：EP17188640.1

    申请日：2017-08-30

    申请人： Nuctech Company Limited

    发明人： ZHANG, Lan ,  DU, Yingshuai ,  LI, Bo ,  WU, Zonggui ,  LI, Jun ,  CAO, Xuepeng ,  HU, Haifan ,  GU, Jianping ,  XU, Guangming ,  LIU, Bicheng

    IPC分类号： H01L31/0224 ,  G01T1/24 ,  H01L31/115

    CPC分类号： G01T1/24 ,  G01T1/241 ,  H01L31/02005 ,  H01L31/0224 ,  H01L31/02966 ,  H01L31/115 ,  H01L31/119 ,  H05K1/0233 ,  H05K1/028 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/10151 ,  H05K2201/10287 ,  H05K2201/10522

    摘要： The present disclosure provides a semiconductor detector. The semiconductor detector comprises: a detector crystal including a crystal body (3), an anode and a cathode; a field enhance electrode (1) for applying a voltage to the detector crystal; an insulating material (2) disposed between the field enhanced electrode (1) and a surface of the detector crystal (3). The semiconductor detector further comprises a field enhanced electrode circuit board having a bottom connection layer in contact with the surface of the detector crystal and a top layer opposite to the bottom connection layer, wherein the top layer is connected to a high voltage input terminal of the semiconductor detector, and an insulating material is provided between the bottom connection layer and the detector surface of the detector crystal.

    摘要翻译： 本公开提供了一种半导体检测器。 该半导体检测器包括：包括晶体（3），阳极和阴极的检测器晶体; 场增强电极（1），用于向检测器晶体施加电压; 设置在场增强电极（1）与检测器晶体（3）的表面之间的绝缘材料（2）。 所述半导体探测器还包括场增强电极电路板，所述场增强电极电路板具有与所述探测器晶体的表面接触的底部连接层和与所述底部连接层相对的顶层，其中所述顶层连接到所述探测器晶体的高压输入端子 半导体探测器，并且在底部连接层和探测器晶体的探测器表面之间提供绝缘材料。

    RADIO FREQUENCY INTERCONNECTION DEVICE
    3.
    发明公开
    RADIO FREQUENCY INTERCONNECTION DEVICE 审中-公开
    无线电频率互连装置

    公开(公告)号：EP3264872A1

    公开(公告)日：2018-01-03

    申请号：EP16305824.1

    申请日：2016-06-30

    申请人： Thomson Licensing

    发明人： LO HINE TONG, Dominique ,  AUBIN, Anthony ,  LE FOULGOC, Jean-Marc

    IPC分类号： H05K3/36 ,  H05K1/02 ,  H03H7/01 ,  H01P1/203

    CPC分类号： H05K3/366 ,  H01P1/203 ,  H01P1/2039 ,  H05K1/0233 ,  H05K1/0237 ,  H05K2201/09254 ,  H05K2201/1031 ,  Y02P70/611

    摘要： A radio frequency interconnection device, comprising; a first part of said radio frequency interconnection device being disposed on a first circuit board; and a second part of said radio frequency interconnection device disposed on a second circuit board wherein the radio frequency interconnection device is a radio frequency wideband bandpass filter comprising:
    - an input port (915,1115,P1) on said first circuit board (1105) and an output port (1215,P2) on said second circuit board (1205), wherein said first and second circuit board (1105,1205) are arranged at an angle to one another,
    - a first transmission line (925,1130,TL1) on said first circuit board (1105) to connect said input port (915,1115,P1) with an intermediate terminating pad (1120) on said first circuit board (1105),
    - a second transmission line (935,TL2) on said first circuit board (1105) connected to said first transmission line (925,1130,TL1) and terminated by a ground hole (910) on said first circuit board (1105),
    - a first ground pad (1125,PG1) formed on said first circuit board (1105) being spaced apart from said intermediate terminating pad (1120),
    - a third transmission line (925,1220,TL3) on said second circuit board (1205) to connect an intersection point (C) with a second ground pad (1225,PG2) on said second circuit board (1205), wherein said output port (1215,P2) is connected to said third transmission line (925,1220,TL3) at said intersection point (C), said intersection point (C) is located above said intermediate terminating pad (1120) and said second ground pad (1225,PG2) is located above said first ground pad (1125,PG1)
    - a first baseplate located being between said first grounding pad (1125) and said second grounding pad (1225,PG2) and a second baseplate being between said intersection point (C) and said intermediate terminating pad (1120), said baseplates providing an air gap between said first circuit board (1105) and said second circuit board (1205), both said first circuit board (1105) and said second circuit board (1205) having a ground plane (1110,1210).

    摘要翻译： 一种射频互连装置，包括： 所述射频互连装置的第一部分设置在第一电路板上; 所述射频互连装置的第二部分设置在第二电路板上，其中所述射频互连装置是射频宽带带通滤波器，包括： - 所述第一电路板（1105）上的输入端口（915,1115，P1） 和所述第二电路板（1205）上的输出端口（1215，P2），其中所述第一和第二电路板（1105,1205）彼此成角度地布置， - 第一传输线（925,1130，TL1 ）连接到所述第一电路板（1105）上，以将所述输入端口（915,1115，P1）与所述第一电路板（1105）上的中间端接焊盘（1120）连接; - 所述第二传输线（935，TL2） 第一电路板（1105），其连接到所述第一传输线（925,1130，TL1）并且由所述第一电路板（1105）上的接地孔（910）终止;第一接地焊盘（1125，PG1），其形成在所述第一电路板 第一电路板（1105）与所述中间端接焊盘（1120）间隔开， - 第三透射 （1205）上的离子线（925,1220，TL3）以在所述第二电路板（1205）上连接交点（C）与第二接地焊盘（1225，PG2），其中所述输出端口（1215 ，所述交点（C）位于所述中间端接焊盘（1120）的上方，并且所述第二接地焊盘（1225，PG2）与所述第三传输线（925,1220，TL3） ）位于所述第一接地垫（1125，PG1）上方 - 位于所述第一接地垫（1125）和所述第二接地垫（1225，PG2）之间的第一底板和位于所述交叉点（C）和第二底板 所述中间终端垫（1120），所述基板在所述第一电路板（1105）和所述第二电路板（1205）之间提供气隙，所述第一电路板（1105）和所述第二电路板（1205）都具有接地 平面（1110,1210）。

    Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR
    8.
    发明公开
    Z-DIRECTED PRINTED CIRCUIT BOARD COMPONENTS HAVING A REMOVABLE END PORTION AND METHODS THEREFOR 审中-公开
    Z-ORIENTIERTE LEITERPLATTENKOMPONENTEN MIT ABNEHMBAREMENDSTÜCKUND VERFAHRENDAFÜR

    公开(公告)号：EP2865052A1

    公开(公告)日：2015-04-29

    申请号：EP13806722.8

    申请日：2013-06-19

    申请人： Lexmark International, Inc.

    发明人： HARDIN, Keith, Bryan ,  HALL, Paul, Kevin ,  KRATZER, Zachary, Charles, Nathan ,  ZHANG, Qing ,  FESSLER, John, Thomas

    IPC分类号： H01R12/58

    CPC分类号： H05K3/301 ,  H05K1/0222 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0251 ,  H05K1/0298 ,  H05K1/184 ,  H05K3/306 ,  H05K3/4046 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10015 ,  H05K2201/10893 ,  H05K2201/10984 ,  Y10T29/4913 ,  Y10T29/49135

    摘要： A Z-directed component for mounting in a mounting hole in a printed circuit board according to one example embodiment includes a main body portion and a tapered end portion that facilitates insertion of the Z-directed component into the mounting hole in the printed circuit board. The tapered end portion is removably attached to the main body portion such that the tapered end portion may be removed after the Z-directed component is inserted into the mounting hole in the printed circuit board. A method for installing a Z-directed component having a removable tapered lead-in into the mounting hole according to one example embodiment includes inserting the Z- directed component into the mounting hole in the printed circuit board with the removable tapered lead-in leading the insertion and after the Z-directed component is inserted into the mounting hole, removing the removable lead-in from the rest of the Z-directed component.

    摘要翻译： 根据一个示例性实施例的用于安装在印刷电路板的安装孔中的Z指向部件包括主体部分和锥形端部，其有助于将Z定向部件插入到印刷电路板中的安装孔中。 锥形端部可移除地附接到主体部分，使得在Z指向部件插入印刷电路板的安装孔中之后，锥形端部可以被移除。 根据一个示例性实施例的用于将具有可移除的锥形引入件的Z指向部件安装到安装孔中的方法包括将Z定向部件插入印刷电路板中的安装孔中，其中可移除的锥形引入引导 插入，并且在将Z定向部件插入到安装孔中之后，从Z定向部件的其余部分移除可移除引入线。