公开(公告)号：EP2580303B1

公开(公告)日：2018-08-29

申请号：EP11792023.1

申请日：2011-06-01

申请人： BASF SE

发明人： FERSTL, Berthold ,  BRAUN, Simon ,  FEßENBECKER, Achim

IPC分类号： C11D7/34 ,  C11D7/36 ,  C11D7/32 ,  C11D11/00 ,  H01L21/306 ,  H01L21/461 ,  H01L31/18

CPC分类号： H01L31/1804 ,  C09K13/00 ,  C09K13/06 ,  C11D7/3209 ,  C11D7/34 ,  C11D7/36 ,  C11D11/0047 ,  H01L21/306 ,  H01L21/30604 ,  Y02E10/547 ,  Y02P70/521

摘要： An aqueous alkaline etching and cleaning composition for treating the surface of silicon substrates, the said composition comprising: (A) a quaternary ammonium hydroxide; and (B) a component selected from the group consisting of water-soluble acids and their water-soluble salts of the general formulas (I) to (V): (R1—S03-)nXn+ (I), R—P032−(Xn+)3-n (II); (RO—S03-)nXn+ (III), RO—P032−(Xn+)3-n, (IV), and [(RO)2P02−]nXn+ (V); wherein the n=1 or 2; X is hydrogen or alkaline or alkaline-earth metal; the variable R1 is an olefinically unsaturated aliphatic or cycloaliphatic moiety and R is R1 or an alkylaryl moiety; the use of the composition for treating silicon substrates, a method for treating the surface of silicon substrates, and methods for manufacturing devices generating electricity upon the exposure to electromagnetic radiation.

公开(公告)号：EP2869938A4

公开(公告)日：2016-06-01

申请号：EP12880676

申请日：2012-10-04

申请人： GEN ENGINEERING & RES L L C

发明人： IHNFELDT ROBIN

IPC分类号： B24B1/00 ,  B01J13/02 ,  B01J13/14 ,  C09C1/30 ,  C09K3/14 ,  C23F3/00 ,  H01L21/321

CPC分类号： C09G1/02 ,  B01J13/14 ,  B24B1/00 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/14 ,  C01P2006/16 ,  C08K9/00 ,  C08K9/10 ,  C09C1/02 ,  C09C1/3063 ,  C09G1/00 ,  C09G1/04 ,  C09K3/1436 ,  C09K3/1454 ,  C09K3/1463 ,  C09K13/00 ,  C09K13/06 ,  C23F3/00 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/7684

摘要： The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.

公开(公告)号：EP2888758A4

公开(公告)日：2016-04-20

申请号：EP13830251

申请日：2013-08-15

申请人： CABOT MICROELECTRONICS CORP

发明人： JIN WIECHANG ,  REMSEN ELIZABETH

IPC分类号： H01L21/304

CPC分类号： C23F3/06 ,  B24B1/00 ,  C09G1/00 ,  C09G1/02 ,  C09G1/04 ,  C09G1/06 ,  C09K3/1409 ,  C09K3/1463 ,  C09K13/06 ,  C23F3/04 ,  H01L21/30625 ,  H01L21/31053 ,  H01L21/3212

公开(公告)号：EP2875520A4

公开(公告)日：2016-02-24

申请号：EP13819335

申请日：2013-07-17

申请人： FUJIFILM CORP

发明人： KAMIMURA TETSUYA ,  INABA TADASHI ,  MURO NAOTSUGU ,  NISHIWAKI YOSHINORI

IPC分类号： H01L21/3213 ,  C09K13/00 ,  C09K13/06 ,  H01L21/311

CPC分类号： H01L21/30604 ,  C09K13/00 ,  C09K13/02 ,  C09K13/06 ,  C23F1/00 ,  C23F1/02 ,  C23F1/14 ,  C23F1/26 ,  C23F1/38 ,  C23F1/44 ,  C23G1/106 ,  C23G1/205 ,  H01L21/02063 ,  H01L21/31144 ,  H01L21/32134 ,  H01L21/6704

公开(公告)号：EP2827363A4

公开(公告)日：2015-11-11

申请号：EP12871234

申请日：2012-12-25

申请人： ADEKA CORP

发明人： TAGUCHI YUTA ,  SAITOH KOUTA

IPC分类号： H01L21/308 ,  C09K13/06 ,  C23F1/16 ,  C23F1/18 ,  H01L31/0224

CPC分类号： C23F1/18 ,  C09K13/06 ,  C23F1/16 ,  H01L21/32134 ,  H01L31/022425 ,  Y02E10/50

公开(公告)号：EP2922086A1

公开(公告)日：2015-09-23

申请号：EP14198123.3

申请日：2014-12-16

申请人： AIR PRODUCTS AND CHEMICALS, INC.

发明人： Casteel Jr., William Jack ,  Inaoka, Seiji ,  Rao, Madhukar Bhaskara ,  Ross, Brenda Faye ,  Lee, Yi-Chia ,  Liu, Wen Dar ,  Chen, Tianniu

IPC分类号： H01L21/3213 ,  H01L21/02 ,  C09K13/00 ,  H01L21/311

CPC分类号： H01L21/32134 ,  C09K13/06 ,  C09K13/08 ,  H01L21/02063 ,  H01L21/31144

摘要： Aqueous compositions for stripping titanium nitride (TiN or TiNxOy) hard mask and removing etch residue are low pH aqueous composition comprising solvent, a weakly coordinating anion, amine, and at least two non-oxidizing trace metal ions. The aqueous compositions contain no non-ambient oxidizer, and are exposed to air. Bifluoride, or metal corrosion inhibitor may be added to the aqueous composition. Systems and processes use the aqueous compositions for stripping titanium nitride (TiN or TiNxOy) hard mask and removing titanium nitride (TiN or TiNxOy) etch residue.

摘要翻译： 用于剥离氮化钛（TiN或TiNxOy）硬掩模并除去蚀刻残留物的含水组合物是包含溶剂，弱配位阴离子，胺和至少两种非氧化痕量金属离子的低pH含水组合物。 含水组合物不含非环境氧化剂，并暴露于空气中。 二氟化物或金属腐蚀抑制剂可以加入含水组合物中。 系统和工艺使用水性组合物剥离氮化钛（TiN或TiNxOy）硬掩模并除去氮化钛（TiN或TiNxOy）蚀刻残余物。

公开(公告)号：EP2798669A4

公开(公告)日：2015-08-19

申请号：EP12863340

申请日：2012-12-27

申请人： ENTEGRIS INC

发明人： BARNES JEFFREY A ,  COOPER EMANUEL I ,  CHEN LI-MIN ,  LIPPY STEVEN ,  RAJARAM REKHA ,  TU SHENG-HUNG

IPC分类号： H01L21/3213 ,  H01L21/311

CPC分类号： C09K13/10 ,  C09K13/00 ,  C09K13/06 ,  C09K13/08 ,  C11D7/02 ,  C11D7/08 ,  C11D7/3209 ,  C11D11/0047 ,  C23F1/02 ,  C23F1/30 ,  C23F1/40 ,  H01L21/02063 ,  H01L21/31144 ,  H01L21/32134

摘要： Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.

公开(公告)号：EP2869938A1

公开(公告)日：2015-05-13

申请号：EP12880676.7

申请日：2012-10-04

申请人： General Engineering & Research, L.L.C.

发明人： IHNFELDT, Robin

IPC分类号： B05D7/00

CPC分类号： C09G1/02 ,  B01J13/14 ,  B24B1/00 ,  C01P2004/62 ,  C01P2004/64 ,  C01P2006/14 ,  C01P2006/16 ,  C08K9/00 ,  C08K9/10 ,  C09C1/02 ,  C09C1/3063 ,  C09G1/00 ,  C09G1/04 ,  C09K3/1436 ,  C09K3/1454 ,  C09K3/1463 ,  C09K13/00 ,  C09K13/06 ,  C23F3/00 ,  H01L21/30625 ,  H01L21/3212 ,  H01L21/7684

摘要： The invention relates to a contact release capsule comprising a particle, a chemical payload, and a polymer coating, wherein the particle is impregnated with the chemical payload, and the chemical payload is held inside the particle by the polymer coating until the contact release capsule contacts a surface and a shearing force removes the polymer coating allowing the chemical payload to release outside the particle. The contact release capsule is useful in chemical mechanical planarization slurries. Particularly, the contact release capsule may comprise a glycine impregnated silica nanoparticle coated with a polymer, wherein the contact release capsule is dispersed in an aqueous solution and used in the copper chemical mechanical planarization process. Use of the contact release capsule in a slurry for copper chemical mechanical planarization may significantly improve planarization efficiency, decrease unwanted etching and corrosion, and improve dispersion stability.

公开(公告)号：EP2827363A1

公开(公告)日：2015-01-21

申请号：EP12871234.6

申请日：2012-12-25

申请人： Adeka Corporation

发明人： TAGUCHI, Yuta ,  SAITOH, Kouta

IPC分类号： H01L21/308 ,  C23F1/16

CPC分类号： C23F1/18 ,  C09K13/06 ,  C23F1/16 ,  H01L21/32134 ,  H01L31/022425 ,  Y02E10/50

摘要： An object of the present invention is to provide an etching liquid composition and etching method which, when collectively etching a multilayer film formed of an indium oxide-based coating film and a metal-based coating film, do not produce a large step between the indium oxide-based coating film and the metal-based coating film, cause little thinning of fine wires formed of the indium oxide-based coating film and the metal-based coating film, and can achieve etching with good linearity. The etching liquid composition of the present invention contains a ferric ion component; a hydrogen chloride component; and a component that is at least one type of compound selected from the group consisting of a compound represented by general formula (1) below and a straight chain or branched chain alcohol having 1 to 4 carbon atoms:

wherein R 1 and R 3 are each independently a hydrogen atom or a straight chain or branched chain alkyl group having 1 to 4 carbon atoms, R 2 is a straight chain or branched chain alkylene group having 1 to 4 carbon atoms, and n is a number between 1 and 3.

摘要翻译： 本发明的一个目的是提供一种蚀刻液组合物和蚀刻方法，当共同蚀刻由氧化铟基涂膜和金属基涂膜形成的多层膜时，不会在铟之间产生大的台阶 氧化物系被膜和金属系被膜之间的接合部分，由氧化铟系被膜和金属系被膜形成的细线几乎不会变薄，能够良好地线性地进行蚀刻。 本发明的蚀刻液组合物含有三价铁离子成分， 氯化氢组分; 和选自由下述通式（1）表示的化合物和碳原子数为1〜4的直链或支链的醇组成的组中的至少一种化合物的成分，式中，R 1及R 3分别独立地为 氢原子或具有1至4个碳原子的直链或支链烷基，R 2是具有1至4个碳原子的直链或支链亚烷基，且n是1至3之间的数字。

公开(公告)号：EP2798669A1

公开(公告)日：2014-11-05

申请号：EP12863340.1

申请日：2012-12-27

申请人： Entegris, Inc.

发明人： BARNES, Jeffrey, A. ,  COOPER, Emanuel, I. ,  CHEN, Li-Min ,  LIPPY, Steven ,  RAJARAM, Rekha ,  TU, Sheng-Hung

IPC分类号： H01L21/311

CPC分类号： C09K13/10 ,  C09K13/00 ,  C09K13/06 ,  C09K13/08 ,  C11D7/02 ,  C11D7/08 ,  C11D7/3209 ,  C11D11/0047 ,  C23F1/02 ,  C23F1/30 ,  C23F1/40 ,  H01L21/02063 ,  H01L21/31144 ,  H01L21/32134

摘要： Compositions useful for the selective removal of titanium nitride and/or photoresist etch residue materials relative to metal conducting, e.g., tungsten, and insulating materials from a microelectronic device having same thereon. The removal compositions contain at least one oxidant and one etchant, may contain various corrosion inhibitors to ensure selectivity.