公开(公告)号：EP4404246A1

公开(公告)日：2024-07-24

申请号：EP24151173.2

申请日：2024-01-10

申请人： MediaTek Inc.

发明人： TSAO, Pei-Haw ,  WONG, Te-Chi

IPC分类号： H01L21/56 ,  H01L23/16 ,  H01L23/00 ,  H01L23/58 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L21/563 ,  H01L23/16 ,  H01L23/562 ,  H01L23/585 ,  H01L25/0655 ,  H01L23/3128 ,  H01L23/49816 ,  H01L25/18 ,  H01L24/16 ,  H01L24/13 ,  H01L23/147 ,  H01L24/81 ,  H01L2224/1622720130101 ,  H01L2224/3222520130101 ,  H01L2224/7320420130101 ,  H01L2224/9212520130101 ,  H01L2224/8100520130101 ,  H01L2224/8300520130101 ,  H01L2224/1623520130101 ,  H01L23/5385

摘要： A semiconductor package (1) includes a package substrate (20), an interposer (200) on and electrically connected to the package substrate (20), a central logic die (101) disposed on and electrically connected to the interposer (200), peripheral function dies (102) disposed on and electrically connected to the interposer (200) and located in proximity to the central logic die (101), and at least one dummy die (103) disposed between the central logic die (101) and the peripheral function dies (102) so as to form a rectangular shaped die arrangement. The at least one dummy die (103) is disposed at a corner position of the rectangular shaped die arrangement.

公开(公告)号：EP4379791A1

公开(公告)日：2024-06-05

申请号：EP23212548.4

申请日：2023-11-28

申请人： MediaTek Inc.

发明人： TSAO, Pei-Haw ,  WONG, Te-Chi

IPC分类号： H01L23/16 ,  H01L23/31 ,  H01L21/56 ,  H01L21/60

CPC分类号： H01L23/16 ,  H01L23/562 ,  H01L23/3128 ,  H01L21/563 ,  H01L24/20 ,  H01L23/3135

摘要： A coreless substrate package (1) includes a coreless substrate (20); a package device (10) mounted on the coreless substrate (20); an underfill material (310) filling into a space between the package device (10) and the coreless substrate (20); a stiffener ring (40) disposed on a top surface (20a) of the coreless substrate (20) along perimeter of the coreless substrate (20); and a gap fill material (50) disposed in a gap between the stiffener ring (40) and the package device (10).