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公开(公告)号：EP1920026B1
公开(公告)日：2017-04-12
申请号：EP06771598.7
申请日：2006-05-31
发明人： FENG, Kesheng , KAPADIA, Nilesh , CASTALDI, Steve
IPC分类号： C09K13/00
CPC分类号： H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
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公开(公告)号：EP2132035A1
公开(公告)日：2009-12-16
申请号：EP08724545.2
申请日：2008-01-17
CPC分类号： C09J5/02 , C09J2400/163 , C09J2400/166 , C09J2400/226 , C23C22/40 , C23C22/52 , C23F1/18 , H05K3/383 , H05K2203/0796 , H05K2203/124
摘要： A process is described for treating metal surfaces with roughening compositions that use poly(ethyleneamino propionitrile) polymer as an additive in the composition to improve adhesion of polymeric materials to the metal surfaces and to improve peel strength for thermal stability. The polymer of the invention may be added to compositions containing for example, cupric chloride and hydrochloric acid and is also usable in compositions containing an oxidizer/acid/azole mixture. Other additives, such as adiponitrile may also be beneficially added to compositions of the invention.
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公开(公告)号：EP1958028A1
公开(公告)日：2008-08-20
申请号：EP06790025.8
申请日：2006-08-28
发明人： FENG, Kesheng , HART, Daniel, J.
IPC分类号： G03F7/30
CPC分类号： G03F7/322
摘要： An improved composition and method for the development of resists is disclosed. The method comprises contacting the resist with a developer solution comprising a source of alkalinity and a cationic surfactant which is an ethoxylated and/or propoxylated tallow amine. The improved developer solution more effectively removes the uncured resist from the resist coated surface.
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公开(公告)号：EP2304079B1
公开(公告)日：2012-02-22
申请号：EP09758853.7
申请日：2009-03-27
CPC分类号： H05K3/383 , C23F1/18 , C23F11/184 , H05K3/385 , H05K2203/0796 , H05K2203/124
摘要： A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
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公开(公告)号：EP2183335A1
公开(公告)日：2010-05-12
申请号：EP08780074.4
申请日：2008-07-09
CPC分类号： C23F1/18 , H05K3/383 , H05K2203/122
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤化物离子源的微蚀刻组合物。 其他添加剂，包括有机溶剂，钼离子源，胺，聚胺和丙烯酰胺也可包括在本发明的组合物中。 本发明还涉及一种对铜或铜合金表面进行微蚀刻以增加铜表面与聚合物材料的粘合性的方法，该方法包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后键合 聚合物材料到铜或铜合金表面。
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公开(公告)号：EP1974370B1
公开(公告)日：2019-12-18
申请号：EP06814816.2
申请日：2006-09-15
IPC分类号： H01L21/306 , C09K13/06 , C09K13/04 , C23F1/16 , C23F1/44 , H01L21/3213
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公开(公告)号：EP1958028B1
公开(公告)日：2011-04-27
申请号：EP06790025.8
申请日：2006-08-28
发明人： FENG, Kesheng , HART, Daniel, J.
IPC分类号： G03F7/30
CPC分类号： G03F7/322
摘要： An improved composition and method for the development of resists is disclosed. The method comprises contacting the resist with a developer solution comprising a source of alkalinity and a cationic surfactant which is an ethoxylated and/or propoxylated tallow amine. The improved developer solution more effectively removes the uncured resist from the resist coated surface.
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公开(公告)号：EP2304079A1
公开(公告)日：2011-04-06
申请号：EP09758853.7
申请日：2009-03-27
CPC分类号： H05K3/383 , C23F1/18 , C23F11/184 , H05K3/385 , H05K2203/0796 , H05K2203/124
摘要： A composition for providing acid resistance to copper surfaces in the production of multilayered printed circuit boards. The composition comprises an acid, an oxidizer, a five-membered heterocyclic compound and a thiophosphate or a phosphorous sulfide compound. In a preferred embodiment, the phosphorous compound is phosphorus pentasulfide. The composition is applied to a copper or copper alloy substrate and the copper substrate is thereafter bonded to a polymeric material.
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9.发明公开
公开(公告)号：EP1974370A2
公开(公告)日：2008-10-01
申请号：EP06814816.2
申请日：2006-09-15
IPC分类号： H01L21/306 , C09K13/06 , C09K13/04
摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.
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公开(公告)号：EP1920026A1
公开(公告)日：2008-05-14
申请号：EP06771598.7
申请日：2006-05-31
发明人： FENG, Kesheng , KAPADIA, Nilesh , CASTALDI, Steve
IPC分类号： C09K13/00
CPC分类号： H05K3/383 , C09K13/06 , C23F1/18 , H05K2203/124
摘要： The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.
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