公开(公告)号：EP3307535A1

公开(公告)日：2018-04-18

申请号：EP16812351.1

申请日：2016-06-15

申请人： MC10, INC.

发明人： WANG, Xianyan ,  GHAFFARI, Roozbeh ,  WEI, Pinghung ,  HONG, Ji Hyung Suzy ,  MUTLU, Hakan ,  MURPHY, Brian ,  GARLOCK, David G.

IPC分类号： B32B5/24

CPC分类号： A61B5/6832 ,  A61B5/01 ,  A61B5/0402 ,  A61B5/0476 ,  A61B5/0488 ,  A61B5/0531 ,  A61B5/0533 ,  A61B5/0816 ,  A61B5/11 ,  A61B5/4875 ,  B32B3/16 ,  B32B3/266 ,  B32B5/022 ,  B32B5/024 ,  B32B5/026 ,  B32B5/18 ,  B32B7/12 ,  B32B25/08 ,  B32B25/12 ,  B32B25/14 ,  B32B25/20 ,  B32B27/08 ,  B32B27/10 ,  B32B27/18 ,  B32B27/26 ,  B32B27/308 ,  B32B27/40 ,  B32B29/00 ,  B32B2262/0253 ,  B32B2262/0261 ,  B32B2262/0276 ,  B32B2262/12 ,  B32B2262/14 ,  B32B2264/108 ,  B32B2307/546 ,  B32B2307/702 ,  B32B2307/726 ,  B32B2307/732 ,  B32B2457/00 ,  B32B2535/00 ,  B32B2556/00 ,  C09J7/29 ,  C09J2201/128

摘要： The present invention describes breathable multilayered adhesive structures that can be used as adhesives to mount devices onto the skin. The breathable multilayered adhesive structures can comprise moisture-wicking layers adhered to the skin by a porous adhesion layer. The pores allow moisture released from the skin to be transferred away through the moisture-wicking layer. The adhesive structures permit the devices to be skin-mounted for an extended period of time (e.g., a few hours or days) without causing moisture-associated skin injuries such as erythema, maceration, and irritation or inflammation.

公开(公告)号：EP3092661A2

公开(公告)日：2016-11-16

申请号：EP15733182.8

申请日：2015-01-06

申请人： MC10, INC.

发明人： MCMAHON, Nicholas ,  WANG, Xianyan ,  ELOLAMPI, Brian ,  KEEN, Bryan D. ,  GARLOCK, David G.

IPC分类号： H01L29/82 ,  H01L21/00

CPC分类号： H01L23/4985 ,  H01L21/0206 ,  H01L21/4864 ,  H01L21/561 ,  H01L21/565 ,  H01L22/20 ,  H01L23/293 ,  H01L23/296 ,  H01L23/3121 ,  H01L23/3135 ,  H01L23/49838 ,  H01L23/49894 ,  H01L23/5387 ,  H01L23/562 ,  H01L2924/0002 ,  H01L2924/00

摘要： Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) sensor systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal integrated circuit device is disclosed which includes a flexible substrate with electronic circuitry attached to the flexible substrate. A flexible encapsulation layer is attached to the flexible substrate. The flexible encapsulation layer encases the electronic circuitry between the flexible substrate and the encapsulation layer. For some configurations, the encapsulation layer and flexible substrate are fabricated from stretchable and bendable non-conductive polymers. The electronic circuitry may comprise an integrated circuit sensor system with multiple device islands that are electrically and physically connected via a plurality of stretchable electrical interconnects.