公开(公告)号：EP3413695A1

公开(公告)日：2018-12-12

申请号：EP16889407.9

申请日：2016-12-07

Applicant: Mitsubishi Electric Corporation

Inventor： KONNO, Nobuaki ,  HIRATA, Yoshiaki ,  YOSHIDA, Yukihisa

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/13 ,  H05K1/02

CPC classification number: H01L23/15 ,  H01L23/12 ,  H01L23/13 ,  H01L23/49822 ,  H05K1/02 ,  H05K1/0306 ,  H05K3/46 ,  H05K3/4629

Abstract: A ceramic substrate (10) having a cavity which can be used for measuring the thickness of the substrate includes a plurality of stacked ceramic substrate members (1). Each of the plurality of ceramic substrate members (1) includes a via (2) reaching the other main surface from one main surface. A gap (6) is formed in each of first and second ceramic substrate members (1a, 1f) of the plurality of stacked ceramic substrate members (1) to penetrate each of the first and second ceramic substrate members (1a, 1f), the first ceramic substrate member (1a) being arranged at an outermost surface on one side in a stacking direction of the ceramic substrate members (1), the second ceramic substrate member (If) being arranged at an outermost surface on the other side opposite to the one side in the stacking direction. At least a portion of a side surface and a bottom surface within the gap (6) are covered with a protection layer (7, 8). The protection layer (7, 8) is made of a material having an etching rate lower than that of the ceramic substrate members (1).

公开(公告)号：EP2752102B1

公开(公告)日：2018-03-21

申请号：EP12827168.1

申请日：2012-08-24

Applicant: Lexmark International, Inc.

Inventor： HALL, Paul, Kevin ,  HARDIN, Keith Bryan ,  KRATZER, Zachary, Charles Nathan ,  ZHANG, Qing

IPC: H05K3/46 ,  H05K3/40 ,  H05K1/18

CPC classification number: H05K1/184 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/09645 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

公开(公告)号：EP3247181A1

公开(公告)日：2017-11-22

申请号：EP16737189.7

申请日：2016-01-08

Applicant: NGK Spark Plug Co., Ltd.

Inventor： KATOH, Tatsuya ,  ITO, Masanori ,  KUTSUNA, Masaki

IPC: H05K3/12 ,  H05K1/09 ,  H05K3/28 ,  H05K3/46

CPC classification number: H05K3/40 ,  B32B9/005 ,  B32B2307/202 ,  C03C4/14 ,  C03C10/0054 ,  C03C2204/00 ,  C04B35/6303 ,  C04B2237/40 ,  C04B2237/704 ,  H01L23/15 ,  H05K1/0296 ,  H05K1/0306 ,  H05K1/09 ,  H05K1/092 ,  H05K3/12 ,  H05K3/1291 ,  H05K3/28 ,  H05K3/285 ,  H05K3/321 ,  H05K3/4061 ,  H05K3/46 ,  H05K3/4629 ,  H05K3/4664 ,  H05K2201/017 ,  H05K2201/0769 ,  H05K2203/1126

Abstract: This circuit-board production method is provided with: a step for preparing a conductor paste obtained by adding, to silver (Ag) powder, a powder of a metal boride and/or a metal silicide; a step in which the conductor paste is applied to the surface of a baked ceramic substrate; a step in which a glass paste is applied to the surface of the ceramic substrate after the conductor paste has been applied; a step in which the conductor paste applied to the surface is baked to form a conductor pattern; and a step in which the glass paste applied to the surface is baked to form a coating layer.

Abstract translation: 该电路基板的制造方法具备：准备在银（Ag）粉末中添加金属硼化物和/或金属硅化物的粉末而得到的导体膏的工序; 将导体膏施加到烘烤的陶瓷基底的表面上的步骤; 在施加导体膏之后，将陶瓷基板的表面涂布玻璃膏的工序; 烘焙施加到表面的导体膏以形成导体图案的步骤; 以及将涂布于表面的玻璃糊剂烘烤以形成涂层的步骤。

公开(公告)号：EP2129201B1

公开(公告)日：2017-04-12

申请号：EP08711655.4

申请日：2008-02-20

Applicant: Murata Manufacturing Co. Ltd.

Inventor： NOMIYA, Masato

IPC: H05K3/46

CPC classification number: H05K1/115 ,  H05K1/0271 ,  H05K1/0306 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0195 ,  H05K2201/09781 ,  H05K2201/10378

公开(公告)号：EP1981320B1

公开(公告)日：2016-01-20

申请号：EP07713685.1

申请日：2007-01-23

Applicant: Hitachi Metals, Ltd.

Inventor： IKEDA, Hatsuo ,  ICHIKAWA, Koji

IPC: H05K1/09 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/092 ,  H05K3/4061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0272 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24331 ,  Y10T428/24339 ,  Y10T428/24347 ,  Y10T428/24893 ,  Y10T428/24909

公开(公告)号：EP2752102A4

公开(公告)日：2015-09-02

申请号：EP12827168

申请日：2012-08-24

Applicant: LEXMARK INT INC

Inventor： HALL PAUL KEVIN ,  HARDIN KEITH BRYAN ,  KRATZER ZACHARY CHARLES NATHAN ,  ZHANG QING

IPC: H05K3/46 ,  H05K1/18 ,  H05K3/40

CPC classification number: H05K1/184 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0248 ,  H05K1/0251 ,  H05K3/4046 ,  H05K3/4629 ,  H05K2201/09645 ,  Y10T29/49117 ,  Y10T29/4913

Abstract: A method for manufacturing a Z-directed component for insertion into a mounting hole in a printed circuit board according to one example embodiment includes punching a plurality of segments out of at least one sheet of substrate material to form a plurality of layers of the Z-directed component. A channel is formed through the substrate material either before or after the segments are punched. At least one of the formed layers includes at least a portion of the channel. A conductive material is applied to at least one surface of at least one of the formed layers. A stack of the formed layers is combined to form the Z-directed component.

公开(公告)号：EP2444772A3

公开(公告)日：2014-12-17

申请号：EP12151253.7

申请日：2010-10-19

Applicant: NGK Insulators, Ltd. ,  NGK Ceramic Device Co., Ltd.

Inventor： Shindo, Hiroyuki ,  Asai, Toyoiko

IPC: G01B5/06 ,  H01G4/12 ,  H01G4/30 ,  H05K3/46

CPC classification number: G01B5/06 ,  H01G4/12 ,  H01G4/30 ,  H05K3/4629

Abstract: A method for improving an accuracy of measurement of the thickness of a green sheet, and additionally improving yield of a green sheet used for formation of a laminated body is provided. The thickness of each of a plurality of ceramic green sheets is measured, and an average and a variation of obtained thickness measurement values are checked against predetermined ranking criteria. Thereby, a ranking is performed in which the plurality of ceramic green sheets are classified into a plurality of ranks set in the ranking criteria. When forming the laminated body, only a ceramic green sheet belonging to at least one of the ranks which is in advance allowed to be used is used as a ceramic green sheet constituting each layer of the laminated body.

公开(公告)号：EP2194766A4

公开(公告)日：2013-08-21

申请号：EP08792271

申请日：2008-07-31

Applicant: SOSHIN ELECTRIC ,  NGK INSULATORS LTD

Inventor： HASEGAWA TOMOYUKI ,  NAGATOMO TAKASHI ,  IDE YOSHINORI ,  OTAGIRI TADASHI

IPC: H05K3/46 ,  B32B18/00 ,  C04B35/46 ,  C04B35/462 ,  C04B35/468 ,  H01B3/12 ,  H01L23/498 ,  H05K1/03 ,  H05K1/16

CPC classification number: H05K1/162 ,  B32B18/00 ,  C04B35/46 ,  C04B35/462 ,  C04B35/468 ,  C04B35/4682 ,  C04B35/62675 ,  C04B2235/3215 ,  C04B2235/3281 ,  C04B2235/3284 ,  C04B2235/3298 ,  C04B2235/365 ,  C04B2235/6025 ,  C04B2235/656 ,  C04B2235/96 ,  C04B2237/341 ,  C04B2237/346 ,  H01B3/12 ,  H01L23/49822 ,  H01L2224/16 ,  H01L2924/01012 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K1/165 ,  H05K3/4611 ,  H05K3/4629 ,  H05K3/4688 ,  H05K2201/0187 ,  H05K2201/10674 ,  Y10T428/24926

公开(公告)号：EP1921904B1

公开(公告)日：2013-06-12

申请号：EP06766615.6

申请日：2006-06-13

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： MATSUBARA, Daigo ,  CHIKAGAWA, Osamu

IPC: H05K3/46 ,  H01L23/13

CPC classification number: H05K3/4007 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/49822 ,  H01L2221/68345 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0306 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/0367 ,  H05K2201/0979 ,  H05K2203/308 ,  Y10T29/49163 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A ceramic electronic component is provided which can realize a sufficient drop resistance strength even when terminal electrodes are formed at a higher density. A ceramic electronic component 10 of the present invention has a ceramic laminate 11 composed of ceramic laminates 11A which are laminated to each other, first terminal electrodes 13 disposed in a peripheral portion of a bottom surface of the ceramic laminate 11, catch pad electrodes 15A provided in the ceramic laminate 11 to face the respective first terminal electrodes 13, and sets each including at least two first via hole conductors 16A and 16B, which electrically connect the first terminal electrodes 13 and the respective catch pad electrodes 15A.

公开(公告)号：EP2575167A2

公开(公告)日：2013-04-03

申请号：EP12180754.9

申请日：2012-08-16

Applicant: FUJITSU LIMITED

Inventor： Masuda, Satoshi

IPC: H01L23/367 ,  H01L25/07

CPC classification number: H01L23/3677 ,  H01L23/49838 ,  H01L23/50 ,  H01L23/66 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2924/1423 ,  H01L2924/15157 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/021 ,  H05K1/0215 ,  H05K1/0243 ,  H05K3/4629 ,  H05K2201/09181 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic device including a first ground conductor layer positioned at an underside of a first insulation layer; a second ground conductor layer positioned at an upper side of the first insulation layer; a second insulation layer positioned at an upper side of the second ground conductor layer; a first connection pattern formed in inside wall of a first opening penetrating the first insulation layer and the second insulation layer and interconnecting the first ground conductor layer and the second ground conductor layer; a conductive member provided in the first opening and connected to the first ground conductor layer; and an electronic element mounted on the member and grounded to the member.

Abstract translation: 一种电子装置，包括：位于第一绝缘层的下侧的第一接地导体层; 位于所述第一绝缘层的上侧的第二接地导体层; 位于所述第二接地导体层的上侧的第二绝缘层; 第一连接图案，形成在第一开口的内壁中，所述第一开口贯穿所述第一绝缘层和所述第二绝缘层并且将所述第一接地导体层和所述第二接地导体层互连; 设置在所述第一开口中并连接到所述第一接地导体层的导电构件; 以及安装在该构件上并且与该构件接地的电子元件。