公开(公告)号：EP1920026B1

公开(公告)日：2017-04-12

申请号：EP06771598.7

申请日：2006-05-31

申请人： MacDermid, Incorporated

发明人： FENG, Kesheng ,  KAPADIA, Nilesh ,  CASTALDI, Steve

IPC分类号： C09K13/00

CPC分类号： H05K3/383 ,  C09K13/06 ,  C23F1/18 ,  H05K2203/124

公开(公告)号：EP2183335A1

公开(公告)日：2010-05-12

申请号：EP08780074.4

申请日：2008-07-09

申请人： MacDermid, Incorporated

发明人： FENG, Kesheng ,  KAPADIA, Nilesh ,  CASTALDI, Steven, A.

IPC分类号： C09K13/00 ,  C23F1/00

CPC分类号： C23F1/18 ,  H05K3/383 ,  H05K2203/122

摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

摘要翻译： 本发明涉及包含铜离子源，酸，腈化合物和卤化物离子源的微蚀刻组合物。 其他添加剂，包括有机溶剂，钼离子源，胺，聚胺和丙烯酰胺也可包括在本发明的组合物中。 本发明还涉及一种对铜或铜合金表面进行微蚀刻以增加铜表面与聚合物材料的粘合性的方法，该方法包括以下步骤：使铜或铜合金表面与本发明的组合物接触，然后键合 聚合物材料到铜或铜合金表面。

公开(公告)号：EP1974370B1

公开(公告)日：2019-12-18

申请号：EP06814816.2

申请日：2006-09-15

申请人： MacDermid, Incorporated

发明人： CASTALDI, Steven, A. ,  FENG, Kesheng ,  KAPADIA, Nilesh

IPC分类号： H01L21/306 ,  C09K13/06 ,  C09K13/04 ,  C23F1/16 ,  C23F1/44 ,  H01L21/3213

公开(公告)号：EP1974370A2

公开(公告)日：2008-10-01

申请号：EP06814816.2

申请日：2006-09-15

申请人： MacDermid, Incorporated

发明人： CASTALDI, Steven, A. ,  FENG, Kesheng ,  KAPADIA, Nilesh

IPC分类号： H01L21/306 ,  C09K13/06 ,  C09K13/04

摘要： The present invention is directed to a microetching composition comprising a source of cupric ions, acid, a nitrile compound, and a source of halide ions. Other additive, including organic solvents, a source of molybdenum ions, amines, polyamines, and acrylamides may also be included in the composition of the invention. The present invention is also directed to a method of microetching copper or copper alloy surfaces to increase the adhesion of the copper surface to a polymeric material, comprising the steps of contacting a copper or copper alloy surface with the composition of the invention, and thereafter bonding the polymeric material to the copper or copper alloy surface.

公开(公告)号：EP1920026A1

公开(公告)日：2008-05-14

申请号：EP06771598.7

申请日：2006-05-31

申请人： MacDermid, Incorporated

发明人： FENG, Kesheng ,  KAPADIA, Nilesh ,  CASTALDI, Steve

IPC分类号： C09K13/00

CPC分类号： H05K3/383 ,  C09K13/06 ,  C23F1/18 ,  H05K2203/124

摘要： The present invention related to an improved microetching solution and a method of using the improved composition for roughening a metal surface and increasing the adhesion strength of a metal layer to a subsequently applied layer. The microetching composition is an aqueous solution comprising cupric ion source, a pyridine derivative, multiethyleneamine, and an acid. In a preferred embodiment, the microetching solution of the invention also comprises a source of halide ions such as sodium chloride or hydrochloric acid.