公开(公告)号：EP1189282A1

公开(公告)日：2002-03-20

申请号：EP01912489.0

申请日：2001-03-19

申请人： MITSUBISHI DENKI KABUSHIKI KAISHA

发明人： HAMAGUCHI, Tsuneo, c/o Mitsubishi Denki K.K. ,  KAGATA, Kenji, c/o Mitsubishi Denki K.K.

IPC分类号： H01L25/065 ,  H01L23/12

CPC分类号： H05K3/3436 ,  H01L23/13 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/0657 ,  H01L27/14609 ,  H01L27/14618 ,  H01L2224/05554 ,  H01L2224/05599 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06582 ,  H01L2225/06586 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01057 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10162 ,  H01L2924/10253 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K2201/09018 ,  H05K2201/094 ,  H05K2203/0465 ,  H05K2203/306 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： It is an object of the present invention to provide a low-cost semiconductor device including a semiconductor chip mounted on both surfaces of a wiring substrate without degrading electric characteristics, a method for manufacturing an electronic equipment, an electronic equipment, and a portable information terminal.
The semiconductor device includes projecting electrodes formed on one surface of a wiring substrate so as to have a prescribed height, a semiconductor chip having a thickness smaller than the height of the projecting electrodes, and an electronic component having a thickness larger than that of the semiconductor chip and mounted on the other surface of the wiring substrate so that the wiring substrate is warped to be recessed at the one surface. Thus, the rigidity as well as the spacing between the semiconductor chip and the mounting board are assured. Moreover, the semiconductor device having a logic LSI mounted on both surfaces of a wiring substrate is mounted on a mounting board in a housing with projecting electrodes having a prescribed height interposed therebetween, wherein the wiring substrate is warped to be recessed on the side having the projecting electrodes. Thus, the rigidity and the spacing are assured, whereby an electronic equipment and a portable information terminal are manufactured which cause no damage to the logic LSIs even when subjected to external pressure.

摘要翻译： 它是本发明的一个目的是提供一种低成本的半导体装置，其包括安装在布线基板的两个表面上，而不会降低电特性，用于制造电子设备的方法，对电子设备的半导体芯片，和便携式信息终端 ， 该半导体器件包括投影形成于布线基板的一个表面上的电极，从而具有其厚度比上述半导体的大的规定高度，其厚度比所述凸起电极的高度更小的半导体芯片，以及电子部件 芯片以及安装在所述布线基板的另一个表面上，以便做的布线基板翘曲在一个表面上被凹进。 因此，刚性以及在半导体芯片和安装基板之间的间距被保证。 更完了，具有LSI安装在布线基板的两个表面上的逻辑的半导体器件被安装在安装基板上与投射具有之间夹有规定高度的电极，worin布线基板的壳体翘曲在具有侧为凹陷 突起状电极。 因此，刚度和间距放心，从而对电子设备和便携式信息终端被制造引起的逻辑LSI即使受到外部压力没有损害。