公开(公告)号：EP1668697A2

公开(公告)日：2006-06-14

申请号：EP04784570.6

申请日：2004-09-17

Applicant: MOTOROLA, INC.

Inventor： WALDVOGEL, John M. ,  BIELICK, Brian R. ,  MILLER, Herman J. ,  VAN CANNON, Billy J.

IPC: H01L23/10 ,  H01L23/12 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/0061 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/341 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2203/1178 ,  H01L2924/00

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.

Abstract translation: 1。一种电路装置（300），包括：具有接地层（336），至少一个热孔径（332）和至少一个焊料孔（334）的基板（330）; 散热器（310）; 以及用于将所述散热器机械地耦合到所述基板的所述接地层的粘合剂层（320），使得所述至少一个基板热孔径的至少一部分与所述散热器重叠，所述粘合剂层具有至少一个热孔径（322 ）和至少一个焊料孔（324），其中将所述至少一个基板焊料孔与所述至少一个粘合剂层焊料孔对准并且将所述至少一个基板热孔与所述至少一个粘合剂层热孔对准使得焊料润湿 在散热器和基板的接地层之间的预定区域中。

公开(公告)号：EP1668697B1

公开(公告)日：2010-12-15

申请号：EP04784570.6

申请日：2004-09-17

Applicant: MOTOROLA, INC.

Inventor： WALDVOGEL, John M. ,  BIELICK, Brian R. ,  MILLER, Herman J. ,  VAN CANNON, Billy J.

IPC: H01L23/10 ,  H01L23/12 ,  H01L23/34 ,  H01L23/48 ,  H01L23/52 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50

CPC classification number: H05K3/0061 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K1/0271 ,  H05K1/111 ,  H05K3/341 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/0347 ,  H05K2201/068 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2203/1178 ,  H01L2924/00

Abstract: An electrical circuit apparatus (300) that includes: a substrate (330) having a ground layer (336), at least one thermal aperture (332), and at least one solder aperture (334); a heat sink (310); and an adhesive layer (320) for mechanically coupling the heat sink to the ground layer of the substrate such that at least a portion of the at least one substrate thermal aperture overlaps the heat sink, the adhesive layer having at least one thermal aperture (322) and at least one solder aperture (324), wherein aligning the at least one substrate solder aperture with the at least one adhesive layer solder aperture and aligning the at least one substrate thermal aperture with the at least one adhesive layer thermal aperture enables solder wetting in a predetermined area between the heat sink and the ground layer of the substrate.