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公开(公告)号:EP1920026A1
公开(公告)日:2008-05-14
申请号:EP06771598.7
申请日:2006-05-31
发明人: FENG, Kesheng , KAPADIA, Nilesh , CASTALDI, Steve
IPC分类号: C09K13/00
CPC分类号: H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
摘要: The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
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公开(公告)号:EP1920026B1
公开(公告)日:2017-04-12
申请号:EP06771598.7
申请日:2006-05-31
发明人: FENG, Kesheng , KAPADIA, Nilesh , CASTALDI, Steve
IPC分类号: C09K13/00
CPC分类号: H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
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